Classifications

• • G—PHYSICS
  • G06—COMPUTING OR CALCULATING; COUNTING
  • G06F—ELECTRIC DIGITAL DATA PROCESSING
  • G06F30/00—Computer-aided design [CAD]
  • G06F30/30—Circuit design
  • G06F30/39—Circuit design at the physical level
  • G06F30/394—Routing
  • G06F30/3953—Routing detailed
• • H—ELECTRICITY
  • H03—ELECTRONIC CIRCUITRY
  • H03K—PULSE TECHNIQUE
  • H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
  • H03K19/003—Modifications for increasing the reliability for protection
• • G—PHYSICS
  • G06—COMPUTING OR CALCULATING; COUNTING
  • G06F—ELECTRIC DIGITAL DATA PROCESSING
  • G06F30/00—Computer-aided design [CAD]
  • G06F30/30—Circuit design
  • G06F30/38—Circuit design at the mixed level of analogue and digital signals
• • G—PHYSICS
  • G06—COMPUTING OR CALCULATING; COUNTING
  • G06F—ELECTRIC DIGITAL DATA PROCESSING
  • G06F30/00—Computer-aided design [CAD]
  • G06F30/30—Circuit design
  • G06F30/39—Circuit design at the physical level
  • G06F30/392—Floor-planning or layout, e.g. partitioning or placement
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
  • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
  • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
  • H10D84/01—Manufacture or treatment
  • H10D84/02—Manufacture or treatment characterised by using material-based technologies
  • H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
  • H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
• • G—PHYSICS
  • G06—COMPUTING OR CALCULATING; COUNTING
  • G06F—ELECTRIC DIGITAL DATA PROCESSING
  • G06F2111/00—Details relating to CAD techniques
  • G06F2111/20—Configuration CAD, e.g. designing by assembling or positioning modules selected from libraries of predesigned modules

Landscapes

• Engineering & Computer Science (AREA)
• Computer Hardware Design (AREA)
• Physics & Mathematics (AREA)
• Theoretical Computer Science (AREA)
• General Engineering & Computer Science (AREA)
• Geometry (AREA)
• General Physics & Mathematics (AREA)
• Evolutionary Computation (AREA)
• Computer Networks & Wireless Communication (AREA)
• Architecture (AREA)
• Mathematical Physics (AREA)
• Computing Systems (AREA)
• Semiconductor Integrated Circuits (AREA)
• Design And Manufacture Of Integrated Circuits (AREA)

Applications Claiming Priority (2)

Publications (2)

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Family Applications (1)

Country Status (5)

Family Cites Families (13)

• 2022
  • 2022-06-13 JP JP2023535183A patent/JPWO2023286506A1/ja active Pending
  • 2022-06-13 CN CN202280044122.3A patent/CN117546281A/zh active Pending
  • 2022-06-13 DE DE112022002544.1T patent/DE112022002544T5/de active Pending
  • 2022-06-13 WO PCT/JP2022/023609 patent/WO2023286506A1/ja not_active Ceased
• 2023
  • 2023-12-19 US US18/545,662 patent/US20240119215A1/en active Pending

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