JPWO2024224460A5 - - Google Patents
Info
- Publication number
- JPWO2024224460A5 JPWO2024224460A5 JP2025516334A JP2025516334A JPWO2024224460A5 JP WO2024224460 A5 JPWO2024224460 A5 JP WO2024224460A5 JP 2025516334 A JP2025516334 A JP 2025516334A JP 2025516334 A JP2025516334 A JP 2025516334A JP WO2024224460 A5 JPWO2024224460 A5 JP WO2024224460A5
- Authority
- JP
- Japan
- Prior art keywords
- fin
- flow path
- layer
- inlet
- outlet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/016172 WO2024224460A1 (ja) | 2023-04-24 | 2023-04-24 | 冷却器 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2024224460A1 JPWO2024224460A1 (https=) | 2024-10-31 |
| JPWO2024224460A5 true JPWO2024224460A5 (https=) | 2025-07-28 |
| JP7829807B2 JP7829807B2 (ja) | 2026-03-13 |
Family
ID=93256046
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025516334A Active JP7829807B2 (ja) | 2023-04-24 | 2023-04-24 | 冷却器 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7829807B2 (https=) |
| CN (1) | CN121039807A (https=) |
| DE (1) | DE112023006272T5 (https=) |
| WO (1) | WO2024224460A1 (https=) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4031903B2 (ja) * | 1999-10-21 | 2008-01-09 | イェーノプティク アクチエンゲゼルシャフト | ダイオードレーザを冷却する装置 |
| JP2003051689A (ja) * | 2001-08-06 | 2003-02-21 | Toshiba Corp | 発熱素子用冷却装置 |
| JP2010098204A (ja) | 2008-10-20 | 2010-04-30 | Stanley Electric Co Ltd | 光源の冷却構造 |
| US8929071B2 (en) | 2008-12-22 | 2015-01-06 | General Electric Company | Low cost manufacturing of micro-channel heatsink |
| US8391008B2 (en) | 2011-02-17 | 2013-03-05 | Toyota Motor Engineering & Manufacturing North America, Inc. | Power electronics modules and power electronics module assemblies |
| JP2014017412A (ja) | 2012-07-10 | 2014-01-30 | Nippon Soken Inc | 熱拡散装置 |
| DE112019007686B4 (de) | 2019-09-04 | 2023-08-03 | Mitsubishi Electric Corporation | Kühlkörper und halbleitermodul |
| CN115136302B (zh) | 2020-02-26 | 2025-12-23 | 京瓷株式会社 | 散热构件 |
-
2023
- 2023-04-24 CN CN202380097307.5A patent/CN121039807A/zh active Pending
- 2023-04-24 DE DE112023006272.2T patent/DE112023006272T5/de active Pending
- 2023-04-24 WO PCT/JP2023/016172 patent/WO2024224460A1/ja not_active Ceased
- 2023-04-24 JP JP2025516334A patent/JP7829807B2/ja active Active
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