CN101627472A - 散热器和电子装置以及电子装置的制造方法 - Google Patents
散热器和电子装置以及电子装置的制造方法 Download PDFInfo
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Abstract
本发明提供散热器和电子装置以及电子装置的制造方法,在具有与半导体芯片热连接的基座和多个散热片的散热器中,在所述散热片中,配设于来自半导体芯片的热传导温度高的部位的散热片形成得较长,并且随着热传导温度的降低而使散热片形成得较短。并且,散热片由从基座直立起来的直立部和从该直立部向外侧弯折成大致直角的水平部构成。
Description
技术领域
本发明涉及一种散热器和电子装置以及电子装置的制造方法,特别涉及到具有多个散热片的散热器和电子装置以及电子装置的制造方法。
背景技术
例如,功率器件等电子装置实现了高密度化和高输出化,与此相伴地产生的发热量也有增大的倾向。为此,在这些发热的电子装置中设有用于进行冷却的散热器。通常,这种散热器构成为在与作为发热体的电子元件热连接的基座上设置多个散热片。
此外,已知有例如专利文献1和专利文献2中公开的散热器的结构。图1所示的散热器1A是模拟显示的专利文献1中公开的散热器。此外,图2所示的散热器1B是模拟显示的专利文献2中公开的散热器。
如各图中所示,散热器1A、1B构成为在与作为发热体的电子元件5热连接的基座2上形成多个散热片3A、3B的结构。通过如此设置多个散热片3A、3B,能够增大散热片3A、3B整体的散热面积,提高散热效率。
另外,在图1和图2所示状态下,冷却散热器1A、1B的冷却风沿相对于图的纸面垂直的方向吹送。
其中,关注图1所示的散热器1A,该散热器1A的散热片3A全部形成为相等的长度。像这样,使散热片3A全部是相等的长度的话,散热器1A的整体形状形成为大致长方体形状。由此,该散热器1A如后所述那样空间利用效率较高,因而以往一般被广泛应用。
与此相对地,图2所示的散热器1B被设定为:处于基座2的中央位置的散热片3B的长度较长,越靠外侧散热片3B的长度变得越短。
图3示出了基座2的温度分布。该图中的A1~A3与图2中所示的基座2的A1~A3的位置对应。如图3所示,作为发热体的电子元件5所配置的位置A2的温度最高,从该位置A2开始基座2的温度越靠外侧越低。
因此,像散热器1B那样在基座2的温度较高的部位处配置散热效率高的较长散热片3B,并随着越靠外侧温度越低,散热片3B的长度也变短,由此能够实现散热效率较高的无浪费的散热器1B。此外,散热片3B的长度与基座2的温度分布相对应,无需设定多余的长度,因此能够实现材料减少和轻量化。
专利文献1:日本特开2006-108239号公报
专利文献2:日本特开2003-008264号公报
然而,在电子设备内,供电子装置装配的装配空间一般多为长方体形状。因此,如图1所示的整体形状为立方体状的散热器1A相对于电子设备的装配性良好,相对于电子设备的空间利用效率较高。
然而,在散热片3A的长度全部相等的情况下,散热片3A的长度需要以基座2上温度最高的部位处的、最长的散热片3A为基准。因此,图1所示的散热器1A虽然空间利用效率高,然而由于需要形成多余长度的散热片3A,变得大型化,因而有着如下问题:需要很多材料,与此相伴地重量也增加了。
另一方面,图2所示的散热器1B虽然如上所述那样散热效率高,然而其正面视图呈山形形状。因此,在设有散热器1B的电子装置中,需要在电子设备内形成与散热器1B的形状相配合的装配空间,因而容易在电子设备内产生所谓的无效空间。由此,对于散热器1B来说,有着将其装配到电子设备中时空间利用效率较低的问题。
发明内容
本发明的总体目的在于解决上述现有技术的问题,提供一种改良且有用的散热器和电子装置以及电子装置的制造方法。
本发明的更为详细的目的在于提供一种能够同时实现空间利用效率的提高和散热效率的提高的散热器和电子装置以及电子装置的制造方法。
为了达成该目的,本发明中的散热器具有:基座,其与发热体热连接;和多个散热片,其从该基座的与所述发热体连接的连接面的相反侧面延伸出去而形成,该散热器的特征在于,在所述多个散热片中,配设于来自所述发热体的热传导温度高的部位的所述散热片形成得较长,并且随着所述热传导温度的降低而使所述散热片形成得较短,并且,所述散热片形成为朝向外侧弯折的形状。
此外,优选的是,在上述发明中的散热器的基础上,从冷却风的流动方向观察所述基座和所述散热片时,所述基座和所述散热片的外形形状形成为矩形。
此外,优选的是,在上述发明中的散热器的基础上,所述散热片形成为倒J字形状。
此外,为了达成上述目的,本发明中的散热器具有:基座,其与发热体热连接;和多个散热片,其从该基座的与所述发热体连接的连接面的相反侧面延伸出去而形成,该散热器的特征在于,在所述多个散热片中,配设于来自所述发热体的热传导温度高的部位的所述散热片形成得较长,并且随着所述热传导温度的降低而使所述散热片形成得较短,并且,所述散热片由从所述基座直立起来的直立部和从该直立部向外侧弯折成大致直角的水平部构成。
此外,优选的是,在上述发明中的散热器的基础上,从冷却风的流动方向观察所述基座和所述散热片时,所述基座和所述散热片的外形形状形成为矩形。
此外,优选的是,在上述发明中的散热器的基础上,在所述水平部的上表面设有信息显示部。
此外,优选的是,在上述发明中的散热器的基础上,所述散热片形成为倒L字形状。
此外,为了达成上述目的,本发明中的电子装置具有散热器,所述散热器包括:基座,其与作为发热体的电子元件热连接;和多个散热片,其从该基座的与所述发热体连接的连接面的相反侧面延伸出去而形成,在所述多个散热片中,配设于来自所述发热体的热传导温度高的部位的所述散热片形成得较长,并且随着所述热传导温度的降低而使所述散热片形成得较短,并且,所述散热片由从所述基座直立起来的直立部和从该直立部向外侧弯折成大致直角的水平部构成。
此外,优选的是,在上述发明中的电子装置的基础上,从冷却风的流动方向观察所述基座和所述散热片时,所述基座和所述散热片的外形形状形成为矩形。
此外,优选的是,在上述发明中的电子装置的基础上,在所述水平部的上表面设有信息显示部。
此外,优选的是,在上述发明中的电子装置的基础上,所述散热片形成为倒L字形状。
此外,为了达成上述目的,本发明中的电子装置的制造方法包括将具有多个散热片的散热器用运送装置搭载到作为发热体的电子元件上的工序,该电子装置的制造方法的特征在于,将所述散热器的所述多个散热片构成为:配设于来自所述发热体的热传导温度高的部位的所述散热片形成得较长,并且随着所述热传导温度的降低而使其长度形成得较短,并且,通过使所述散热片在中间位置向外侧弯折,从而具有从所述基座直立起来的直立部和从该直立部弯折成大致直角的水平部,并且,通过所述运送装置吸附所述水平部来将所述散热器运送到所述电子元件上。
根据本发明,使配设于来自发热体的热传导温度高的部位的散热片形成得较长,并且随着热传导温度的降低而使散热片的长度形成得较短,由此,各散热片的长度形成为适当的长度以对从发热体热传导来的热量进行散热,因此能够实现小型化的同时也提高了散热效率。此外,通过使散热风扇形成为朝向外侧弯折的形状,从而能够调整散热器整体的形状。由此,能够使散热器的形状与装配该散热器的装配空间的形状相对应,从而能够实现空间利用效率的提高。
附图说明
图1是示出作为第一现有例的散热器的主视图。
图2是示出作为第二现有例的散热器的主视图。
图3是示出散热器的基座的温度分布的图。
图4是示出作为本发明的一个实施例的电子装置以及散热器的立体图。
图5是示出作为本发明的一个实施例的散热器的主视图。
图6是示出作为本发明的一个实施例的散热器的第一变形例的主视图。
图7是示出作为本发明的一个实施例的散热器的第二变形例的主视图。
图8是用于说明作为本发明的一个实施例的电子装置的制造方法的图。
标号说明
10A、10B:半导体装置;20:半导体芯片;21:凸点(bump);22:安装电路板;30A~30C:散热器;31:基座;40~48:散热片;40a~48a:直立部;41b~47b:水平部;49:中央片;50~58:散热片;50a~58a:直立部;51b~57b:弯曲部;60:贴片机(chip mounter);61:回流(reflow)炉;62:散热器安装装置;64:运送装置;70:信息显示部。
具体实施方式
以下,参照附图对本发明的实施方式进行说明。
图4是示出作为本发明的一个实施例的电子装置10A以及散热器30A的立体图,图5是示出作为本发明的一个实施例的散热器30A的主视图。另外,在本实施例中,示出了采用半导体装置作为电子装置的例子并进行说明(以下,将电子装置称作半导体装置10A)。
首先,对半导体装置10A的整体结构进行说明。半导体装置10A大致由半导体芯片20、安装电路板22以及散热器30A等构成。半导体芯片20例如是高频器件或者功率器件等进行发热的电子元件。
该半导体芯片20在下部形成有凸点21并倒装式接合在安装电路板22上。由此,在安装状态下,半导体芯片20形成为与电路形成面相反侧的面(以下称作背面)位于上部的位置的状态。
散热器30A固定于该半导体芯片20的背面。具体来说,散热器30A使用热传导性高的粘着剂固定在半导体芯片20的背面。另外,将散热器30A固定到半导体芯片20上的固定方法并不限定于此,也可以采用通过导热片等进行接合而构成。
接着,对散热器30A的结构进行说明。散热器30A由基座31和多个(在本实施例中为8个)散热片40~47构成。该散热器30A由铝等热传导性高的金属材料形成。可以使基座31与散热片40~47一体形成,或者也可以通过在基座31上接合散热片40~47而形成。
基座31形成为平板形状,并形成为图中下表面与半导体芯片20热连接的结构。此外,在本实施例中,半导体芯片20构成为热连接在基座31的大致中央位置的结构。因而,半导体芯片20发明时的半导体芯片20的温度分布与图3所示的分布大致相等的分布。
散热片40~47形成为从基座31的与半导体芯片20连接的连接面的相反侧面延伸出来。所述散热片40~47各自的长度被设定为与图3所示的温度分布相对应的长度。
具体来说,在来自半导体芯片20的热传导温度较高的中央部分配设的散热片43、44形成得较长,并且随着热传导温度的降低(即随着靠向外侧)而使散热片形成得较短。
当设各散热片40~47的长度为L40~L47时,位于中央位置的散热片43、44的长度L43、L44被设定为相等(L43=L44),比它们靠向外侧的散热片40~42、45~47的各长度L40~L42、L45~L47满足L43>L42>L41>L40、以及L44>L45>L46>L47。
根据该结构,将散热效率较高的长散热片43、44配置于基座31的温度较高的部位,并随着靠向外侧而温度降低使散热片40~42、45~47的长度缩短,从而能够实现散热效率高且没有浪费的散热器30A。此外,散热片40~47的长度与基座31的温度分布对应,不存在设定多余长度的情况,因此能够实现材料的减少和轻量化。
进而,本实施例所述的散热器30A具有如下特征:在散热片40~47内,散热片41~46形成为朝向外侧弯折的形状。具体来说,在本实施例中,通过将各散热片41~46的中途位置呈大致直角地弯折,形成有作为处于从基座31直立起来的状态的部位的直立部41a~46a,以及从所述直立部41a~46a向外侧沿大致直角方向(水平方向)延伸出去的水平部41b~46b。通过如此形成直立部41a~46a和水平部41b~46b,各散热片41~46形成为倒L字形状。
在本实施例中,在各散热片41~46上形成直立部41a~46a和水平部41b~46b时,是在基座31上形成平板状的散热片41~46后通过冲压加工等弯折而形成的。然而,也可以采用如下方法:预先通过铸造或者机械加工形成了具有直立部41a~46a和水平部41b~46b的散热片41~46,然后将所述散热片41~46接合到基座31上。
其中,着眼于各散热片41~46的弯折位置。在本实施例中,通过在散热片41~46上形成直立部41a~46a和水平部41b~46b,从而在从冷却风的流动方向观察基座31和散热器30A时,即在图5所示的主视图状态下,散热器30A的外形形状形成为矩形。
此处所述散热器30A的外形如图5所示,由基座31在图5中的接触面、两侧面、散热片40、47的直立部40a、47a、各水平部41b~46b的前端部、以及水平部43b、44b形成,是由图5中的单点划线所示出的形状。
具体来说,基座31的图5中左侧面以使散热片40的直立部40a、以及水平部41b~43b的前端部位于同一平面中而构成。此外,基座31的图5中右侧面以使散热片47的直立部47a、以及水平部44b~46b的前端部位于同一平面中而构成。进而,水平部43b和水平部44b构成为处于同一平面中的位置。
由此,在从正面观察基座31和散热器30A的情况下,散热器30A的外形形状为矩形。此外,通过使如此地正面观察到的散热器30A的外形形状形成为矩形形状,从而如图4所示使散热器30A的整体形状形成为长方体形状。
如上所述,在装配有设了散热器30A的半导体装置10A的电子设备中,一般来说半导体装置10A的装配空间为长方体形状的情况较多。因而,根据本实施例的结构,使散热器30A的整体形状形成为长方体形状,从而使具有散热器30A的半导体装置10A装配到电子设备的装配性良好,并且相对于电子设备的空间利用效率较高。
具体来说,假设之前说明过的图2所示的现有技术所述的散热器1B的散热条件、散热片数以及发热体(电子元件5,半导体芯片20)的发热量、散热器的材料等与本实施例所述的散热器30A相同的话,散热器1B需要图2中箭头H2所示的高度。
与此相对地,本实施例所述的散热器30A形成为将散热片41~46弯折后的形状,因此其高度为图5中箭头H1所示的高度。在此,将各高度H1、H2进行比较的话,可以明确H1<H2。进而,散热器1B以及散热器30A的宽度尺寸W大致相同。因而,根据本实施例所述的散热器30A,与以往相比实现了小型化,同时能够将散热效率维持得较高。
此外,如前所述,在装配有半导体装置10A的电子设备内,装配电子装置10A的装配空间多为长方体形状。因而,通过如本实施例所示使散热器30A的整体形状形成为长方体形状,从而能够提高对电子设备的空间利用效率,能够抑制电子设备内所谓无效空间的产生,有利于电子设备的小型化。
如上所述,本实施例所述的散热器30A的各散热片40~48的各自的长度形成为用于对来自半导体芯片20的热量进行散发的适当长度,因此能够实现小型化的同时提高了散热效率。此外,通过使散热片41~47形成为朝向外侧弯折的形状,并适当地选择弯折位置,能够对散热器30A的整体形状进行调整。并且,通过如本实施例所示使整体形状形成为长方体形状,从而能够使散热器30A容易地对应于电子设备的装配空间的形状。这样,本实施例所述的散热器30A在提高了散热效率的同时,也能够同时实现空间利用效率的提高。
此外,通过如本实施例所示在散热片41~47上形成水平部41b~47b,从而在俯视散热器30A的情况下,使设于基座31中央的散热片43、44的水平部43b、44b形成为中央存在槽的、比较宽的平面。另外,在本实施例中形成为在水平部44b上配设有信息显示部70的结构。
该信息显示部70例如是印制有半导体装置10A的产品信息等的封条,贴附在水平部44b上。通常,半导体装置的该种产品信息在具有散热器1A、1B的现有半导体装置中不能够设于其上表面上(参照图1和图2)。因而,需要设置在电子设备5的侧面或底面,有着识别性差的问题。
然而,在本实施例中,即使在半导体装置10A上设置散热器30A,由于其上部存在水平部43b、44b,因此也能够配置信息显示部70。因此,通过俯视半导体装置10A即可确认信息显示部70,因此能够提高信息显示部70的识别性。
另外,在上述的实施例中,并非全部的散热片40~47均形成为弯折形状,而是仅对散热片41~46进行弯折的结构。即,设于凸点21两端部的散热片40和散热片47仅具有直立部40a、47a,不具有水平部。
这是因为,在本实施例中要使散热片40、47与基座31的侧面共面。因此,在基座31上具有富余空间的情况下,也可以在散热片40、47上形成水平部。此外,在图4和图5的结构中,也可以在散热片40、47上形成朝向内侧弯折的水平部。
图6和图7示出了上述的半导体装置10A以及散热器30A的变形例。另外,在图6和图7中,对与图4和图5的结构对应的结构标以相同符号并省略其说明。
图6所示第一变形例所述的散热器30B的特征在于,在基座31的中央部形成不具有水平部的中央散热片49。如该图所示,在基座31上有着奇数个(在本变形例中为9个)散热片的配设空间时,构成为在基座31的中央位置存在中央散热片49的形成位置的结构。
该情况下,由于要使散热器30B的形状整体形成为长方体形状,因此可以使辅助散热片49的形状形成为该图所示的不具有水平部的形状。此时,虽然也可以考虑到重视与电子设备的装配性而不设置中央散热片49,然而与设置中央散热片49的结构相比,能够提高散热器30B整体的散热特性,因此是有利的。
图7所示的第二变形例所述的半导体装置10B和散热器30C的特征在于:从直立部51a~56a向外侧延伸出去的部分形成有弯曲部51b~56b。在上述的实施例中,形成为从直立部41a~46a向外侧延伸出水平部41b~46b。
然而,在各散热片中,从直立部向外侧(也包括向内侧的情况)延伸出的部分的形状并不限定于水平形状,也可以是如本变形例所示的弯曲部51b~56b。根据该结构,散热片51~56在正面观察散热器30C的状态下呈倒J字形状。
另外,从直立部向外侧(也包括向内侧的情况)延伸出的部分的形状能够根据散热片的长度或者装配散热器的装配空间的大小等进行适当变更。
接着,参照图8对图4所示的半导体装置10A的制造方法进行说明。
另外,在图8中,与图4和图5所示的结构相同的结构标以相同符号,并省略其说明。此外,本实施例所述的制造方法的特征在于从将半导体芯片20搭载于安装电路板22上的贴片工序开始到将散热器30A安装到半导体芯片20上的安装工序,因此对所述各工序进行说明,并省略其他制造工序的说明。
图8示出了半导体装置10A的生产线。搭载半导体芯片20的安装电路板22由传送带65沿图中箭头方向进行运送。此外,该图所示的生产线通过将贴片机60、回流炉61以及散热器安装装置62沿该图所示箭头的顺序依次设置到传送带65上而构成。
贴片机60具有开口夹(collet)63。该开口夹63吸附半导体芯片20,将该半导体芯片20运送到安装电路板22上的预定搭载位置。并且,使开口夹63下降,将半导体芯片20通过倒置(face down)搭载到安装电路板22上。此时,半导体芯片20并未由凸点21进行最终固定,而是形成为相对于安装电路板22临时固定的状态。另外,贴片机60将半导体芯片20以外的电子部件也一并搭载到安装电路板22上。
如上所述,将半导体芯片20和其他电子部件搭载到安装电路板22上后,经安装电路板22通过传送带65进行运送,并装配在回流炉61内。该回流炉61用于进行加热处理,由此使凸点21(由钎料构成)熔融,将半导体芯片20焊接在安装电路板22上。此外,其他电子部件也同样地被焊接在安装电路板22上。由此,半导体芯片20和其他电子部件形成为最终固定在安装电路板22上的状态。
上述的通过回流炉61进行的加热处理结束后,在对安装电路板22进行冷却处理后,通过传送带65运送到散热器安装装置62。该散热器安装装置62进行将散热器30A安装到半导体芯片20上的处理。
具体来说,散热器安装装置62具有运送装置64,散热器30A在被运送装置64保持的状态下被运送到半导体芯片20的背面位置,接着散热器安装装置62使运送装置64下降。在该半导体芯片20的背面(用于安装散热器30A的面)上涂布有未图示的热传导性高的粘着剂。由此,散热器30A经由粘着剂安装到半导体芯片20上。
此时,运送装置64与开口夹63相同地在前端部具有吸附面,散热器30A形成为以被吸附在运送装置64上的方式被保持的结构。如前所述,散热器30A在其上部存在水平部43b、44b。因此,能够以运送装置64的吸附面对水平部43b、44b进行真空吸附,能够通过运送装置64运送散热器30A。
与此相对地,图1和图2所示的散热器1A、1B由于是构成为散热片3A、3B朝向上方延伸的结构,因此不能进行真空吸附。因此,需要把持散热器1A、1B的侧部等,从而使得组装效率降低。
在本实施例所述的制造方法中,能够如上所述地将散热器30A与半导体芯片20同样地从上部以运送装置64进行吸附,并在该状态下进行运送并搭载到半导体芯片20上。因此,与以往相比散热器30A的运送处理变得容易,能够提高半导体装置10A的制造效率。
另外,本发明并不限定于上述的实施例,能够广泛地应用于具有散热片的散热器以及具有该散热器的电子装置中。
Claims (12)
1.一种散热器,该散热器具有:
基座,其与发热体热连接;和
多个散热片,其从该基座的与所述发热体连接的连接面的相反侧面延伸出去而形成,该散热器的特征在于,
在所述多个散热片中,配设于来自所述发热体的热传导温度高的部位的所述散热片形成得较长,并且随着所述热传导温度的降低而使所述散热片形成得较短,
并且,所述散热片形成为朝向外侧弯折的形状。
2.根据权利要求1所述的散热器,其特征在于,
从冷却风的流动方向观察所述基座和所述散热片时,所述基座和所述散热片的外形形状形成为矩形。
3.根据权利要求1所述的散热器,其特征在于,
所述散热片形成为倒J字形状。
4.一种散热器,其具有:
基座,其与发热体热连接;和
多个散热片,其从该基座的与所述发热体连接的连接面的相反侧面延伸出去而形成,该散热器的特征在于,
在所述多个散热片中,配设于来自所述发热体的热传导温度高的部位的所述散热片形成得较长,并且随着所述热传导温度的降低而使所述散热片形成得较短,
并且,所述散热片由从所述基座直立起来的直立部和从该直立部向外侧弯折成大致直角的水平部构成。
5.根据权利要求4所述的散热器,其特征在于,
从冷却风的流动方向观察所述基座和所述散热片时,所述基座和所述散热片的外形形状形成为矩形。
6.根据权利要求4所述的散热器,其特征在于,
在所述水平部的上表面设有信息显示部。
7.根据权利要求4所述的散热器,其特征在于,
所述散热片形成为倒L字形状。
8.一种电子装置,其特征在于,
该电子装置具有散热器,
所述散热器包括:
基座,其与作为发热体的电子元件热连接;和
多个散热片,其从该基座的与所述发热体连接的连接面的相反侧面延伸出去而形成,
在所述多个散热片中,配设于来自所述发热体的热传导温度高的部位的所述散热片形成得较长,并且随着所述热传导温度的降低而使所述散热片形成得较短,
并且,所述散热片由从所述基座直立起来的直立部和从该直立部向外侧弯折成大致直角的水平部构成。
9.根据权利要求8所述的电子装置,其特征在于,
从冷却风的流动方向观察所述基座和所述散热片时,所述基座和所述散热片的外形形状形成为矩形。
10.根据权利要求8所述的电子装置,其特征在于,
在所述水平部的上表面设有信息显示部。
11.根据权利要求8所述的电子装置,其特征在于,
所述散热片形成为倒L字形状。
12.一种电子装置的制造方法,该电子装置的制造方法包括将具有多个散热片的散热器用运送装置搭载到作为发热体的电子元件上的工序,该电子装置的制造方法的特征在于,
将所述散热器的所述多个散热片构成为:配设于来自所述发热体的热传导温度高的部位的所述散热片形成得较长,并且随着所述热传导温度的降低而使其长度形成得较短,并且,通过使所述散热片在中间位置向外侧弯折,从而具有从所述基座直立起来的直立部和从该直立部弯折成大致直角的水平部,
并且,通过所述运送装置吸附所述水平部来将所述散热器运送到所述电子元件上。
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CN105916353A (zh) * | 2016-05-17 | 2016-08-31 | 联想(北京)有限公司 | 一种散热装置、直立型系统支架、处理设备及电子设备 |
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CN105916353A (zh) * | 2016-05-17 | 2016-08-31 | 联想(北京)有限公司 | 一种散热装置、直立型系统支架、处理设备及电子设备 |
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