JPWO2023195164A5 - - Google Patents

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Publication number
JPWO2023195164A5
JPWO2023195164A5 JP2024513672A JP2024513672A JPWO2023195164A5 JP WO2023195164 A5 JPWO2023195164 A5 JP WO2023195164A5 JP 2024513672 A JP2024513672 A JP 2024513672A JP 2024513672 A JP2024513672 A JP 2024513672A JP WO2023195164 A5 JPWO2023195164 A5 JP WO2023195164A5
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JP
Japan
Prior art keywords
plating film
semiconductor device
contact
wire bump
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024513672A
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English (en)
Japanese (ja)
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JP7630717B2 (ja
JPWO2023195164A1 (https=
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Priority claimed from PCT/JP2022/017378 external-priority patent/WO2023195164A1/ja
Publication of JPWO2023195164A1 publication Critical patent/JPWO2023195164A1/ja
Publication of JPWO2023195164A5 publication Critical patent/JPWO2023195164A5/ja
Application granted granted Critical
Publication of JP7630717B2 publication Critical patent/JP7630717B2/ja
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Anticipated expiration legal-status Critical

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JP2024513672A 2022-04-08 2022-04-08 半導体装置及び半導体装置の製造方法 Active JP7630717B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/017378 WO2023195164A1 (ja) 2022-04-08 2022-04-08 半導体装置及び半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JPWO2023195164A1 JPWO2023195164A1 (https=) 2023-10-12
JPWO2023195164A5 true JPWO2023195164A5 (https=) 2024-05-29
JP7630717B2 JP7630717B2 (ja) 2025-02-17

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ID=88242810

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024513672A Active JP7630717B2 (ja) 2022-04-08 2022-04-08 半導体装置及び半導体装置の製造方法

Country Status (5)

Country Link
US (1) US20250157981A1 (https=)
JP (1) JP7630717B2 (https=)
CN (1) CN118974898A (https=)
DE (1) DE112022007004T5 (https=)
WO (1) WO2023195164A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202318568A (zh) * 2021-07-30 2023-05-01 日商尼康股份有限公司 金屬配線的製造方法、電晶體的製造方法及金屬配線

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001326245A (ja) * 2000-05-16 2001-11-22 Hitachi Ltd 半導体装置およびその製造方法
JP3692978B2 (ja) * 2001-07-24 2005-09-07 日立電線株式会社 配線基板の製造方法
JP5509295B2 (ja) * 2012-11-02 2014-06-04 パナソニック株式会社 半導体装置
JP6487122B2 (ja) * 2016-06-14 2019-03-20 三菱電機株式会社 電力用半導体装置

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