JP7834209B2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JP7834209B2
JP7834209B2 JP2024574065A JP2024574065A JP7834209B2 JP 7834209 B2 JP7834209 B2 JP 7834209B2 JP 2024574065 A JP2024574065 A JP 2024574065A JP 2024574065 A JP2024574065 A JP 2024574065A JP 7834209 B2 JP7834209 B2 JP 7834209B2
Authority
JP
Japan
Prior art keywords
heat sink
case
semiconductor device
screw
screw hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024574065A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024161451A1 (https=
JPWO2024161451A5 (https=
Inventor
猛 東畠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of JPWO2024161451A1 publication Critical patent/JPWO2024161451A1/ja
Publication of JPWO2024161451A5 publication Critical patent/JPWO2024161451A5/ja
Application granted granted Critical
Publication of JP7834209B2 publication Critical patent/JP7834209B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/80—Arrangements for protection of devices protecting against overcurrent or overload, e.g. fuses or shunts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/658—Shapes or dispositions of interconnections for devices provided for in groups H10D8/00 - H10D48/00

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2024574065A 2023-01-30 2023-01-30 半導体装置 Active JP7834209B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/002837 WO2024161451A1 (ja) 2023-01-30 2023-01-30 半導体装置

Publications (3)

Publication Number Publication Date
JPWO2024161451A1 JPWO2024161451A1 (https=) 2024-08-08
JPWO2024161451A5 JPWO2024161451A5 (https=) 2025-03-25
JP7834209B2 true JP7834209B2 (ja) 2026-03-23

Family

ID=92146273

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024574065A Active JP7834209B2 (ja) 2023-01-30 2023-01-30 半導体装置

Country Status (4)

Country Link
JP (1) JP7834209B2 (https=)
CN (1) CN120548610A (https=)
DE (1) DE112023005705T5 (https=)
WO (1) WO2024161451A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001307542A (ja) 2000-04-26 2001-11-02 Toshiba Lighting & Technology Corp 電子式放電ランプ点灯装置
JP2011503852A (ja) 2007-11-13 2011-01-27 シーメンス アクチエンゲゼルシヤフト パワー半導体素子モジュール
JP2013094022A (ja) 2011-10-27 2013-05-16 Hitachi Automotive Systems Ltd 電力変換装置
WO2016006065A1 (ja) 2014-07-09 2016-01-14 三菱電機株式会社 半導体装置
JP2017199756A (ja) 2016-04-26 2017-11-02 日本電気株式会社 冷却部材、冷却装置、電子機器および冷却部材の形成方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56610Y2 (https=) * 1977-12-27 1981-01-09
JPH11262273A (ja) * 1998-03-11 1999-09-24 Denso Corp パワーモジュール装置及びその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001307542A (ja) 2000-04-26 2001-11-02 Toshiba Lighting & Technology Corp 電子式放電ランプ点灯装置
JP2011503852A (ja) 2007-11-13 2011-01-27 シーメンス アクチエンゲゼルシヤフト パワー半導体素子モジュール
JP2013094022A (ja) 2011-10-27 2013-05-16 Hitachi Automotive Systems Ltd 電力変換装置
WO2016006065A1 (ja) 2014-07-09 2016-01-14 三菱電機株式会社 半導体装置
JP2017199756A (ja) 2016-04-26 2017-11-02 日本電気株式会社 冷却部材、冷却装置、電子機器および冷却部材の形成方法

Also Published As

Publication number Publication date
WO2024161451A1 (ja) 2024-08-08
CN120548610A (zh) 2025-08-26
JPWO2024161451A1 (https=) 2024-08-08
DE112023005705T5 (de) 2025-11-06

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