CN118922681A - 散热板及均热板 - Google Patents

散热板及均热板 Download PDF

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Publication number
CN118922681A
CN118922681A CN202380029917.1A CN202380029917A CN118922681A CN 118922681 A CN118922681 A CN 118922681A CN 202380029917 A CN202380029917 A CN 202380029917A CN 118922681 A CN118922681 A CN 118922681A
Authority
CN
China
Prior art keywords
needle
main surface
region
area
heat dissipating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380029917.1A
Other languages
English (en)
Chinese (zh)
Inventor
小西芳紀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of CN118922681A publication Critical patent/CN118922681A/zh
Pending legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN202380029917.1A 2022-03-30 2023-03-28 散热板及均热板 Pending CN118922681A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-055454 2022-03-30
JP2022055454 2022-03-30
PCT/JP2023/012540 WO2023190524A1 (ja) 2022-03-30 2023-03-28 放熱板及びベイパーチャンバー

Publications (1)

Publication Number Publication Date
CN118922681A true CN118922681A (zh) 2024-11-08

Family

ID=88202585

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380029917.1A Pending CN118922681A (zh) 2022-03-30 2023-03-28 散热板及均热板

Country Status (5)

Country Link
US (1) US20250224181A1 (https=)
EP (1) EP4502522A1 (https=)
JP (1) JPWO2023190524A1 (https=)
CN (1) CN118922681A (https=)
WO (1) WO2023190524A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025244030A1 (ja) * 2024-05-21 2025-11-27 京セラ株式会社 放熱部材、ベイパーチャンバー及び機能モジュール

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5710351B2 (https=) * 1973-09-05 1982-02-25
US6191944B1 (en) * 1998-11-05 2001-02-20 Electrovac, Fabrikation Elektrotechnischer Spezialartikel Gesellschaft M.B.H. Heat sink for electric and/or electronic devices
JP2002141449A (ja) * 2000-10-31 2002-05-17 Denso Corp 沸騰冷却器
JP4558258B2 (ja) 2001-10-01 2010-10-06 古河電気工業株式会社 板型ヒートパイプおよびその製造方法
US7579077B2 (en) * 2003-05-05 2009-08-25 Nanosys, Inc. Nanofiber surfaces for use in enhanced surface area applications
JP2009260168A (ja) * 2008-04-21 2009-11-05 Sumitomo Electric Ind Ltd 放熱構造、放熱装置及び放熱構造の製造方法
JP4706754B2 (ja) * 2008-12-24 2011-06-22 ソニー株式会社 熱輸送デバイス及び電子機器
US20110108245A1 (en) * 2009-11-10 2011-05-12 Dsem Holdings Sdn. Bhd. Circuit Board Forming Diffusion Bonded Wall of Vapor Chamber
CN103649240B (zh) * 2011-01-19 2016-09-14 哈佛学院院长等 具有高压稳定性、光学透明性以及自修复特征的光滑表面
US20130126132A1 (en) * 2011-11-18 2013-05-23 Chih-peng Chen Vapor chamber with integrally formed wick structure and method of manufacturing same
CN108323137A (zh) * 2017-01-18 2018-07-24 台达电子工业股份有限公司 均热板
US10473404B2 (en) * 2017-11-14 2019-11-12 Asia Vital Components Co., Ltd. Straight-through structure of heat dissipation unit
US20190285357A1 (en) * 2018-03-19 2019-09-19 Asia Vital Components Co., Ltd. Middle member of heat dissipation device and the heat dissipation device
WO2021188128A1 (en) * 2020-03-18 2021-09-23 Kelvin Thermal Technologies, Inc. Deformed mesh thermal ground plane

Also Published As

Publication number Publication date
JPWO2023190524A1 (https=) 2023-10-05
WO2023190524A1 (ja) 2023-10-05
EP4502522A1 (en) 2025-02-05
US20250224181A1 (en) 2025-07-10

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