JPWO2023277085A5 - - Google Patents

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Publication number
JPWO2023277085A5
JPWO2023277085A5 JP2023532034A JP2023532034A JPWO2023277085A5 JP WO2023277085 A5 JPWO2023277085 A5 JP WO2023277085A5 JP 2023532034 A JP2023532034 A JP 2023532034A JP 2023532034 A JP2023532034 A JP 2023532034A JP WO2023277085 A5 JPWO2023277085 A5 JP WO2023277085A5
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JP
Japan
Prior art keywords
solder
forming member
bump forming
solder bump
member according
Prior art date
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JP2023532034A
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English (en)
Japanese (ja)
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JP7831485B2 (ja
JPWO2023277085A1 (https=
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Priority claimed from PCT/JP2022/026032 external-priority patent/WO2023277085A1/ja
Publication of JPWO2023277085A1 publication Critical patent/JPWO2023277085A1/ja
Publication of JPWO2023277085A5 publication Critical patent/JPWO2023277085A5/ja
Application granted granted Critical
Publication of JP7831485B2 publication Critical patent/JP7831485B2/ja
Active legal-status Critical Current
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JP2023532034A 2021-06-30 2022-06-29 はんだバンプ形成用部材 Active JP7831485B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021108630 2021-06-30
JP2021108630 2021-06-30
PCT/JP2022/026032 WO2023277085A1 (ja) 2021-06-30 2022-06-29 はんだバンプ形成用部材

Publications (3)

Publication Number Publication Date
JPWO2023277085A1 JPWO2023277085A1 (https=) 2023-01-05
JPWO2023277085A5 true JPWO2023277085A5 (https=) 2024-04-03
JP7831485B2 JP7831485B2 (ja) 2026-03-17

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ID=84691854

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023532034A Active JP7831485B2 (ja) 2021-06-30 2022-06-29 はんだバンプ形成用部材

Country Status (5)

Country Link
JP (1) JP7831485B2 (https=)
KR (1) KR20240027706A (https=)
CN (1) CN117581342A (https=)
TW (1) TW202318605A (https=)
WO (1) WO2023277085A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08139427A (ja) * 1994-11-04 1996-05-31 Mitsubishi Electric Corp 球状電極の形成方法
JPH09246324A (ja) * 1996-03-08 1997-09-19 Hitachi Ltd 電子部品及びそのバンプ形成方法
JP2006216702A (ja) * 2005-02-02 2006-08-17 Tdk Corp 半田ボールの転写方法及び転写装置
JP5889160B2 (ja) * 2012-10-17 2016-03-22 三菱電機株式会社 電子機器の製造方法
JP6428407B2 (ja) * 2015-03-18 2018-11-28 三菱マテリアル株式会社 ハンダ粉末の製造方法及びこの粉末を用いたハンダ用ペーストの製造方法
JP2017157626A (ja) 2016-02-29 2017-09-07 三菱マテリアル株式会社 はんだバンプの形成方法
JP2018206953A (ja) * 2017-06-05 2018-12-27 三菱マテリアル株式会社 はんだバンプ形成方法及びはんだペースト

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