JPWO2024161451A1 - - Google Patents
Info
- Publication number
- JPWO2024161451A1 JPWO2024161451A1 JP2024574065A JP2024574065A JPWO2024161451A1 JP WO2024161451 A1 JPWO2024161451 A1 JP WO2024161451A1 JP 2024574065 A JP2024574065 A JP 2024574065A JP 2024574065 A JP2024574065 A JP 2024574065A JP WO2024161451 A1 JPWO2024161451 A1 JP WO2024161451A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
- H10W40/611—Bolts or screws
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W42/00—Arrangements for protection of devices
- H10W42/80—Arrangements for protection of devices protecting against overcurrent or overload, e.g. fuses or shunts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
- H10W70/65—Shapes or dispositions of interconnections
- H10W70/658—Shapes or dispositions of interconnections for devices provided for in groups H10D8/00 - H10D48/00
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/002837 WO2024161451A1 (ja) | 2023-01-30 | 2023-01-30 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2024161451A1 true JPWO2024161451A1 (https=) | 2024-08-08 |
| JPWO2024161451A5 JPWO2024161451A5 (https=) | 2025-03-25 |
| JP7834209B2 JP7834209B2 (ja) | 2026-03-23 |
Family
ID=92146273
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024574065A Active JP7834209B2 (ja) | 2023-01-30 | 2023-01-30 | 半導体装置 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7834209B2 (https=) |
| CN (1) | CN120548610A (https=) |
| DE (1) | DE112023005705T5 (https=) |
| WO (1) | WO2024161451A1 (https=) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54101973U (https=) * | 1977-12-27 | 1979-07-18 | ||
| JPH11262273A (ja) * | 1998-03-11 | 1999-09-24 | Denso Corp | パワーモジュール装置及びその製造方法 |
| JP2001307542A (ja) * | 2000-04-26 | 2001-11-02 | Toshiba Lighting & Technology Corp | 電子式放電ランプ点灯装置 |
| JP2011503852A (ja) * | 2007-11-13 | 2011-01-27 | シーメンス アクチエンゲゼルシヤフト | パワー半導体素子モジュール |
| JP2013094022A (ja) * | 2011-10-27 | 2013-05-16 | Hitachi Automotive Systems Ltd | 電力変換装置 |
| WO2016006065A1 (ja) * | 2014-07-09 | 2016-01-14 | 三菱電機株式会社 | 半導体装置 |
| JP2017199756A (ja) * | 2016-04-26 | 2017-11-02 | 日本電気株式会社 | 冷却部材、冷却装置、電子機器および冷却部材の形成方法 |
-
2023
- 2023-01-30 JP JP2024574065A patent/JP7834209B2/ja active Active
- 2023-01-30 WO PCT/JP2023/002837 patent/WO2024161451A1/ja not_active Ceased
- 2023-01-30 DE DE112023005705.2T patent/DE112023005705T5/de active Pending
- 2023-01-30 CN CN202380090853.6A patent/CN120548610A/zh active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54101973U (https=) * | 1977-12-27 | 1979-07-18 | ||
| JPH11262273A (ja) * | 1998-03-11 | 1999-09-24 | Denso Corp | パワーモジュール装置及びその製造方法 |
| JP2001307542A (ja) * | 2000-04-26 | 2001-11-02 | Toshiba Lighting & Technology Corp | 電子式放電ランプ点灯装置 |
| JP2011503852A (ja) * | 2007-11-13 | 2011-01-27 | シーメンス アクチエンゲゼルシヤフト | パワー半導体素子モジュール |
| JP2013094022A (ja) * | 2011-10-27 | 2013-05-16 | Hitachi Automotive Systems Ltd | 電力変換装置 |
| WO2016006065A1 (ja) * | 2014-07-09 | 2016-01-14 | 三菱電機株式会社 | 半導体装置 |
| JP2017199756A (ja) * | 2016-04-26 | 2017-11-02 | 日本電気株式会社 | 冷却部材、冷却装置、電子機器および冷却部材の形成方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024161451A1 (ja) | 2024-08-08 |
| CN120548610A (zh) | 2025-08-26 |
| JP7834209B2 (ja) | 2026-03-23 |
| DE112023005705T5 (de) | 2025-11-06 |
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