JPWO2024070966A5 - - Google Patents

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Publication number
JPWO2024070966A5
JPWO2024070966A5 JP2024549330A JP2024549330A JPWO2024070966A5 JP WO2024070966 A5 JPWO2024070966 A5 JP WO2024070966A5 JP 2024549330 A JP2024549330 A JP 2024549330A JP 2024549330 A JP2024549330 A JP 2024549330A JP WO2024070966 A5 JPWO2024070966 A5 JP WO2024070966A5
Authority
JP
Japan
Prior art keywords
chip
die pad
wire
terminal
transmission device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024549330A
Other languages
English (en)
Japanese (ja)
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JPWO2024070966A1 (cg-RX-API-DMAC7.html
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/034561 external-priority patent/WO2024070966A1/ja
Publication of JPWO2024070966A1 publication Critical patent/JPWO2024070966A1/ja
Publication of JPWO2024070966A5 publication Critical patent/JPWO2024070966A5/ja
Pending legal-status Critical Current

Links

JP2024549330A 2022-09-29 2023-09-22 Pending JPWO2024070966A1 (cg-RX-API-DMAC7.html)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022156995 2022-09-29
PCT/JP2023/034561 WO2024070966A1 (ja) 2022-09-29 2023-09-22 信号伝達装置

Publications (2)

Publication Number Publication Date
JPWO2024070966A1 JPWO2024070966A1 (cg-RX-API-DMAC7.html) 2024-04-04
JPWO2024070966A5 true JPWO2024070966A5 (cg-RX-API-DMAC7.html) 2025-06-12

Family

ID=90477698

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024549330A Pending JPWO2024070966A1 (cg-RX-API-DMAC7.html) 2022-09-29 2023-09-22

Country Status (3)

Country Link
US (1) US20250253272A1 (cg-RX-API-DMAC7.html)
JP (1) JPWO2024070966A1 (cg-RX-API-DMAC7.html)
WO (1) WO2024070966A1 (cg-RX-API-DMAC7.html)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017112327A (ja) * 2015-12-18 2017-06-22 ルネサスエレクトロニクス株式会社 半導体装置
JP7527916B2 (ja) * 2020-09-29 2024-08-05 ローム株式会社 半導体装置
CN116472610A (zh) * 2020-10-20 2023-07-21 罗姆股份有限公司 半导体器件
US20240047438A1 (en) * 2020-12-18 2024-02-08 Rohm Co., Ltd. Semiconductor equipment

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