JPWO2021261403A5 - - Google Patents
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- Publication number
- JPWO2021261403A5 JPWO2021261403A5 JP2021552191A JP2021552191A JPWO2021261403A5 JP WO2021261403 A5 JPWO2021261403 A5 JP WO2021261403A5 JP 2021552191 A JP2021552191 A JP 2021552191A JP 2021552191 A JP2021552191 A JP 2021552191A JP WO2021261403 A5 JPWO2021261403 A5 JP WO2021261403A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- organic film
- electrode
- resin composition
- curable resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003431 cross linking reagent Substances 0.000 claims description 4
- 239000003054 catalyst Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 17
- 150000003961 organosilicon compounds Chemical class 0.000 claims 11
- 125000003118 aryl group Chemical group 0.000 claims 10
- 239000011342 resin composition Substances 0.000 claims 9
- 125000001931 aliphatic group Chemical group 0.000 claims 8
- 125000004122 cyclic group Chemical group 0.000 claims 4
- 229910052739 hydrogen Inorganic materials 0.000 claims 4
- 239000001257 hydrogen Substances 0.000 claims 4
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 4
- 125000001424 substituent group Chemical group 0.000 claims 4
- 239000004020 conductor Substances 0.000 claims 3
- 238000000034 method Methods 0.000 claims 3
- 238000004519 manufacturing process Methods 0.000 claims 2
- 238000005498 polishing Methods 0.000 claims 2
- 230000004888 barrier function Effects 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 150000003377 silicon compounds Chemical class 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 230000004580 weight loss Effects 0.000 claims 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 241000723353 Chrysanthemum Species 0.000 description 1
- 235000005633 Chrysanthemum balsamita Nutrition 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022140717A JP7374270B2 (ja) | 2020-06-22 | 2022-09-05 | 硬化性樹脂組成物 |
| JP2023182417A JP2024010081A (ja) | 2020-06-22 | 2023-10-24 | 積層体、硬化性樹脂組成物、積層体の製造方法、接合電極を有する基板の製造方法、半導体装置及び撮像装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020107273 | 2020-06-22 | ||
| JP2020107273 | 2020-06-22 | ||
| PCT/JP2021/023227 WO2021261403A1 (ja) | 2020-06-22 | 2021-06-18 | 積層体、硬化性樹脂組成物、積層体の製造方法、接合電極を有する基板の製造方法、半導体装置及び撮像装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022140717A Division JP7374270B2 (ja) | 2020-06-22 | 2022-09-05 | 硬化性樹脂組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021261403A1 JPWO2021261403A1 (https=) | 2021-12-30 |
| JPWO2021261403A5 true JPWO2021261403A5 (https=) | 2022-06-09 |
| JP7144624B2 JP7144624B2 (ja) | 2022-09-29 |
Family
ID=79281358
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021552191A Active JP7144624B2 (ja) | 2020-06-22 | 2021-06-18 | 積層体、硬化性樹脂組成物、積層体の製造方法、接合電極を有する基板の製造方法、半導体装置及び撮像装置 |
| JP2022140717A Active JP7374270B2 (ja) | 2020-06-22 | 2022-09-05 | 硬化性樹脂組成物 |
| JP2023182417A Pending JP2024010081A (ja) | 2020-06-22 | 2023-10-24 | 積層体、硬化性樹脂組成物、積層体の製造方法、接合電極を有する基板の製造方法、半導体装置及び撮像装置 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022140717A Active JP7374270B2 (ja) | 2020-06-22 | 2022-09-05 | 硬化性樹脂組成物 |
| JP2023182417A Pending JP2024010081A (ja) | 2020-06-22 | 2023-10-24 | 積層体、硬化性樹脂組成物、積層体の製造方法、接合電極を有する基板の製造方法、半導体装置及び撮像装置 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20230245936A1 (https=) |
| EP (1) | EP4169971A4 (https=) |
| JP (3) | JP7144624B2 (https=) |
| KR (1) | KR20230028205A (https=) |
| CN (1) | CN115244670A (https=) |
| TW (1) | TWI891818B (https=) |
| WO (1) | WO2021261403A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW202340324A (zh) * | 2021-12-23 | 2023-10-16 | 日商積水化學工業股份有限公司 | 硬化性樹脂組成物、硬化膜、積層體、攝像裝置、半導體裝置、積層體之製造方法、及具有接合電極之元件之製造方法 |
| JPWO2024157914A1 (https=) * | 2023-01-23 | 2024-08-02 | ||
| CN120380085A (zh) * | 2023-01-23 | 2025-07-25 | 积水化学工业株式会社 | 树脂组合物、固化膜、层叠体、拍摄装置、半导体装置、层叠体的制造方法和具有接合电极的元件的制造方法 |
| WO2025063069A1 (ja) * | 2023-09-21 | 2025-03-27 | 積水化学工業株式会社 | 硬化性樹脂組成物、硬化膜、積層体及び半導体装置 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100610481B1 (ko) | 2004-12-30 | 2006-08-08 | 매그나칩 반도체 유한회사 | 수광영역을 넓힌 이미지센서 및 그 제조 방법 |
| JP5610379B2 (ja) * | 2008-11-12 | 2014-10-22 | Jnc株式会社 | シロキサンポリマー、シロキサン系の架橋性組成物及びシリコーン膜 |
| JP5488031B2 (ja) * | 2010-02-19 | 2014-05-14 | 日本電気株式会社 | 検索装置 |
| JP5803398B2 (ja) * | 2011-08-04 | 2015-11-04 | ソニー株式会社 | 半導体装置、半導体装置の製造方法、及び、電子機器 |
| FR2987626B1 (fr) * | 2012-03-05 | 2015-04-03 | Commissariat Energie Atomique | Procede de collage direct utilisant une couche poreuse compressible |
| JP6014354B2 (ja) * | 2012-04-25 | 2016-10-25 | 株式会社日立製作所 | 半導体装置の製造方法 |
| US20160268230A1 (en) * | 2015-03-12 | 2016-09-15 | United Microelectronics Corp. | Stacked semiconductor structure |
| JP2017197688A (ja) * | 2016-04-28 | 2017-11-02 | 三井化学東セロ株式会社 | アンダーフィル用絶縁フィルム |
| JP7766390B2 (ja) * | 2018-12-04 | 2025-11-10 | Jnc株式会社 | 縮合硬化型樹脂組成物、硬化物、成形体、及び半導体装置 |
-
2021
- 2021-06-18 WO PCT/JP2021/023227 patent/WO2021261403A1/ja not_active Ceased
- 2021-06-18 KR KR1020227026941A patent/KR20230028205A/ko active Pending
- 2021-06-18 CN CN202180020010.XA patent/CN115244670A/zh active Pending
- 2021-06-18 JP JP2021552191A patent/JP7144624B2/ja active Active
- 2021-06-18 US US18/010,288 patent/US20230245936A1/en active Pending
- 2021-06-18 EP EP21829982.4A patent/EP4169971A4/en active Pending
- 2021-06-21 TW TW110122578A patent/TWI891818B/zh active
-
2022
- 2022-09-05 JP JP2022140717A patent/JP7374270B2/ja active Active
-
2023
- 2023-10-24 JP JP2023182417A patent/JP2024010081A/ja active Pending
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