CN121039807A - 冷却器 - Google Patents

冷却器

Info

Publication number
CN121039807A
CN121039807A CN202380097307.5A CN202380097307A CN121039807A CN 121039807 A CN121039807 A CN 121039807A CN 202380097307 A CN202380097307 A CN 202380097307A CN 121039807 A CN121039807 A CN 121039807A
Authority
CN
China
Prior art keywords
fin
outflow
layer
inflow
flow path
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380097307.5A
Other languages
English (en)
Chinese (zh)
Inventor
吉濑幸司
野田进
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Kyoto University NUC
Original Assignee
Mitsubishi Electric Corp
Kyoto University NUC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp, Kyoto University NUC filed Critical Mitsubishi Electric Corp
Publication of CN121039807A publication Critical patent/CN121039807A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN202380097307.5A 2023-04-24 2023-04-24 冷却器 Pending CN121039807A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/016172 WO2024224460A1 (ja) 2023-04-24 2023-04-24 冷却器

Publications (1)

Publication Number Publication Date
CN121039807A true CN121039807A (zh) 2025-11-28

Family

ID=93256046

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380097307.5A Pending CN121039807A (zh) 2023-04-24 2023-04-24 冷却器

Country Status (4)

Country Link
JP (1) JP7829807B2 (https=)
CN (1) CN121039807A (https=)
DE (1) DE112023006272T5 (https=)
WO (1) WO2024224460A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4031903B2 (ja) * 1999-10-21 2008-01-09 イェーノプティク アクチエンゲゼルシャフト ダイオードレーザを冷却する装置
JP2003051689A (ja) * 2001-08-06 2003-02-21 Toshiba Corp 発熱素子用冷却装置
JP2010098204A (ja) 2008-10-20 2010-04-30 Stanley Electric Co Ltd 光源の冷却構造
US8929071B2 (en) 2008-12-22 2015-01-06 General Electric Company Low cost manufacturing of micro-channel heatsink
US8391008B2 (en) 2011-02-17 2013-03-05 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics modules and power electronics module assemblies
JP2014017412A (ja) 2012-07-10 2014-01-30 Nippon Soken Inc 熱拡散装置
DE112019007686B4 (de) 2019-09-04 2023-08-03 Mitsubishi Electric Corporation Kühlkörper und halbleitermodul
CN115136302B (zh) 2020-02-26 2025-12-23 京瓷株式会社 散热构件

Also Published As

Publication number Publication date
WO2024224460A1 (ja) 2024-10-31
JP7829807B2 (ja) 2026-03-13
DE112023006272T5 (de) 2026-04-23
JPWO2024224460A1 (https=) 2024-10-31

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