JPWO2024154358A5 - - Google Patents

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Publication number
JPWO2024154358A5
JPWO2024154358A5 JP2024571595A JP2024571595A JPWO2024154358A5 JP WO2024154358 A5 JPWO2024154358 A5 JP WO2024154358A5 JP 2024571595 A JP2024571595 A JP 2024571595A JP 2024571595 A JP2024571595 A JP 2024571595A JP WO2024154358 A5 JPWO2024154358 A5 JP WO2024154358A5
Authority
JP
Japan
Prior art keywords
wiring
electrode
substrate
forming
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024571595A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024154358A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/001780 external-priority patent/WO2024154358A1/ja
Publication of JPWO2024154358A1 publication Critical patent/JPWO2024154358A1/ja
Publication of JPWO2024154358A5 publication Critical patent/JPWO2024154358A5/ja
Pending legal-status Critical Current

Links

JP2024571595A 2023-01-20 2023-01-20 Pending JPWO2024154358A1 (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/001780 WO2024154358A1 (ja) 2023-01-20 2023-01-20 デバイスおよびデバイスの製造方法

Publications (2)

Publication Number Publication Date
JPWO2024154358A1 JPWO2024154358A1 (https=) 2024-07-25
JPWO2024154358A5 true JPWO2024154358A5 (https=) 2025-08-22

Family

ID=91955746

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024571595A Pending JPWO2024154358A1 (https=) 2023-01-20 2023-01-20

Country Status (4)

Country Link
US (1) US20250309092A1 (https=)
EP (1) EP4654809A4 (https=)
JP (1) JPWO2024154358A1 (https=)
WO (1) WO2024154358A1 (https=)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4979213B2 (ja) * 2005-08-31 2012-07-18 オンセミコンダクター・トレーディング・リミテッド 回路基板、回路基板の製造方法および回路装置
JP2008053429A (ja) * 2006-08-24 2008-03-06 Fujikura Ltd 半導体装置
US11362257B2 (en) 2017-05-16 2022-06-14 National Institute Of Advanced Industrial Science And Technology Quantum bit device
US11276727B1 (en) * 2017-06-19 2022-03-15 Rigetti & Co, Llc Superconducting vias for routing electrical signals through substrates and their methods of manufacture
JP2019165055A (ja) * 2018-03-19 2019-09-26 Tdk株式会社 半導体装置およびその製造方法
US11088310B2 (en) * 2019-04-29 2021-08-10 International Business Machines Corporation Through-silicon-via fabrication in planar quantum devices
WO2021245949A1 (ja) 2020-06-05 2021-12-09 日本電気株式会社 量子デバイス及び量子計算機
US20220199507A1 (en) 2020-12-22 2022-06-23 International Business Machines Corporation Multi-layered packaging for superconducting quantum circuits
EP4227862A4 (en) * 2020-12-31 2024-04-24 Origin Quantum Computing Technology (Hefei) Co., Ltd Superconducting quantum chip structure and superconducting quantum chip preparation method
JP7806395B2 (ja) * 2021-04-23 2026-01-27 日本電気株式会社 量子デバイス

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