CN120548610A - 半导体装置 - Google Patents

半导体装置

Info

Publication number
CN120548610A
CN120548610A CN202380090853.6A CN202380090853A CN120548610A CN 120548610 A CN120548610 A CN 120548610A CN 202380090853 A CN202380090853 A CN 202380090853A CN 120548610 A CN120548610 A CN 120548610A
Authority
CN
China
Prior art keywords
semiconductor device
heat sink
screw
case
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380090853.6A
Other languages
English (en)
Chinese (zh)
Inventor
东畠猛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN120548610A publication Critical patent/CN120548610A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/80—Arrangements for protection of devices protecting against overcurrent or overload, e.g. fuses or shunts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/658—Shapes or dispositions of interconnections for devices provided for in groups H10D8/00 - H10D48/00

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN202380090853.6A 2023-01-30 2023-01-30 半导体装置 Pending CN120548610A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/002837 WO2024161451A1 (ja) 2023-01-30 2023-01-30 半導体装置

Publications (1)

Publication Number Publication Date
CN120548610A true CN120548610A (zh) 2025-08-26

Family

ID=92146273

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380090853.6A Pending CN120548610A (zh) 2023-01-30 2023-01-30 半导体装置

Country Status (4)

Country Link
JP (1) JP7834209B2 (https=)
CN (1) CN120548610A (https=)
DE (1) DE112023005705T5 (https=)
WO (1) WO2024161451A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56610Y2 (https=) * 1977-12-27 1981-01-09
JPH11262273A (ja) * 1998-03-11 1999-09-24 Denso Corp パワーモジュール装置及びその製造方法
JP2001307542A (ja) 2000-04-26 2001-11-02 Toshiba Lighting & Technology Corp 電子式放電ランプ点灯装置
US9064737B2 (en) * 2007-11-13 2015-06-23 Siemens Aktiengesellschaft Power semiconductor module
JP5855899B2 (ja) 2011-10-27 2016-02-09 日立オートモティブシステムズ株式会社 Ｄｃ−ｄｃコンバータ及び電力変換装置
DE112014006796B4 (de) * 2014-07-09 2023-12-28 Mitsubishi Electric Corporation Halbleiteranordnung
JP6769087B2 (ja) * 2016-04-26 2020-10-14 日本電気株式会社 冷却部材、冷却装置、電子機器および冷却部材の形成方法

Also Published As

Publication number Publication date
WO2024161451A1 (ja) 2024-08-08
JP7834209B2 (ja) 2026-03-23
JPWO2024161451A1 (https=) 2024-08-08
DE112023005705T5 (de) 2025-11-06

Similar Documents

Publication Publication Date Title
US9171773B2 (en) Semiconductor device
US8258622B2 (en) Power device package and semiconductor package mold for fabricating the same
US10163752B2 (en) Semiconductor device
CN108292631B (zh) 半导体模块
CN111081643B (zh) 半导体装置及半导体装置的制造方法
CN111584477A (zh) 半导体模块和半导体模块的制造方法
CN102683301A (zh) 包括底座的半导体器件
US20210257269A1 (en) Semiconductor device
US11037845B2 (en) Semiconductor device and manufacturing method thereof
JP2012209470A (ja) 半導体装置、半導体装置モジュール及び半導体装置の製造方法
US20230253275A1 (en) Semiconductor device and semiconductor device manufacturing method
US20250210424A1 (en) Semiconductor device and method for manufacturing semiconductor device
US11616024B2 (en) Storage device including semiconductor chips sealed with resin on metal plate
CN120548610A (zh) 半导体装置
JP7778271B2 (ja) 半導体装置及びその製造方法
JP2025074405A (ja) 半導体モジュールおよび半導体モジュールの製造方法
CN114203650A (zh) 半导体装置和半导体装置的制造方法
WO2021261056A1 (ja) パワーモジュール
JP2022044158A (ja) 半導体モジュールの製造方法
US20240266265A1 (en) Semiconductor device
CN110416178A (zh) 一种集成电路封装结构及其封装方法
JP7803460B2 (ja) 放熱ベース、半導体モジュール、及びエネルギー変換装置
TWI851424B (zh) 半導體模組及其製作方法
US20240304567A1 (en) Semiconductor device and method of manufacturing semiconductor device
JP7570298B2 (ja) 半導体装置

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination