JPWO2024070957A5 - - Google Patents

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Publication number
JPWO2024070957A5
JPWO2024070957A5 JP2024549322A JP2024549322A JPWO2024070957A5 JP WO2024070957 A5 JPWO2024070957 A5 JP WO2024070957A5 JP 2024549322 A JP2024549322 A JP 2024549322A JP 2024549322 A JP2024549322 A JP 2024549322A JP WO2024070957 A5 JPWO2024070957 A5 JP WO2024070957A5
Authority
JP
Japan
Prior art keywords
lead
die pad
chip
wire
transmission device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024549322A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024070957A1 (cg-RX-API-DMAC7.html
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/034534 external-priority patent/WO2024070957A1/ja
Publication of JPWO2024070957A1 publication Critical patent/JPWO2024070957A1/ja
Publication of JPWO2024070957A5 publication Critical patent/JPWO2024070957A5/ja
Pending legal-status Critical Current

Links

JP2024549322A 2022-09-29 2023-09-22 Pending JPWO2024070957A1 (cg-RX-API-DMAC7.html)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022156993 2022-09-29
PCT/JP2023/034534 WO2024070957A1 (ja) 2022-09-29 2023-09-22 信号伝達装置

Publications (2)

Publication Number Publication Date
JPWO2024070957A1 JPWO2024070957A1 (cg-RX-API-DMAC7.html) 2024-04-04
JPWO2024070957A5 true JPWO2024070957A5 (cg-RX-API-DMAC7.html) 2025-06-24

Family

ID=90477746

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024549322A Pending JPWO2024070957A1 (cg-RX-API-DMAC7.html) 2022-09-29 2023-09-22

Country Status (2)

Country Link
JP (1) JPWO2024070957A1 (cg-RX-API-DMAC7.html)
WO (1) WO2024070957A1 (cg-RX-API-DMAC7.html)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6121692B2 (ja) * 2012-11-05 2017-04-26 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
JP7166234B2 (ja) * 2019-09-30 2022-11-07 三菱電機株式会社 半導体製造検査装置
JP2023179806A (ja) * 2020-09-09 2023-12-20 ローム株式会社 半導体装置
JP7824273B2 (ja) * 2021-02-25 2026-03-04 ローム株式会社 絶縁モジュールおよびゲートドライバ

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