JP7829807B2 - 冷却器 - Google Patents

冷却器

Info

Publication number
JP7829807B2
JP7829807B2 JP2025516334A JP2025516334A JP7829807B2 JP 7829807 B2 JP7829807 B2 JP 7829807B2 JP 2025516334 A JP2025516334 A JP 2025516334A JP 2025516334 A JP2025516334 A JP 2025516334A JP 7829807 B2 JP7829807 B2 JP 7829807B2
Authority
JP
Japan
Prior art keywords
fin
forming layer
layer
refrigerant
inlet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2025516334A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024224460A5 (https=
JPWO2024224460A1 (https=
Inventor
幸司 吉瀬
進 野田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Kyoto University NUC
Original Assignee
Mitsubishi Electric Corp
Kyoto University NUC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp, Kyoto University NUC filed Critical Mitsubishi Electric Corp
Publication of JPWO2024224460A1 publication Critical patent/JPWO2024224460A1/ja
Publication of JPWO2024224460A5 publication Critical patent/JPWO2024224460A5/ja
Application granted granted Critical
Publication of JP7829807B2 publication Critical patent/JP7829807B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2025516334A 2023-04-24 2023-04-24 冷却器 Active JP7829807B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/016172 WO2024224460A1 (ja) 2023-04-24 2023-04-24 冷却器

Publications (3)

Publication Number Publication Date
JPWO2024224460A1 JPWO2024224460A1 (https=) 2024-10-31
JPWO2024224460A5 JPWO2024224460A5 (https=) 2025-07-28
JP7829807B2 true JP7829807B2 (ja) 2026-03-13

Family

ID=93256046

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025516334A Active JP7829807B2 (ja) 2023-04-24 2023-04-24 冷却器

Country Status (4)

Country Link
JP (1) JP7829807B2 (https=)
CN (1) CN121039807A (https=)
DE (1) DE112023006272T5 (https=)
WO (1) WO2024224460A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010098204A (ja) 2008-10-20 2010-04-30 Stanley Electric Co Ltd 光源の冷却構造
US20120212907A1 (en) 2011-02-17 2012-08-23 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics modules and power electronics module assemblies
JP2014017412A (ja) 2012-07-10 2014-01-30 Nippon Soken Inc 熱拡散装置
WO2021044550A1 (ja) 2019-09-04 2021-03-11 三菱電機株式会社 ヒートシンクおよび半導体モジュール
JP7451678B2 (ja) 2020-02-26 2024-03-18 京セラ株式会社 放熱部材

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4031903B2 (ja) * 1999-10-21 2008-01-09 イェーノプティク アクチエンゲゼルシャフト ダイオードレーザを冷却する装置
JP2003051689A (ja) * 2001-08-06 2003-02-21 Toshiba Corp 発熱素子用冷却装置
US8929071B2 (en) 2008-12-22 2015-01-06 General Electric Company Low cost manufacturing of micro-channel heatsink

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010098204A (ja) 2008-10-20 2010-04-30 Stanley Electric Co Ltd 光源の冷却構造
US20120212907A1 (en) 2011-02-17 2012-08-23 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics modules and power electronics module assemblies
JP2014017412A (ja) 2012-07-10 2014-01-30 Nippon Soken Inc 熱拡散装置
WO2021044550A1 (ja) 2019-09-04 2021-03-11 三菱電機株式会社 ヒートシンクおよび半導体モジュール
JP7451678B2 (ja) 2020-02-26 2024-03-18 京セラ株式会社 放熱部材

Also Published As

Publication number Publication date
CN121039807A (zh) 2025-11-28
WO2024224460A1 (ja) 2024-10-31
DE112023006272T5 (de) 2026-04-23
JPWO2024224460A1 (https=) 2024-10-31

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