CN120548593A - 接合体的制造方法及接合方法 - Google Patents

接合体的制造方法及接合方法

Info

Publication number
CN120548593A
CN120548593A CN202380089885.4A CN202380089885A CN120548593A CN 120548593 A CN120548593 A CN 120548593A CN 202380089885 A CN202380089885 A CN 202380089885A CN 120548593 A CN120548593 A CN 120548593A
Authority
CN
China
Prior art keywords
substrate
sio
bonding
layer
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380089885.4A
Other languages
English (en)
Chinese (zh)
Inventor
山寺乔纮
岩间敬太
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Publication of CN120548593A publication Critical patent/CN120548593A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/03—Assembling devices that include piezoelectric or electrostrictive parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
    • H10N30/086—Shaping or machining of piezoelectric or electrostrictive bodies by machining by polishing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Ceramic Products (AREA)
CN202380089885.4A 2023-01-27 2023-12-19 接合体的制造方法及接合方法 Pending CN120548593A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023011416 2023-01-27
JP2023-011416 2023-01-27
PCT/JP2023/045518 WO2024157663A1 (ja) 2023-01-27 2023-12-19 接合体の製造方法および接合方法

Publications (1)

Publication Number Publication Date
CN120548593A true CN120548593A (zh) 2025-08-26

Family

ID=91970403

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380089885.4A Pending CN120548593A (zh) 2023-01-27 2023-12-19 接合体的制造方法及接合方法

Country Status (6)

Country Link
US (1) US20250323210A1 (https=)
JP (1) JP7834207B2 (https=)
KR (1) KR20250120331A (https=)
CN (1) CN120548593A (https=)
DE (1) DE112023004646T5 (https=)
WO (1) WO2024157663A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026048189A1 (ja) * 2024-08-27 2026-03-05 日本碍子株式会社 複合基板の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2200077B1 (en) 2008-12-22 2012-12-05 Soitec Method for bonding two substrates
JP2016171307A (ja) 2015-03-10 2016-09-23 株式会社デンソー 基板接合方法
JP6454606B2 (ja) 2015-06-02 2019-01-16 信越化学工業株式会社 酸化物単結晶薄膜を備えた複合ウェーハの製造方法

Also Published As

Publication number Publication date
DE112023004646T5 (de) 2025-08-28
US20250323210A1 (en) 2025-10-16
JP7834207B2 (ja) 2026-03-23
KR20250120331A (ko) 2025-08-08
JPWO2024157663A1 (https=) 2024-08-02
WO2024157663A1 (ja) 2024-08-02

Similar Documents

Publication Publication Date Title
KR101335713B1 (ko) 접합 기판의 제조방법 및 접합 기판
CN112868178B (zh) 接合体及弹性波元件
KR101541940B1 (ko) Ｓｏｉ 기판의 제조 방법
KR101291956B1 (ko) 증착된 장벽층을 구비한 유리 절연체 상의 반도체
CN112243568B (zh) 接合体及弹性波元件
CN112840563B (zh) 接合体及弹性波元件
CN112272920B (zh) 接合体及弹性波元件
CN102468385A (zh) 复合基板及复合基板的制造方法
CN105074868A (zh) 复合基板、半导体装置及半导体装置的制法
KR20200096987A (ko) 압전성 재료 기판과 지지 기판의 접합체
US20070029043A1 (en) Pre-made cleavable substrate method and structure of fabricating devices using one or more films provided by a layer transfer process
US20250323210A1 (en) Manufacturing method and joining method of joined body
CN114388688B (zh) 基于等离子体刻蚀的黑化单晶压电复合薄膜及其制备方法
JP2007227415A (ja) 貼り合わせ基板の製造方法および貼り合わせ基板
JP2020536841A (ja) ナノレベルの単結晶薄膜
US20250334742A1 (en) Composite substrate and method of manufacturing composite substrate
JP7183481B1 (ja) 接合体
EP4497151B1 (en) Method of forming a composite substrate
WO2025100277A1 (ja) 接合体、デバイスおよび接合体の製造方法
US20250374674A1 (en) Composite substrate
US20260040825A1 (en) Bonded body and method for producing bonded body
WO2024225277A1 (ja) 複合基板
TW202610529A (zh) 複合基板的製造方法
WO2026048189A1 (ja) 複合基板の製造方法
KR20220149737A (ko) 복합 기판 및 탄성 표면파 소자

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination