JPWO2024157663A5 - - Google Patents

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Publication number
JPWO2024157663A5
JPWO2024157663A5 JP2024572893A JP2024572893A JPWO2024157663A5 JP WO2024157663 A5 JPWO2024157663 A5 JP WO2024157663A5 JP 2024572893 A JP2024572893 A JP 2024572893A JP 2024572893 A JP2024572893 A JP 2024572893A JP WO2024157663 A5 JPWO2024157663 A5 JP WO2024157663A5
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JP
Japan
Prior art keywords
substrate
sio
layer
bonding
heating
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JP2024572893A
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English (en)
Japanese (ja)
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JP7834207B2 (ja
JPWO2024157663A1 (https=
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Priority claimed from PCT/JP2023/045518 external-priority patent/WO2024157663A1/ja
Publication of JPWO2024157663A1 publication Critical patent/JPWO2024157663A1/ja
Publication of JPWO2024157663A5 publication Critical patent/JPWO2024157663A5/ja
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JP2024572893A 2023-01-27 2023-12-19 接合体の製造方法および接合方法 Active JP7834207B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023011416 2023-01-27
JP2023011416 2023-01-27
PCT/JP2023/045518 WO2024157663A1 (ja) 2023-01-27 2023-12-19 接合体の製造方法および接合方法

Publications (3)

Publication Number Publication Date
JPWO2024157663A1 JPWO2024157663A1 (https=) 2024-08-02
JPWO2024157663A5 true JPWO2024157663A5 (https=) 2025-05-22
JP7834207B2 JP7834207B2 (ja) 2026-03-23

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ID=91970403

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024572893A Active JP7834207B2 (ja) 2023-01-27 2023-12-19 接合体の製造方法および接合方法

Country Status (6)

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US (1) US20250323210A1 (https=)
JP (1) JP7834207B2 (https=)
KR (1) KR20250120331A (https=)
CN (1) CN120548593A (https=)
DE (1) DE112023004646T5 (https=)
WO (1) WO2024157663A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026048189A1 (ja) * 2024-08-27 2026-03-05 日本碍子株式会社 複合基板の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2200077B1 (en) 2008-12-22 2012-12-05 Soitec Method for bonding two substrates
JP2016171307A (ja) 2015-03-10 2016-09-23 株式会社デンソー 基板接合方法
JP6454606B2 (ja) 2015-06-02 2019-01-16 信越化学工業株式会社 酸化物単結晶薄膜を備えた複合ウェーハの製造方法

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