JPWO2023190524A5 - - Google Patents

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Publication number
JPWO2023190524A5
JPWO2023190524A5 JP2024512571A JP2024512571A JPWO2023190524A5 JP WO2023190524 A5 JPWO2023190524 A5 JP WO2023190524A5 JP 2024512571 A JP2024512571 A JP 2024512571A JP 2024512571 A JP2024512571 A JP 2024512571A JP WO2023190524 A5 JPWO2023190524 A5 JP WO2023190524A5
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JP
Japan
Prior art keywords
needle
shaped body
heat sink
shaped
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024512571A
Other languages
English (en)
Japanese (ja)
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JPWO2023190524A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/012540 external-priority patent/WO2023190524A1/ja
Publication of JPWO2023190524A1 publication Critical patent/JPWO2023190524A1/ja
Publication of JPWO2023190524A5 publication Critical patent/JPWO2023190524A5/ja
Pending legal-status Critical Current

Links

JP2024512571A 2022-03-30 2023-03-28 Pending JPWO2023190524A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022055454 2022-03-30
PCT/JP2023/012540 WO2023190524A1 (ja) 2022-03-30 2023-03-28 放熱板及びベイパーチャンバー

Publications (2)

Publication Number Publication Date
JPWO2023190524A1 JPWO2023190524A1 (https=) 2023-10-05
JPWO2023190524A5 true JPWO2023190524A5 (https=) 2024-12-03

Family

ID=88202585

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024512571A Pending JPWO2023190524A1 (https=) 2022-03-30 2023-03-28

Country Status (5)

Country Link
US (1) US20250224181A1 (https=)
EP (1) EP4502522A1 (https=)
JP (1) JPWO2023190524A1 (https=)
CN (1) CN118922681A (https=)
WO (1) WO2023190524A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025244030A1 (ja) * 2024-05-21 2025-11-27 京セラ株式会社 放熱部材、ベイパーチャンバー及び機能モジュール

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5710351B2 (https=) * 1973-09-05 1982-02-25
US6191944B1 (en) * 1998-11-05 2001-02-20 Electrovac, Fabrikation Elektrotechnischer Spezialartikel Gesellschaft M.B.H. Heat sink for electric and/or electronic devices
JP2002141449A (ja) * 2000-10-31 2002-05-17 Denso Corp 沸騰冷却器
JP4558258B2 (ja) 2001-10-01 2010-10-06 古河電気工業株式会社 板型ヒートパイプおよびその製造方法
US7579077B2 (en) * 2003-05-05 2009-08-25 Nanosys, Inc. Nanofiber surfaces for use in enhanced surface area applications
JP2009260168A (ja) * 2008-04-21 2009-11-05 Sumitomo Electric Ind Ltd 放熱構造、放熱装置及び放熱構造の製造方法
JP4706754B2 (ja) * 2008-12-24 2011-06-22 ソニー株式会社 熱輸送デバイス及び電子機器
US20110108245A1 (en) * 2009-11-10 2011-05-12 Dsem Holdings Sdn. Bhd. Circuit Board Forming Diffusion Bonded Wall of Vapor Chamber
CN103649240B (zh) * 2011-01-19 2016-09-14 哈佛学院院长等 具有高压稳定性、光学透明性以及自修复特征的光滑表面
US20130126132A1 (en) * 2011-11-18 2013-05-23 Chih-peng Chen Vapor chamber with integrally formed wick structure and method of manufacturing same
CN108323137A (zh) * 2017-01-18 2018-07-24 台达电子工业股份有限公司 均热板
US10473404B2 (en) * 2017-11-14 2019-11-12 Asia Vital Components Co., Ltd. Straight-through structure of heat dissipation unit
US20190285357A1 (en) * 2018-03-19 2019-09-19 Asia Vital Components Co., Ltd. Middle member of heat dissipation device and the heat dissipation device
WO2021188128A1 (en) * 2020-03-18 2021-09-23 Kelvin Thermal Technologies, Inc. Deformed mesh thermal ground plane

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