JPWO2024248011A5 - - Google Patents
Info
- Publication number
- JPWO2024248011A5 JPWO2024248011A5 JP2025524115A JP2025524115A JPWO2024248011A5 JP WO2024248011 A5 JPWO2024248011 A5 JP WO2024248011A5 JP 2025524115 A JP2025524115 A JP 2025524115A JP 2025524115 A JP2025524115 A JP 2025524115A JP WO2024248011 A5 JPWO2024248011 A5 JP WO2024248011A5
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- semiconductor device
- gate
- sidewall
- gate electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023089176 | 2023-05-30 | ||
| PCT/JP2024/019603 WO2024248011A1 (ja) | 2023-05-30 | 2024-05-28 | 半導体装置およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024248011A1 JPWO2024248011A1 (https=) | 2024-12-05 |
| JPWO2024248011A5 true JPWO2024248011A5 (https=) | 2026-03-04 |
Family
ID=93657997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025524115A Pending JPWO2024248011A1 (https=) | 2023-05-30 | 2024-05-28 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20260090057A1 (https=) |
| JP (1) | JPWO2024248011A1 (https=) |
| CN (1) | CN121286116A (https=) |
| DE (1) | DE112024002339T5 (https=) |
| WO (1) | WO2024248011A1 (https=) |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5777455B2 (ja) * | 2011-09-08 | 2015-09-09 | 株式会社東芝 | 半導体装置および半導体装置の製造方法 |
| JP6120525B2 (ja) * | 2012-10-30 | 2017-04-26 | 三菱電機株式会社 | 炭化珪素半導体装置 |
| JP6295797B2 (ja) * | 2014-04-10 | 2018-03-20 | 住友電気工業株式会社 | 炭化珪素半導体装置およびその製造方法 |
| JP6267624B2 (ja) * | 2014-10-24 | 2018-01-24 | 住友電気工業株式会社 | 炭化珪素半導体装置 |
| TWI780186B (zh) | 2017-07-28 | 2022-10-11 | 瑞士商菲利浦莫里斯製品股份有限公司 | 加熱器總成、氣溶膠產生裝置、氣溶膠產生系統、氣溶膠產生方法以及用於組裝該裝置用的加熱器總成之方法 |
| JP7529429B2 (ja) * | 2019-05-30 | 2024-08-06 | ローム株式会社 | 半導体装置 |
| JP7647042B2 (ja) * | 2020-09-17 | 2025-03-18 | 富士電機株式会社 | 半導体装置および半導体装置の製造方法 |
| JP7471974B2 (ja) | 2020-09-18 | 2024-04-22 | 株式会社東芝 | 半導体装置 |
| WO2022202088A1 (ja) * | 2021-03-26 | 2022-09-29 | ローム株式会社 | 半導体装置 |
-
2024
- 2024-05-28 CN CN202480034161.4A patent/CN121286116A/zh active Pending
- 2024-05-28 WO PCT/JP2024/019603 patent/WO2024248011A1/ja not_active Ceased
- 2024-05-28 JP JP2025524115A patent/JPWO2024248011A1/ja active Pending
- 2024-05-28 DE DE112024002339.8T patent/DE112024002339T5/de active Pending
-
2025
- 2025-11-26 US US19/401,433 patent/US20260090057A1/en active Pending
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