JP7834207B2 - 接合体の製造方法および接合方法 - Google Patents

接合体の製造方法および接合方法

Info

Publication number
JP7834207B2
JP7834207B2 JP2024572893A JP2024572893A JP7834207B2 JP 7834207 B2 JP7834207 B2 JP 7834207B2 JP 2024572893 A JP2024572893 A JP 2024572893A JP 2024572893 A JP2024572893 A JP 2024572893A JP 7834207 B2 JP7834207 B2 JP 7834207B2
Authority
JP
Japan
Prior art keywords
substrate
sio2
joining
mbar
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024572893A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024157663A1 (https=
JPWO2024157663A5 (https=
Inventor
喬紘 山寺
敬太 岩間
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Publication of JPWO2024157663A1 publication Critical patent/JPWO2024157663A1/ja
Publication of JPWO2024157663A5 publication Critical patent/JPWO2024157663A5/ja
Application granted granted Critical
Publication of JP7834207B2 publication Critical patent/JP7834207B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/03—Assembling devices that include piezoelectric or electrostrictive parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
    • H10N30/086—Shaping or machining of piezoelectric or electrostrictive bodies by machining by polishing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Ceramic Products (AREA)
JP2024572893A 2023-01-27 2023-12-19 接合体の製造方法および接合方法 Active JP7834207B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023011416 2023-01-27
JP2023011416 2023-01-27
PCT/JP2023/045518 WO2024157663A1 (ja) 2023-01-27 2023-12-19 接合体の製造方法および接合方法

Publications (3)

Publication Number Publication Date
JPWO2024157663A1 JPWO2024157663A1 (https=) 2024-08-02
JPWO2024157663A5 JPWO2024157663A5 (https=) 2025-05-22
JP7834207B2 true JP7834207B2 (ja) 2026-03-23

Family

ID=91970403

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024572893A Active JP7834207B2 (ja) 2023-01-27 2023-12-19 接合体の製造方法および接合方法

Country Status (6)

Country Link
US (1) US20250323210A1 (https=)
JP (1) JP7834207B2 (https=)
KR (1) KR20250120331A (https=)
CN (1) CN120548593A (https=)
DE (1) DE112023004646T5 (https=)
WO (1) WO2024157663A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026048189A1 (ja) * 2024-08-27 2026-03-05 日本碍子株式会社 複合基板の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010149180A (ja) 2008-12-22 2010-07-08 Soi Tec Silicon On Insulator Technologies ２つの基板を接合するための接合方法
JP2016171307A (ja) 2015-03-10 2016-09-23 株式会社デンソー 基板接合方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6454606B2 (ja) 2015-06-02 2019-01-16 信越化学工業株式会社 酸化物単結晶薄膜を備えた複合ウェーハの製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010149180A (ja) 2008-12-22 2010-07-08 Soi Tec Silicon On Insulator Technologies ２つの基板を接合するための接合方法
JP2016171307A (ja) 2015-03-10 2016-09-23 株式会社デンソー 基板接合方法

Also Published As

Publication number Publication date
DE112023004646T5 (de) 2025-08-28
US20250323210A1 (en) 2025-10-16
KR20250120331A (ko) 2025-08-08
JPWO2024157663A1 (https=) 2024-08-02
CN120548593A (zh) 2025-08-26
WO2024157663A1 (ja) 2024-08-02

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