JPWO2024143384A5 - - Google Patents
Info
- Publication number
- JPWO2024143384A5 JPWO2024143384A5 JP2024567875A JP2024567875A JPWO2024143384A5 JP WO2024143384 A5 JPWO2024143384 A5 JP WO2024143384A5 JP 2024567875 A JP2024567875 A JP 2024567875A JP 2024567875 A JP2024567875 A JP 2024567875A JP WO2024143384 A5 JPWO2024143384 A5 JP WO2024143384A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- sic
- sic semiconductor
- region
- trench
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022212617 | 2022-12-28 | ||
| PCT/JP2023/046705 WO2024143384A1 (ja) | 2022-12-28 | 2023-12-26 | ＳｉＣ半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024143384A1 JPWO2024143384A1 (https=) | 2024-07-04 |
| JPWO2024143384A5 true JPWO2024143384A5 (https=) | 2025-09-11 |
Family
ID=91717842
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024567875A Pending JPWO2024143384A1 (https=) | 2022-12-28 | 2023-12-26 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250324682A1 (https=) |
| JP (1) | JPWO2024143384A1 (https=) |
| CN (1) | CN120435925A (https=) |
| DE (1) | DE112023004917T5 (https=) |
| WO (1) | WO2024143384A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7055725B2 (ja) * | 2018-09-14 | 2022-04-18 | 株式会社東芝 | 半導体装置 |
| JP7156170B2 (ja) * | 2019-05-20 | 2022-10-19 | 株式会社豊田中央研究所 | 半導体装置とその製造方法 |
| JP7472477B2 (ja) * | 2019-12-02 | 2024-04-23 | 富士電機株式会社 | 炭化珪素半導体装置の製造方法および炭化珪素基板の製造方法 |
| JP7540320B2 (ja) * | 2020-12-11 | 2024-08-27 | 株式会社デンソー | 炭化珪素半導体装置およびその製造方法 |
| DE112021006730T5 (de) * | 2021-02-01 | 2023-10-12 | Rohm Co., Ltd. | Sic-halbleiterbauelement |
-
2023
- 2023-12-26 JP JP2024567875A patent/JPWO2024143384A1/ja active Pending
- 2023-12-26 DE DE112023004917.3T patent/DE112023004917T5/de active Pending
- 2023-12-26 WO PCT/JP2023/046705 patent/WO2024143384A1/ja not_active Ceased
- 2023-12-26 CN CN202380089504.2A patent/CN120435925A/zh active Pending
-
2025
- 2025-06-27 US US19/252,687 patent/US20250324682A1/en active Pending
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