JPWO2024161451A5 - - Google Patents

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Publication number
JPWO2024161451A5
JPWO2024161451A5 JP2024574065A JP2024574065A JPWO2024161451A5 JP WO2024161451 A5 JPWO2024161451 A5 JP WO2024161451A5 JP 2024574065 A JP2024574065 A JP 2024574065A JP 2024574065 A JP2024574065 A JP 2024574065A JP WO2024161451 A5 JPWO2024161451 A5 JP WO2024161451A5
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JP
Japan
Prior art keywords
heat sink
screw
semiconductor device
case
screw hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024574065A
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English (en)
Japanese (ja)
Other versions
JP7834209B2 (ja
JPWO2024161451A1 (https=
Filing date
Publication date
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Priority claimed from PCT/JP2023/002837 external-priority patent/WO2024161451A1/ja
Publication of JPWO2024161451A1 publication Critical patent/JPWO2024161451A1/ja
Publication of JPWO2024161451A5 publication Critical patent/JPWO2024161451A5/ja
Application granted granted Critical
Publication of JP7834209B2 publication Critical patent/JP7834209B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2024574065A 2023-01-30 2023-01-30 半導体装置 Active JP7834209B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/002837 WO2024161451A1 (ja) 2023-01-30 2023-01-30 半導体装置

Publications (3)

Publication Number Publication Date
JPWO2024161451A1 JPWO2024161451A1 (https=) 2024-08-08
JPWO2024161451A5 true JPWO2024161451A5 (https=) 2025-03-25
JP7834209B2 JP7834209B2 (ja) 2026-03-23

Family

ID=92146273

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024574065A Active JP7834209B2 (ja) 2023-01-30 2023-01-30 半導体装置

Country Status (4)

Country Link
JP (1) JP7834209B2 (https=)
CN (1) CN120548610A (https=)
DE (1) DE112023005705T5 (https=)
WO (1) WO2024161451A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56610Y2 (https=) * 1977-12-27 1981-01-09
JPH11262273A (ja) * 1998-03-11 1999-09-24 Denso Corp パワーモジュール装置及びその製造方法
JP2001307542A (ja) 2000-04-26 2001-11-02 Toshiba Lighting & Technology Corp 電子式放電ランプ点灯装置
US9064737B2 (en) * 2007-11-13 2015-06-23 Siemens Aktiengesellschaft Power semiconductor module
JP5855899B2 (ja) 2011-10-27 2016-02-09 日立オートモティブシステムズ株式会社 Ｄｃ−ｄｃコンバータ及び電力変換装置
DE112014006796B4 (de) * 2014-07-09 2023-12-28 Mitsubishi Electric Corporation Halbleiteranordnung
JP6769087B2 (ja) * 2016-04-26 2020-10-14 日本電気株式会社 冷却部材、冷却装置、電子機器および冷却部材の形成方法

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