JPWO2024070958A5 - - Google Patents

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Publication number
JPWO2024070958A5
JPWO2024070958A5 JP2024549323A JP2024549323A JPWO2024070958A5 JP WO2024070958 A5 JPWO2024070958 A5 JP WO2024070958A5 JP 2024549323 A JP2024549323 A JP 2024549323A JP 2024549323 A JP2024549323 A JP 2024549323A JP WO2024070958 A5 JPWO2024070958 A5 JP WO2024070958A5
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JP
Japan
Prior art keywords
die pad
chip
lead
wire
transmission device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024549323A
Other languages
English (en)
Japanese (ja)
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JPWO2024070958A1 (cg-RX-API-DMAC7.html
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Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/034535 external-priority patent/WO2024070958A1/ja
Publication of JPWO2024070958A1 publication Critical patent/JPWO2024070958A1/ja
Publication of JPWO2024070958A5 publication Critical patent/JPWO2024070958A5/ja
Pending legal-status Critical Current

Links

JP2024549323A 2022-09-29 2023-09-22 Pending JPWO2024070958A1 (cg-RX-API-DMAC7.html)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022156994 2022-09-29
PCT/JP2023/034535 WO2024070958A1 (ja) 2022-09-29 2023-09-22 信号伝達装置

Publications (2)

Publication Number Publication Date
JPWO2024070958A1 JPWO2024070958A1 (cg-RX-API-DMAC7.html) 2024-04-04
JPWO2024070958A5 true JPWO2024070958A5 (cg-RX-API-DMAC7.html) 2025-06-12

Family

ID=90477748

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024549323A Pending JPWO2024070958A1 (cg-RX-API-DMAC7.html) 2022-09-29 2023-09-22

Country Status (2)

Country Link
JP (1) JPWO2024070958A1 (cg-RX-API-DMAC7.html)
WO (1) WO2024070958A1 (cg-RX-API-DMAC7.html)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6121692B2 (ja) * 2012-11-05 2017-04-26 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
JP7166234B2 (ja) * 2019-09-30 2022-11-07 三菱電機株式会社 半導体製造検査装置
JP2023179806A (ja) * 2020-09-09 2023-12-20 ローム株式会社 半導体装置
JP7824273B2 (ja) * 2021-02-25 2026-03-04 ローム株式会社 絶縁モジュールおよびゲートドライバ

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