JPWO2024228322A5 - - Google Patents

Info

Publication number
JPWO2024228322A5
JPWO2024228322A5 JP2025518117A JP2025518117A JPWO2024228322A5 JP WO2024228322 A5 JPWO2024228322 A5 JP WO2024228322A5 JP 2025518117 A JP2025518117 A JP 2025518117A JP 2025518117 A JP2025518117 A JP 2025518117A JP WO2024228322 A5 JPWO2024228322 A5 JP WO2024228322A5
Authority
JP
Japan
Prior art keywords
island
thickness direction
semiconductor device
extension
viewed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025518117A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024228322A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/014632 external-priority patent/WO2024228322A1/ja
Publication of JPWO2024228322A1 publication Critical patent/JPWO2024228322A1/ja
Publication of JPWO2024228322A5 publication Critical patent/JPWO2024228322A5/ja
Pending legal-status Critical Current

Links

JP2025518117A 2023-05-01 2024-04-11 Pending JPWO2024228322A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023075727 2023-05-01
PCT/JP2024/014632 WO2024228322A1 (ja) 2023-05-01 2024-04-11 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2024228322A1 JPWO2024228322A1 (https=) 2024-11-07
JPWO2024228322A5 true JPWO2024228322A5 (https=) 2026-02-03

Family

ID=93333028

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025518117A Pending JPWO2024228322A1 (https=) 2023-05-01 2024-04-11

Country Status (2)

Country Link
JP (1) JPWO2024228322A1 (https=)
WO (1) WO2024228322A1 (https=)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2859144B2 (ja) * 1994-11-11 1999-02-17 三洋電機株式会社 リードフレームと半導体装置の製造方法
JP6721346B2 (ja) * 2016-01-27 2020-07-15 ローム株式会社 半導体装置

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