KR20250120331A - 접합체의 제조 방법 및 접합 방법 - Google Patents

접합체의 제조 방법 및 접합 방법

Info

Publication number
KR20250120331A
KR20250120331A KR1020257022110A KR20257022110A KR20250120331A KR 20250120331 A KR20250120331 A KR 20250120331A KR 1020257022110 A KR1020257022110 A KR 1020257022110A KR 20257022110 A KR20257022110 A KR 20257022110A KR 20250120331 A KR20250120331 A KR 20250120331A
Authority
KR
South Korea
Prior art keywords
substrate
sio
bonding
layer
mbar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257022110A
Other languages
English (en)
Korean (ko)
Inventor
다카히로 야마데라
게이타 이와마
Original Assignee
엔지케이 인슐레이터 엘티디
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엔지케이 인슐레이터 엘티디 filed Critical 엔지케이 인슐레이터 엘티디
Publication of KR20250120331A publication Critical patent/KR20250120331A/ko
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/03—Assembling devices that include piezoelectric or electrostrictive parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
    • H10N30/086—Shaping or machining of piezoelectric or electrostrictive bodies by machining by polishing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Ceramic Products (AREA)
KR1020257022110A 2023-01-27 2023-12-19 접합체의 제조 방법 및 접합 방법 Pending KR20250120331A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023011416 2023-01-27
JPJP-P-2023-011416 2023-01-27
PCT/JP2023/045518 WO2024157663A1 (ja) 2023-01-27 2023-12-19 接合体の製造方法および接合方法

Publications (1)

Publication Number Publication Date
KR20250120331A true KR20250120331A (ko) 2025-08-08

Family

ID=91970403

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257022110A Pending KR20250120331A (ko) 2023-01-27 2023-12-19 접합체의 제조 방법 및 접합 방법

Country Status (6)

Country Link
US (1) US20250323210A1 (https=)
JP (1) JP7834207B2 (https=)
KR (1) KR20250120331A (https=)
CN (1) CN120548593A (https=)
DE (1) DE112023004646T5 (https=)
WO (1) WO2024157663A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026048189A1 (ja) * 2024-08-27 2026-03-05 日本碍子株式会社 複合基板の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016225537A (ja) 2015-06-02 2016-12-28 信越化学工業株式会社 酸化物単結晶薄膜を備えた複合ウェーハの製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2200077B1 (en) 2008-12-22 2012-12-05 Soitec Method for bonding two substrates
JP2016171307A (ja) 2015-03-10 2016-09-23 株式会社デンソー 基板接合方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016225537A (ja) 2015-06-02 2016-12-28 信越化学工業株式会社 酸化物単結晶薄膜を備えた複合ウェーハの製造方法

Also Published As

Publication number Publication date
DE112023004646T5 (de) 2025-08-28
US20250323210A1 (en) 2025-10-16
JP7834207B2 (ja) 2026-03-23
JPWO2024157663A1 (https=) 2024-08-02
CN120548593A (zh) 2025-08-26
WO2024157663A1 (ja) 2024-08-02

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