JPWO2024157663A1 - - Google Patents
Info
- Publication number
- JPWO2024157663A1 JPWO2024157663A1 JP2024572893A JP2024572893A JPWO2024157663A1 JP WO2024157663 A1 JPWO2024157663 A1 JP WO2024157663A1 JP 2024572893 A JP2024572893 A JP 2024572893A JP 2024572893 A JP2024572893 A JP 2024572893A JP WO2024157663 A1 JPWO2024157663 A1 JP WO2024157663A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/03—Assembling devices that include piezoelectric or electrostrictive parts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
- H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
- H10N30/086—Shaping or machining of piezoelectric or electrostrictive bodies by machining by polishing or grinding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07331—Connecting techniques
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Ceramic Products (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023011416 | 2023-01-27 | ||
| JP2023011416 | 2023-01-27 | ||
| PCT/JP2023/045518 WO2024157663A1 (ja) | 2023-01-27 | 2023-12-19 | 接合体の製造方法および接合方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2024157663A1 true JPWO2024157663A1 (https=) | 2024-08-02 |
| JPWO2024157663A5 JPWO2024157663A5 (https=) | 2025-05-22 |
| JP7834207B2 JP7834207B2 (ja) | 2026-03-23 |
Family
ID=91970403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024572893A Active JP7834207B2 (ja) | 2023-01-27 | 2023-12-19 | 接合体の製造方法および接合方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20250323210A1 (https=) |
| JP (1) | JP7834207B2 (https=) |
| KR (1) | KR20250120331A (https=) |
| CN (1) | CN120548593A (https=) |
| DE (1) | DE112023004646T5 (https=) |
| WO (1) | WO2024157663A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2026048189A1 (ja) * | 2024-08-27 | 2026-03-05 | 日本碍子株式会社 | 複合基板の製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010149180A (ja) * | 2008-12-22 | 2010-07-08 | Soi Tec Silicon On Insulator Technologies | ２つの基板を接合するための接合方法 |
| JP2016171307A (ja) * | 2015-03-10 | 2016-09-23 | 株式会社デンソー | 基板接合方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6454606B2 (ja) | 2015-06-02 | 2019-01-16 | 信越化学工業株式会社 | 酸化物単結晶薄膜を備えた複合ウェーハの製造方法 |
-
2023
- 2023-12-19 DE DE112023004646.8T patent/DE112023004646T5/de active Pending
- 2023-12-19 WO PCT/JP2023/045518 patent/WO2024157663A1/ja not_active Ceased
- 2023-12-19 KR KR1020257022110A patent/KR20250120331A/ko active Pending
- 2023-12-19 CN CN202380089885.4A patent/CN120548593A/zh active Pending
- 2023-12-19 JP JP2024572893A patent/JP7834207B2/ja active Active
-
2025
- 2025-06-26 US US19/250,217 patent/US20250323210A1/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010149180A (ja) * | 2008-12-22 | 2010-07-08 | Soi Tec Silicon On Insulator Technologies | ２つの基板を接合するための接合方法 |
| JP2016171307A (ja) * | 2015-03-10 | 2016-09-23 | 株式会社デンソー | 基板接合方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE112023004646T5 (de) | 2025-08-28 |
| US20250323210A1 (en) | 2025-10-16 |
| JP7834207B2 (ja) | 2026-03-23 |
| KR20250120331A (ko) | 2025-08-08 |
| CN120548593A (zh) | 2025-08-26 |
| WO2024157663A1 (ja) | 2024-08-02 |
Similar Documents
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