CN1964614B - 电路装置尤其是变频器 - Google Patents

电路装置尤其是变频器 Download PDF

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CN1964614B
CN1964614B CN2006101365130A CN200610136513A CN1964614B CN 1964614 B CN1964614 B CN 1964614B CN 2006101365130 A CN2006101365130 A CN 2006101365130A CN 200610136513 A CN200610136513 A CN 200610136513A CN 1964614 B CN1964614 B CN 1964614B
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circuit
frequency converter
circuit board
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CN1964614A (zh
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克里斯蒂安·格布尔
莱纳·波普
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Semikron GmbH and Co KG
Semikron Elektronik GmbH and Co KG
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Abstract

电路装置，尤其是变频器(10)，具有一电路模块(12)，所述电路模块与一电路板(14)相联接并且与一散热体(16)热传导地相连接，其特征在于，电路模块(12)具有一柔性的、电绝缘的塑料薄膜(18)，该塑料薄膜在其一侧上具有一薄的电路结构化的逻辑金属层(20)并且在对置的一侧上具有一电路结构化的功率金属层(22)，该功率金属层以一接触边缘(26)与电路板(14)的一边缘部段(28)相接触，其中柔性的电路模块(12)折弯地离开电路板(14)，功率半导体芯片(24)与电路结构化的功率金属层(22)相接触，并且在散热体(16)上固定有一基片(30)，该基片构成有一用来与功率半导体芯片(24)接触的电路结构(32)。

Description

电路装置尤其是变频器
技术领域
本发明涉及一种电路装置尤其是变频器，具有一电路模块，所述电路模块与一电路板相联接，并与一散热体相连接。
背景技术
按现有技术，变频器是由TO′s或功率半导体模块构成的。对此总是要考虑电路平面和散热平面。标准模块总是这样构成，即电路平面和散热平面是彼此平行设置的。由于散热平面和电路平面彼此平行设置的结构，变频器在这个所谓的顺序排列方案(
Figure GSB00000143066500011
)中只能受限制地实现，因为它们构造得太宽了，因此是以一相对较大的配电柜宽度为前提的，其售价一定是很高的。但如果变频器这样设置，即它设置为相对狭长的顺序排列方式，以适应被变频器所替代的接触器的构造尺寸，就会出现热流动即热传导的问题，因为它一定会围绕一角落传导。这意味着散热效果差。
发明内容
按照对现有技术的了解，本发明的目的是，提供一种开头所述类型的电路装置尤其是变频器，其构造简单且可实现最佳的散热。
按本发明此目的根据本发明如此实现，即变频器具有一柔性的、电绝缘的塑料薄膜，该塑料薄膜在其一侧上具有一薄的电路结构化(schaltstrukturiert)的逻辑金属层并且在对置的第二侧上具有一电路结构化的功率金属层，该功率金属层以一接触边缘与电路板的一边缘部段相接触，其中柔性的电路模块折弯地离开电路板，功率半导体芯片与电路结构化的功率金属层相接触，在散热体上固定有一基片，该基片具有一用来与功率半导体芯片接触的电路结构。
本发明具有的优点是，柔性的电路模块在为其设置的位置上是可折弯的。这意味着，散热平面和电路平面可彼此围成一任意的角度。本发明一重要的优点在于，具有与电路结构化的功率金属层相接触的功率半导体芯片的电路模块能够与电路板在一共同的平面上用一已知的技术例如钎焊或焊接技术彼此连接在一起。随后这两个部件彼此偏转到一任意的、预先规定的角度位置。从而实现了，变频器的结构相对小，适合于顺序排列方案，并伴随着变频器有效的散热。
按本发明，柔性的电路模块相对于电路板来说具有较小的平面尺寸。此柔性的电路模块与电路板例如围成一90°的角度。
基片优选具有与柔性的电路模块的平面尺寸相配的平面尺寸。
散热体可以具有一折弯的金属片，其具有一第一片材部段和一第二片材部段，其中基片固定在第一片材部段上，第二片材部段可具有与电路板相配的平面尺寸。在第一片材部段上固定有一散热元件。此散热元件可例如构成有散热片。
附图说明
从在附图中描述的本发明的顺序排列的电路装置尤其是变频器与按现有技术的一变频器相比可得出其它的细节、特征和优点。
图1在一正视图中不按比例地示意示出了本发明的按顺序排列方案的电路装置尤其是变频器的构造，以及
图2在一与图1相似的视图中不按比例地示意示出了一已知的按顺序排列方案的变频器。
具体实施方式
图1示意示出了按本发明的电路装置尤其是变频器10的结构，所述变频器具有一电路模块12，所述电路模块与一电路板14相联接，并与一散热体16热传导地相连接。
电路模块12具有一柔性的、电绝缘的塑料薄膜18，在其一侧上具有一电路结构化的薄的逻辑金属层20，并且在对置的第二侧上具有一电路结构化的功率金属层22。功率半导体芯片24与功率金属层22相接触。
电路结构化的功率金属层22以一接触边缘26与电路板14的一边缘部段28相接触。在此，功率触点和/或辅助触点相连接。所述接触通过在电路模块12的初始状态下的钎焊或焊接实现，其中电路模块12和电路板14几乎定位在一共同的平面中。在接触后，电路模块12折弯后离开电路板14的平面，因此电路模块12和电路板14围成一个角度A。此角度A例如是90°。
在散热体16上固定有一基片30，该基片在一侧上构成有一电路结构32，用来与功率半导体芯片24相接触。在基片30的对置的第二侧上具有一金属层34，基片30借助此金属层热传导良好地固定在散热体16上。
散热体16是由一折弯的金属片36构成，其具有一第一片材部段38和一第二片材部段40。在第一片材部段38上固定有基片30。第二片材部段40具有一与电路板14的平面尺寸相配的平面尺寸。在第一片材部段38上热传导地固定有一散热元件42，该散热元件构成有散热片。
用附图标记44标出了变频器10的一壳体，其被部分地示出。按本发明的变频器10具有这样的外尺寸，即它应最佳地适合所述的顺序排列方案。
图2在一与图1相似的视图中示出了一种已知的按顺序排列方案的变频器10的结构，其中相同的构件用与图1相同的附图标记标识，因此可以不必将所有这些与图2相关的构件再详细示出。图2特别清楚地示出了折弯的、不充分的热流动，即电路模块12的热传导。此折弯的热传导通过箭头46表示出来。
附图标记清单
10    变频器
12    电路模块(属于10)
14    电路板(属于10)
16    散热体(属于10，用于12)
18    塑料薄膜(属于12)
20    结构化的逻辑金属层(在18上)
22    结构化的功率金属层(在18上)
24    功率半导体芯片(在22上)
26    接触边缘(属于22)
28    边缘部段(属于14)
30    基片(用于24，在16上)
32    电路结构(在30上，用于24)
34    金属层(在30上，用于16)
36    金属片(属于16)
38    第一片材部段(属于36)
40    第二片材部段(属于36)
42    散热元件(在38上)
44    壳体(属于10)
46    箭头/热传导/热流动

Claims (6)

1.变频器(10)，具有一电路模块(12)，所述电路模块与一电路板(14)相联接并且与一散热体(16)热传导地相连接，其特征在于，电路模块(12)具有功率半导体芯片(24)和一柔性的、电绝缘的塑料薄膜(18)，该塑料薄膜在其一侧上具有一薄的电路结构化的逻辑金属层(20)并且在对置的一侧上具有一电路结构化的功率金属层(22)，该功率金属层以一接触边缘(26)与电路板(14)的一边缘部段(28)相接触，其中柔性的电路模块(12)折弯地离开电路板(14)，功率半导体芯片(24)与电路结构化的功率金属层(22)相接触，并且在散热体(16)上固定有一基片(30)，该基片构成有一用来与功率半导体芯片(24)接触的电路结构(32)。
2.按权利要求1所述的变频器(10)，其特征在于，柔性的电路模块(12)相对于电路板(14)具有较小的平面尺寸。
3.按权利要求1所述的变频器(10)，其特征在于，柔性的电路模块(12)与电路板(14)形成一个90°的角度。
4.按权利要求1所述的变频器(10)，其特征在于，基片(30)具有与柔性的电路模块(12)的平面尺寸相配的平面尺寸。
5.按权利要求1所述的变频器(10)，其特征在于，散热体(16)具有一折弯的金属片(36)，此金属片具有一第一片材部段(38)和一第二片材部段(40)，其中在第一片材部段(38)上固定有基片(30)，并且第二片材部段(40)具有与电路板(14)相配的平面尺寸。
6.按权利要求5所述的变频器(10)，其特征在于，在第一片材部段(38)上固定有一散热元件(42)。
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Publication number Priority date Publication date Assignee Title
DE102007044143A1 (de) * 2007-09-18 2009-04-02 Behr-Hella Thermocontrol Gmbh Vorrichtung zur Ansteuerung eines elektrischen Verbrauchers, insbesondere eines Gebläsemotors
CN102271480A (zh) * 2010-06-04 2011-12-07 施耐德东芝换流器欧洲公司 电气设备及用于电气设备的底座
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US9825437B2 (en) * 2014-06-04 2017-11-21 Hamilton Sundstrand Corporation Three-dimensional power distribution interconnect structure
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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6040624A (en) * 1997-10-02 2000-03-21 Motorola, Inc. Semiconductor device package and method

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4105152A1 (de) * 1991-02-20 1992-09-03 Export Contor Aussenhandel Elektronische schaltungsanordnung
DE9109911U1 (zh) * 1991-08-10 1992-12-10 Fritz A. Seidel Elektro-Automatik Gmbh, 4000 Duesseldorf, De
SE9203533L (sv) * 1992-11-24 1994-05-24 Asea Brown Boveri Anordning för kylning av skivformiga kraftelektronikelement jämte skivformigt kraftelektronikelement avsett att monteras i sådan kylanordning
DE19617055C1 (de) * 1996-04-29 1997-06-26 Semikron Elektronik Gmbh Halbleiterleistungsmodul hoher Packungsdichte in Mehrschichtbauweise
US6466447B2 (en) * 2000-02-24 2002-10-15 Denso Corporation Electronic control unit having flexible wires connecting connector to circuit board
DE10121970B4 (de) * 2001-05-05 2004-05-27 Semikron Elektronik Gmbh Leistungshalbleitermodul in Druckkontaktierung
US7071420B2 (en) * 2002-12-18 2006-07-04 Micron Technology, Inc. Methods and apparatus for a flexible circuit interposer
DE10316355C5 (de) * 2003-04-10 2008-03-06 Semikron Elektronik Gmbh & Co. Kg Leistungshalbeitermodul mit flexibler äusserer Anschlussbelegung
DE102004018476B4 (de) * 2004-04-16 2009-06-18 Infineon Technologies Ag Leistungshalbleiteranordnung mit kontaktierender Folie und Anpressvorrichtung
DE102004019435A1 (de) * 2004-04-19 2005-11-03 Siemens Ag An einer Kühlrippe angeordnetes Bauelement
DE102004019442A1 (de) * 2004-04-19 2005-10-06 Siemens Ag An planarer Verbindung angeordneter Kühlkörper

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6040624A (en) * 1997-10-02 2000-03-21 Motorola, Inc. Semiconductor device package and method

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