JP2019075538A - 半導体の熱伝導及び放熱構造 - Google Patents
半導体の熱伝導及び放熱構造 Download PDFInfo
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
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Abstract
Description
12 熱伝導放熱装置
14 上面
16 下面
18 上導電銅箔
181 下銅箔
20 半導体素子
22 載置ベース
24 第1の放熱シート
26 第1の表面
28 第2の表面
30 凸部
302 ギャップ
32 第1の端
34 第2の端
36 ヒートブリッジ
38 リベット
40 折り曲げ部
42 第2の放熱シート
44 第1の端
46 第2の端
48 リベット
54 金属ベース
56 結合部材
57 外部放熱体
58 熱伝導体
60 第1の熱伝導部材
601 表面
62 第2の熱伝導部材
621 表面
66 リベット
68 基板放熱シート
72 基板載置ベース
Claims (10)
- 対向する上面と下面とを含み、該上面に上導電銅箔が設けられ、該上導電銅箔の上に半導体素子が設けられている基板と、
第1の放熱シートと、高熱伝導リベットとを含み、該第1の放熱シートは厚さ方向において対向する第1の表面と第2の表面とを含み、該高熱伝導リベットは該第1の放熱シートを該上導電銅箔に熱伝導可能に結合されることで該第1の表面と第2の表面とを放熱面として形成させている熱伝導放熱装置と、
を備えることを特徴とする半導体の熱伝導及び放熱構造。 - 該熱伝導放熱装置は、熱伝導放熱装置載置ベースに位置し、該第1の放熱シートと該熱伝導放熱装置載置ベースとの間には複数の凸部が形成されており、該複数の凸部は、該熱伝導放熱装置載置ベースから該第1の放熱シートに向けて突出し、若しくは該第1の放熱シートから該熱伝導放熱装置載置ベースに向けて突出することで、該第1の放熱シートと該熱伝導放熱装置載置ベースとの間には、該複数の凸部によって隔てられたギャップが形成されていることを特徴とする請求項1に記載の半導体の熱伝導及び放熱構造。
- 該熱伝導放熱装置は少なくとも1つの第2の放熱シートをさらに含み、該第1の放熱シートは、離間した第1の端と第2の端とを有し、該第2の放熱シートは、離間した第1の端と第2の端とを含み、該第2の放熱シートの第1の端と第2の端とはそれぞれ該第1の放熱シートの第1の端と第2の端とにリベット結合され、該第2の放熱シートと該第1の放熱シートとは該厚さ方向においてギャップが形成されており、該第1、第2の放熱シートのそれぞれは、離間した複数の凸部を有し、該第1の放熱シートの凸部と該第2の放熱シートの凸部は同一方向へ突出し、該第1の放熱シートの凸部は、該第2の放熱シートに当接され、該第2の放熱シートの凸部は該載置ベースに当接されていることを特徴とする請求項2に記載の半導体の熱伝導及び放熱構造。
- 該熱伝導放熱装置は、高熱伝導材料からなる熱伝導体をさらに含み、該熱伝導体の両端面はそれぞれ金属製の第1の熱伝導部材と第2の熱伝導部材とに結合され、該第1の熱伝導部材は、該高熱伝導リベットにより該基板の上導電銅箔に結合され、該第2の熱伝導部材は、他のリベットにより該第1の放熱シートに結合されていることを特徴とする請求項1に記載の半導体の熱伝導及び放熱構造。
- 該第1の放熱シートは、ヒートブリッジにより該基板の上導電銅箔に結合されていることを特徴とする請求項1に記載の半導体の熱伝導及び放熱構造。
- 基板放熱シートをさらに含み、該高熱伝導リベットは該基板放熱シートを該基板の下面にリベット固定することで、該基板放熱シートと該基板との間にギャップが形成され、該基板放熱シートの上表面または下表面、若しくは上、下表面に離間した凸部が複数形成されていることを特徴とする請求項1に記載の半導体の熱伝導及び放熱構造。
- 該基板放熱シートと該第1の放熱シートとは一体に形成されていることを特徴とする請求項6に記載の半導体の熱伝導及び放熱構造。
- 該熱伝導放熱装置は少なくとも1つの第2の放熱シートをさらに含み、該第1の放熱シートは、離間した第1の端と第2の端とを有し、該第2の放熱シートは、離間した第1の端と第2の端とを含み、該第2の放熱シートの第1の端と第2の端とはそれぞれ該第1の放熱シートの第1の端と第2の端とにリベット結合され、該第1の放熱シートまたは第2の放熱シートは折り曲げ部を含み、該第2の放熱シートと該第1の放熱シートとは該厚さ方向においてギャップが形成され、該折り曲げ部は傾斜状または直角状であることを特徴とする請求項1に記載の半導体の熱伝導及び放熱構造。
- 該少なくとも1つの第2の放熱シートは、複数の第2の放熱シートを含み、隣接した第2の放熱シートの間にはギャップが形成されていることを特徴とする請求項8に記載の半導体の熱伝導及び放熱構造。
- 該隣接した第2の放熱シートの間には、該ギャップ内に位置する離間した凸部が複数形成されていることを特徴とする請求項9に記載の半導体の熱伝導及び放熱構造。
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TW106135166A TWI645588B (zh) | 2017-10-13 | 2017-10-13 | 半導體的導熱及散熱結構 |
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US11632860B2 (en) * | 2019-10-25 | 2023-04-18 | Infineon Technologies Ag | Power electronic assembly and method of producing thereof |
CN212628972U (zh) * | 2020-07-10 | 2021-02-26 | 瑞声科技(新加坡)有限公司 | 移动终端 |
Citations (4)
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JP2001189583A (ja) * | 1999-11-17 | 2001-07-10 | Samsung Electronics Co Ltd | 半導体モジュールにヒートシンクを組み付ける設備及びその組み付け方法 |
JP2003324214A (ja) * | 2002-04-30 | 2003-11-14 | Omron Corp | 発光モジュール |
JP2010238904A (ja) * | 2009-03-31 | 2010-10-21 | Nec Corp | 電子装置、電子装置の冷却方法、電子装置の冷却ユニットおよび電子装置冷却ユニットの製造方法 |
JP2014203855A (ja) * | 2013-04-01 | 2014-10-27 | 三菱電機株式会社 | 電子部品の放熱構造 |
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CN201985161U (zh) * | 2011-01-05 | 2011-09-21 | 芃博科技有限公司 | 堆栈式散热模组 |
TWI552395B (zh) * | 2014-01-22 | 2016-10-01 | 胡文松 | 高照度表面黏著型led的散熱結構 |
US9541273B2 (en) * | 2014-05-22 | 2017-01-10 | Wen-Sung Hu | Heat dissipation structure of SMD LED |
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JP2001189583A (ja) * | 1999-11-17 | 2001-07-10 | Samsung Electronics Co Ltd | 半導体モジュールにヒートシンクを組み付ける設備及びその組み付け方法 |
JP2003324214A (ja) * | 2002-04-30 | 2003-11-14 | Omron Corp | 発光モジュール |
JP2010238904A (ja) * | 2009-03-31 | 2010-10-21 | Nec Corp | 電子装置、電子装置の冷却方法、電子装置の冷却ユニットおよび電子装置冷却ユニットの製造方法 |
JP2014203855A (ja) * | 2013-04-01 | 2014-10-27 | 三菱電機株式会社 | 電子部品の放熱構造 |
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US20190115276A1 (en) | 2019-04-18 |
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TWI645588B (zh) | 2018-12-21 |
TW201916414A (zh) | 2019-04-16 |
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