CN103687303A - 功率半导体器件和pcb 的联接组件及其制造方法 - Google Patents

功率半导体器件和pcb 的联接组件及其制造方法 Download PDF

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CN103687303A
CN103687303A CN201310412928.6A CN201310412928A CN103687303A CN 103687303 A CN103687303 A CN 103687303A CN 201310412928 A CN201310412928 A CN 201310412928A CN 103687303 A CN103687303 A CN 103687303A
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power semiconductor
pcb
connecting elements
coupling assembly
fixed cell
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CN103687303B (zh
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尹普铉
许瑉
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LS Electric Co Ltd
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Abstract

本发明提供功率半导体器件和印刷电路板（PCB）的联接组件及其制造方法。所述功率半导体器件和印刷电路板（PCB）的联接组件包括：PCB；功率半导体器件，其包括被电连接至布置在所述PCB上的电路图案的多个引脚；连接构件，其被布置在所述功率半导体器件上方，所述连接构件由导电材料形成；主固定单元，其将所述功率半导体器件固定到所述PCB上；以及壳体，其被布置在所述PCB的外部。因此，可以提高功率半导体器件和PCB之间的联接力和电效率至发热量。此外，热量可以通过所述连接构件而被更快速地驱散以提高冷却效果。

Description

功率半导体器件和PCB 的联接组件及其制造方法
技术领域
本公开涉及功率半导体器件和印刷电路板（PCB）的联接组件，并且更特别地，涉及功率半导体器件和PCB的联接组件，其中功率器件被布置在连接构件与PCB之间以使所述连接构件朝向所述PCB挤压，从而牢固地将所述功率半导体器件固定到所述PCB上并且提高了冷却效率和电效率。
背景技术
根据现有技术的使用在诸如功率转换器件的电气/电子器件中的功率半导体器件可以具有如下结构：通过使用螺栓或夹子而将功率半导体器件固定在壳体的内部，并且然后将所述功率半导体器件的引脚连接至PCB；或者可以具有如下结构：通过使用夹子或螺栓而将功率半导体器件固定到PCB上，而不直接附接至壳体的内部。
图1是图示出根据现有技术的功率半导体器件被联接至PCB的联接组件的示例的视图。通过使用固定螺栓40将功率半导体器件10附接至壳体30的内部。功率半导体器件10的引脚11通过焊接被连接至PCB20。根据上述结构，因为功率半导体器件10和壳体30彼此直接接触，所以可以在散热和冷却方面改进功率半导体器件。
然而，因为功率半导体器件10的引脚11通过焊接被连接至PCB20，所以组件可以容易被组装，但是在振动方面薄弱。
图2是图示出根据现有技术的功率半导体器件50被联接至PCB60的联接组件的示例的视图。不同于前述的根据现有技术的联接组件，功率半导体器件50被附接到PCB60的上部。此处，功率半导体器件50被挤压且通过使用固定螺栓和夹子80被固定在PCB60的顶面上。
因此，尽管功率半导体器件50更牢固地固定到PCB60上，因为功率半导体器件未直接接触壳体（未显示），所以可能使冷却效率变劣。
发明内容
实施例提供一种功率半导体器件和PCB的联接组件，在所述联接组件中功率半导体器件牢固地被固定到PCB上并且还提高了散热效率。
实施例还提供了一种功率半导体器件和PCB的联接组件，电流流经的通道在面积上增加以提高功率半导体器件的电效率并且减少发热量。
在一个实施例中，一种功率半导体器件和印刷电路板（PCB）的联接组件包括：PCB；功率半导体器件，其包括被电连接至布置在所述PCB上的电路图案的多个引脚；连接构件，其被布置在所述功率半导体器件的上方，所述连接构件由导电材料形成；主固定单元，其将所述功率半导体器件固定到所述PCB上；以及壳体，其被布置在所述PCB的外部，其中所述连接构件包括：平板部，其接触所述功率半导体器件的上部；以及翼部，其从所述平板部的端部向下延伸，其中所述翼部的端部导电地接触所述功率半导体器件的引脚。
可以设置至少一个翼部，并且多个引脚可以导电地接触一个翼部。
所述翼部的垂直延伸角度可以比所述功率半导体器件的所述引脚中的每个引脚的垂直延伸角度更接近于垂直状态。
所述平板部可以与所述功率半导体器件的顶面表面接触。
接地件可以被布置在所述PCB上，并且所述连接构件可以延伸至所述接地件。
所述联接组件可以进一步包括挤压并且固定所述连接构件至所述接地件的辅固定单元。
在另一个实施例中，一种用于制造根据实施例的功率半导体器件和PCB的联接组件的方法包括：将所述功率半导体器件焊接到所述PCB上以将所述功率半导体器件联接到所述PCB上；将所述连接构件布置在所述功率半导体器件的上部上；将在其上部布置有连接构件的所述PCB布置在所述壳体内；并且通过使用所述主固定单元来将所述连接构件、所述PCB以及所述壳体彼此联接。
所述方法可以进一步包括：在将所述连接构件布置在所述功率半导体器件的所述上部上与将在其上部布置有连接构件的所述PCB布置在所述壳体内之间，通过使用所述辅固定单元来将所述连接构件联接至所述接地件，其中所述辅固定单元可以包括焊接和固定螺栓中的至少一种。
在附图和下面的说明中给出了一个或多个实施例的细节。通过本说明书和附图以及权利要求书其他特征将是显而易见的。
附图说明
图1是图示出根据现有技术的功率半导体器件被联接至PCB的联接组件的示例的视图。
图2是图示出根据现有技术的功率半导体器件被联接至PCB的联接组件的另一个示例的视图。
图3是图示出根据实施例的功率半导体器件和PCB的联接组件的示意立体图。
图4是图示出根据实施例的功率半导体器件和PCB的联接组件的示意剖视图。
具体实施方式
下文中，将参照附图详细地描述根据实施例的功率半导体器件和印刷电路板（PCB）的联接组件。
图3是图示出根据实施例的功率半导体器件和PCB的联接组件的示意立体图，并且图4是根据实施例的功率半导体器件和PCB的联接组件的示意剖视图。
虽然功率半导体器件和PCB的联接组件在参照图3和图4描述的当前实施中被应用到功率转换器件中，但是本公开不限于此。例如，功率半导体器件和PCB的联接组件可以被应用至除了功率转换器件之外的其他电气/电子器件。
参照图3，根据实施例的功率半导体器件和PCB的联接组件包括：PCB300、联接至PCB300的上部的功率半导体器件100、以及被布置在功率半导体器件100上方以将功率半导体器件100朝向PCB300挤压的连接构件200。此处，连接构件200可以称为共用汇流条。连接构件可以由例如铜的导电材料形成。
此处，功率半导体器件100被布置在PCB300上方并且包括多个引脚110。各个引脚110由导电材料形成并且倾斜地在垂直方向上延伸。引脚110的外端被焊接并且被电连接至印刷在PCB300上的电路图案上。
根据当前实施例的连接构件200包括具有近似矩形平面的平板部210和从平板部210的一个长侧向下延伸的翼部220。
平板部210可以接触功率半导体器件100的顶面以通过两者之间的表面接触来有效地驱散功率半导体器件100中产生的热量。
此处，所述翼部220在垂直方向上倾斜地延伸。翼部220的倾斜角可以比功率半导体器件100的引脚110的垂直倾斜角更接近于垂直状态。因此，当连接构件200从功率半导体器件100的上侧朝向PCB300被挤压时，翼部200可以挤压功率半导体器件110的引脚以接触连接构件200。此处，可以稳定地保持两者之间的接触状态。
可以提供多个翼部220。尽管在当前实施例中提供四个翼部220，但是本公开不限于此。例如，翼部220的数量可以按需要选择。
翼部220可以延伸，使其宽度足以同时接触多个引脚110。在当前的实施例中，翼部220可以具有足以同时接触四个引脚110的宽度，在四个引脚110中电流在同一方向上流动。由于上述结构，电流流经的通道可以在面积上增加以提高电效率，从而减少功率半导体器件的发热量。
接地件500被布置在PCB300上。连接构件200的平板部210可以延伸达到接地件500以接触接地件500。从而，可以改进接地效果。
如图3和图4所示，连接构件200朝向PCB300被挤压并且然后通过使用主固定单元410而被联接至壳体600。
图4是图示出PCB300被联接至壳体600的内部的结构的剖视图，其中连接构件200和功率半导体器件100被联接至PCB上。壳体600包括各自向下延伸的多个管脚。
此处，图3和图4所图示的螺栓可以用作主固定单元410。
螺栓可以穿过连接构件200的平板部210和PCB300。然后，螺栓的端被联接至壳体600以将功率半导体器件100朝向PCB300挤压，从而将功率半导体器件100牢固地固定到PCB300上。
辅固定单元420可以被布置在连接构件200的平板部220的一部分上，接触所述接地件。如图主固定单元410一样，螺栓可以用作辅固定单元420。
辅固定单元420朝向接地件500挤压连接构件200的平板部210以将平板部210联接至接地件500。因此，可以牢固地保持连接构件200与平板部210之间的规律的接触状态。
下文中，将简单地描述将包括上述构成部件的功率半导体器件与PCB组装的过程。
首先，功率半导体器件100通过焊接被连接至PCB300。
然后，连接构件200被放置在功率半导体器件和接地件500上。此处，连接构件200的平板部210和接地件500可以通过辅固定单元彼此固定。此处，焊接可以用作辅固定单元420。可替代地，如图3和图4所示，螺栓可以用作主固定单元420。而且，可以使用焊接和螺栓两者。
接下来，组装后的PCB300被布置在包括管脚的壳体600内。
然后，连接构件200和壳体600通过使用为主固定单元410的螺栓而彼此联接。
在PCB300被联接至壳体600之后，可以执行连接构件200与接地件500之间通过辅固定单元420的联接。
根据所述联接结构和方法，可以增加功率半导体器件100与PCB300之间的联接力。此外，可以改善电效率，并且同样，通过连接构件可以更快地驱散热量以提高冷却效率。
而且，可以改善功率半导体器件100与PCB300之间的接地效果。
根据实施例，连接构件可以挤压功率半导体器件以将功率半导体器件联接到PCB上。因此，功率半导体器件可以更牢固地固定到PCB上。此外，功率半导体器件中所产生的热量可以通过连接构件被驱散以提高散热效率。
而且，因为连接构件被连接至功率半导体器件的多个引脚以使电流流动，所以电流流经的通道可以在面积上增加并且在电阻上减小。因此，可以减少功率半导体器件的发热量。所以，可以提高电效率。
而且，连接构件可以直接延伸至接地件并且可以被连接到所述接地件以提高接地效果。
为了解释目的，已经描述了本发明的精神，在上述范围内不背离本发明的必要特征的情况下，本发明所属领域的普通技术人员进行各种修改、增加和替换是可能的。
因此，为了解释所公开的实施例，本公开不限于本公开的技术构思，并且在不背离本发明的范围和精神的情况下不受本实施例限制。
本公开的保护范围、全部技术构思在其等效布置的范围内应当被以下的权利要求书解释，并且以下的权利要求书应当被理解为包括在本公开的范围内。

Claims (8)

1.一种功率半导体器件和印刷电路板（PCB）的联接组件，所述联接组件包括：
PCB；
功率半导体器件，其包括被电连接至布置在所述PCB上的电路图案的多个引脚；
连接构件，其被布置在所述功率半导体器件的上方，所述连接构件由导电材料形成；
主固定单元，其将所述功率半导体器件固定到所述PCB上；以及
壳体，其被布置在所述PCB的外部，
其中所述连接构件包括：
平板部，其接触所述功率半导体器件的上部；以及
翼部，其从所述平板部的端部向下延伸，
其中所述翼部的端部导电地接触所述功率半导体器件的引脚。
2.根据权利要求1所述的联接组件，其中设置至少一个翼部，并且
所述多个引脚导电地接触一个翼部。
3.根据权利要求2所述的联接组件，其中所述翼部的垂直延伸角度比所述功率半导体器件的所述引脚中的每个引脚的垂直延伸角度更接近于垂直状态。
4.根据权利要求2所述的联接组件，其中所述平板部与所述功率半导体器件的顶面进行表面接触。
5.根据权利要求1所述的联接组件，其中接地件被布置在所述PCB上，并且
所述连接构件延伸至所述接地件。
6.根据权利要求5所述的联接组件，进一步包括挤压并且固定所述连接构件至所述接地件的辅固定单元。
7.一种用于制造根据权利要求1至6中任一项所述的功率半导体器件和PCB的所述联接组件的方法，所述方法包括：
将所述功率半导体器件焊接到所述PCB上以将所述功率半导体器件联接到所述PCB上；
将所述连接构件布置在所述功率半导体器件的上部上；
将在其上部布置有所述连接构件的所述PCB布置在所述壳体内；以及
通过使用所述主固定单元来将所述连接构件、所述PCB以及所述壳体彼此联接。
8.根据权利要求7所述的方法，进一步包括：在将所述连接构件布置在所述功率半导体器件的所述上部上与将在其上部布置有所述连接构件的所述PCB布置在所述壳体内之间，通过使用所述辅固定单元来将所述连接构件联接至所述接地件，
其中所述辅固定单元包括焊接和固定螺栓中的至少一种。
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