CN103687303B - 功率半导体器件和pcb 的联接组件及其制造方法 - Google Patents

功率半导体器件和pcb 的联接组件及其制造方法 Download PDF

Info

Publication number
CN103687303B
CN103687303B CN201310412928.6A CN201310412928A CN103687303B CN 103687303 B CN103687303 B CN 103687303B CN 201310412928 A CN201310412928 A CN 201310412928A CN 103687303 B CN103687303 B CN 103687303B
Authority
CN
China
Prior art keywords
power semiconductor
pcb
circuit board
printed circuit
connecting elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201310412928.6A
Other languages
English (en)
Other versions
CN103687303A (zh
Inventor
尹普铉
许瑉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LS Electric Co Ltd
Original Assignee
LS Industrial Systems Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LS Industrial Systems Co Ltd filed Critical LS Industrial Systems Co Ltd
Publication of CN103687303A publication Critical patent/CN103687303A/zh
Application granted granted Critical
Publication of CN103687303B publication Critical patent/CN103687303B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L24/80 - H01L24/90
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/2049—Pressing means used to urge contact, e.g. springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H01L2224/37001—Core members of the connector
    • H01L2224/37099—Material
    • H01L2224/371—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40105—Connecting bonding areas at different heights
    • H01L2224/40106—Connecting bonding areas at different heights the connector being orthogonal to a side surface of the semiconductor or solid-state body, e.g. parallel layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/40227—Connecting the strap to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L24/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Power Conversion In General (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

本发明提供功率半导体器件和印刷电路板（PCB）的联接组件及其制造方法。所述功率半导体器件和印刷电路板（PCB）的联接组件包括：PCB；功率半导体器件，其包括被电连接至布置在所述PCB上的电路图案的多个引脚；连接构件，其被布置在所述功率半导体器件上方，所述连接构件由导电材料形成；主固定单元，其将所述功率半导体器件固定到所述PCB上；以及壳体，其被布置在所述PCB的外部。因此，可以提高功率半导体器件和PCB之间的联接力和电效率至发热量。此外，热量可以通过所述连接构件而被更快速地驱散以提高冷却效果。

Description

功率半导体器件和PCB的联接组件及其制造方法
技术领域
本公开涉及功率半导体器件和印刷电路板（PCB）的联接组件，并且更特别地，涉及功率半导体器件和PCB的联接组件，其中功率器件被布置在连接构件与PCB之间以使所述连接构件朝向所述PCB挤压，从而牢固地将所述功率半导体器件固定到所述PCB上并且提高了冷却效率和电效率。
背景技术
根据现有技术的使用在诸如功率转换器件的电气/电子器件中的功率半导体器件可以具有如下结构：通过使用螺栓或夹子而将功率半导体器件固定在壳体的内部，并且然后将所述功率半导体器件的引脚连接至PCB；或者可以具有如下结构：通过使用夹子或螺栓而将功率半导体器件固定到PCB上，而不直接附接至壳体的内部。
图1是图示出根据现有技术的功率半导体器件被联接至PCB的联接组件的示例的视图。通过使用固定螺栓40将功率半导体器件10附接至壳体30的内部。功率半导体器件10的引脚11通过焊接被连接至PCB20。根据上述结构，因为功率半导体器件10和壳体30彼此直接接触，所以可以在散热和冷却方面改进功率半导体器件。
然而，因为功率半导体器件10的引脚11通过焊接被连接至PCB20，所以组件可以容易被组装，但是在振动方面薄弱。
图2是图示出根据现有技术的功率半导体器件50被联接至PCB60的联接组件的示例的视图。不同于前述的根据现有技术的联接组件，功率半导体器件50被附接到PCB60的上部。此处，功率半导体器件50被挤压且通过使用固定螺栓和夹子80被固定在PCB60的顶面上。
因此，尽管功率半导体器件50更牢固地固定到PCB60上，因为功率半导体器件未直接接触壳体（未显示），所以可能使冷却效率变劣。
发明内容
实施例提供一种功率半导体器件和PCB的联接组件，在所述联接组件中功率半导体器件牢固地被固定到PCB上并且还提高了散热效率。
实施例还提供了一种功率半导体器件和PCB的联接组件，电流流经的通道在面积上增加以提高功率半导体器件的电效率并且减少发热量。
在一个实施例中，一种功率半导体器件和印刷电路板（PCB）的联接组件包括：PCB；功率半导体器件，其包括被电连接至布置在所述PCB上的电路图案的多个引脚；连接构件，其被布置在所述功率半导体器件的上方，所述连接构件由导电材料形成；主固定单元，其将所述功率半导体器件固定到所述PCB上；以及壳体，其被布置在所述PCB的外部，其中所述连接构件包括：平板部，其接触所述功率半导体器件的上部；以及翼部，其从所述平板部的端部向下延伸，其中所述翼部的端部导电地接触所述功率半导体器件的引脚。
可以设置至少一个翼部，并且多个引脚可以导电地接触一个翼部。
所述翼部的垂直延伸角度可以比所述功率半导体器件的所述引脚中的每个引脚的垂直延伸角度更接近于垂直状态。
所述平板部可以与所述功率半导体器件的顶面表面接触。
接地件可以被布置在所述PCB上，并且所述连接构件可以延伸至所述接地件。
所述联接组件可以进一步包括挤压并且固定所述连接构件至所述接地件的辅固定单元。
在另一个实施例中，一种用于制造根据实施例的功率半导体器件和PCB的联接组件的方法包括：将所述功率半导体器件焊接到所述PCB上以将所述功率半导体器件联接到所述PCB上；将所述连接构件布置在所述功率半导体器件的上部上；将在其上部布置有连接构件的所述PCB布置在所述壳体内；并且通过使用所述主固定单元来将所述连接构件、所述PCB以及所述壳体彼此联接。
所述方法可以进一步包括：在将所述连接构件布置在所述功率半导体器件的所述上部上与将在其上部布置有连接构件的所述PCB布置在所述壳体内之间，通过使用所述辅固定单元来将所述连接构件联接至所述接地件，其中所述辅固定单元可以包括焊接和固定螺栓中的至少一种。
在附图和下面的说明中给出了一个或多个实施例的细节。通过本说明书和附图以及权利要求书其他特征将是显而易见的。
附图说明
图1是图示出根据现有技术的功率半导体器件被联接至PCB的联接组件的示例的视图。
图2是图示出根据现有技术的功率半导体器件被联接至PCB的联接组件的另一个示例的视图。
图3是图示出根据实施例的功率半导体器件和PCB的联接组件的示意立体图。
图4是图示出根据实施例的功率半导体器件和PCB的联接组件的示意剖视图。
具体实施方式
下文中，将参照附图详细地描述根据实施例的功率半导体器件和印刷电路板（PCB）的联接组件。
图3是图示出根据实施例的功率半导体器件和PCB的联接组件的示意立体图，并且图4是根据实施例的功率半导体器件和PCB的联接组件的示意剖视图。
虽然功率半导体器件和PCB的联接组件在参照图3和图4描述的当前实施中被应用到功率转换器件中，但是本公开不限于此。例如，功率半导体器件和PCB的联接组件可以被应用至除了功率转换器件之外的其他电气/电子器件。
参照图3，根据实施例的功率半导体器件和PCB的联接组件包括：PCB300、联接至PCB300的上部的功率半导体器件100、以及被布置在功率半导体器件100上方以将功率半导体器件100朝向PCB300挤压的连接构件200。此处，连接构件200可以称为共用汇流条。连接构件可以由例如铜的导电材料形成。
此处，功率半导体器件100被布置在PCB300上方并且包括多个引脚110。各个引脚110由导电材料形成并且倾斜地在垂直方向上延伸。引脚110的外端被焊接并且被电连接至印刷在PCB300上的电路图案上。
根据当前实施例的连接构件200包括具有近似矩形平面的平板部210和从平板部210的一个长侧向下延伸的翼部220。
平板部210可以接触功率半导体器件100的顶面以通过两者之间的表面接触来有效地驱散功率半导体器件100中产生的热量。
此处，所述翼部220在垂直方向上倾斜地延伸。翼部220的倾斜角可以比功率半导体器件100的引脚110的垂直倾斜角更接近于垂直状态。因此，当连接构件200从功率半导体器件100的上侧朝向PCB300被挤压时，翼部200可以挤压功率半导体器件110的引脚以接触连接构件200。此处，可以稳定地保持两者之间的接触状态。
可以提供多个翼部220。尽管在当前实施例中提供四个翼部220，但是本公开不限于此。例如，翼部220的数量可以按需要选择。
翼部220可以延伸，使其宽度足以同时接触多个引脚110。在当前的实施例中，翼部220可以具有足以同时接触四个引脚110的宽度，在四个引脚110中电流在同一方向上流动。由于上述结构，电流流经的通道可以在面积上增加以提高电效率，从而减少功率半导体器件的发热量。
接地件500被布置在PCB300上。连接构件200的平板部210可以延伸达到接地件500以接触接地件500。从而，可以改进接地效果。
如图3和图4所示，连接构件200朝向PCB300被挤压并且然后通过使用主固定单元410而被联接至壳体600。
图4是图示出PCB300被联接至壳体600的内部的结构的剖视图，其中连接构件200和功率半导体器件100被联接至PCB上。壳体600包括各自向下延伸的多个管脚。
此处，图3和图4所图示的螺栓可以用作主固定单元410。
螺栓可以穿过连接构件200的平板部210和PCB300。然后，螺栓的端被联接至壳体600以将功率半导体器件100朝向PCB300挤压，从而将功率半导体器件100牢固地固定到PCB300上。
辅固定单元420可以被布置在连接构件200的平板部220的一部分上，接触所述接地件。如图主固定单元410一样，螺栓可以用作辅固定单元420。
辅固定单元420朝向接地件500挤压连接构件200的平板部210以将平板部210联接至接地件500。因此，可以牢固地保持连接构件200与平板部210之间的规律的接触状态。
下文中，将简单地描述将包括上述构成部件的功率半导体器件与PCB组装的过程。
首先，功率半导体器件100通过焊接被连接至PCB300。
然后，连接构件200被放置在功率半导体器件和接地件500上。此处，连接构件200的平板部210和接地件500可以通过辅固定单元彼此固定。此处，焊接可以用作辅固定单元420。可替代地，如图3和图4所示，螺栓可以用作主固定单元420。而且，可以使用焊接和螺栓两者。
接下来，组装后的PCB300被布置在包括管脚的壳体600内。
然后，连接构件200和壳体600通过使用为主固定单元410的螺栓而彼此联接。
在PCB300被联接至壳体600之后，可以执行连接构件200与接地件500之间通过辅固定单元420的联接。
根据所述联接结构和方法，可以增加功率半导体器件100与PCB300之间的联接力。此外，可以改善电效率，并且同样，通过连接构件可以更快地驱散热量以提高冷却效率。
而且，可以改善功率半导体器件100与PCB300之间的接地效果。
根据实施例，连接构件可以挤压功率半导体器件以将功率半导体器件联接到PCB上。因此，功率半导体器件可以更牢固地固定到PCB上。此外，功率半导体器件中所产生的热量可以通过连接构件被驱散以提高散热效率。
而且，因为连接构件被连接至功率半导体器件的多个引脚以使电流流动，所以电流流经的通道可以在面积上增加并且在电阻上减小。因此，可以减少功率半导体器件的发热量。所以，可以提高电效率。
而且，连接构件可以直接延伸至接地件并且可以被连接到所述接地件以提高接地效果。
为了解释目的，已经描述了本发明的精神，在上述范围内不背离本发明的必要特征的情况下，本发明所属领域的普通技术人员进行各种修改、增加和替换是可能的。
因此，为了解释所公开的实施例，本公开不限于本公开的技术构思，并且在不背离本发明的范围和精神的情况下不受本实施例限制。
本公开的保护范围、全部技术构思在其等效布置的范围内应当被以下的权利要求书解释，并且以下的权利要求书应当被理解为包括在本公开的范围内。

Claims (6)

1.一种功率半导体器件和印刷电路板的联接组件，所述联接组件包括：
印刷电路板；
功率半导体器件，其包括被电连接至布置在所述印刷电路板上的电路图案的多个引脚；
连接构件，其被布置在所述功率半导体器件的上方，所述连接构件由导电材料形成；
主固定单元，其将所述功率半导体器件固定到所述印刷电路板上；以及
壳体，其被布置在所述印刷电路板的外部，
其中所述连接构件包括：
平板部，其接触所述功率半导体器件的上部；以及
翼部，其从所述平板部的端部向下延伸，
其中所述翼部的端部导电地接触所述功率半导体器件的引脚，
其中设置至少一个翼部，并且
所述多个引脚导电地接触一个翼部，
其中所述翼部的垂直延伸角度比所述功率半导体器件的所述引脚中的每个引脚的垂直延伸角度更接近于垂直状态。
2.根据权利要求1所述的联接组件，其中所述平板部与所述功率半导体器件的顶面进行表面接触。
3.一种用于制造根据权利要求1或2中任一项所述的功率半导体器件和印刷电路板的所述联接组件的方法，所述方法包括：
将所述功率半导体器件焊接到所述印刷电路板上以将所述功率半导体器件联接到所述印刷电路板上；
将所述连接构件布置在所述功率半导体器件的上部上；
将在其上部布置有所述连接构件的所述印刷电路板布置在所述壳体内；以及
通过使用所述主固定单元来将所述连接构件、所述印刷电路板以及所述壳体彼此联接。
4.一种功率半导体器件和印刷电路板的联接组件，所述联接组件包括：
印刷电路板；
功率半导体器件，其包括被电连接至布置在所述印刷电路板上的电路图案的多个引脚；
连接构件，其被布置在所述功率半导体器件的上方，所述连接构件由导电材料形成；
主固定单元，其将所述功率半导体器件固定到所述印刷电路板上；以及
壳体，其被布置在所述印刷电路板的外部，
其中所述连接构件包括：
平板部，其接触所述功率半导体器件的上部；以及
翼部，其从所述平板部的端部向下延伸，
其中所述翼部的端部导电地接触所述功率半导体器件的引脚，
其中接地件被布置在所述印刷电路板上，并且
所述连接构件延伸至所述接地件，
其中，所述联接组件进一步包括挤压并且固定所述连接构件至所述接地件的辅固定单元。
5.一种用于制造根据权利要求4所述的功率半导体器件和印刷电路板的所述联接组件的方法，所述方法包括：
将所述功率半导体器件焊接到所述印刷电路板上以将所述功率半导体器件联接到所述印刷电路板上；
将所述连接构件布置在所述功率半导体器件的上部上；
将在其上部布置有所述连接构件的所述印刷电路板布置在所述壳体内；以及
通过使用所述主固定单元来将所述连接构件、所述印刷电路板以及所述壳体彼此联接。
6.根据权利要求5所述的方法，进一步包括：在将所述连接构件布置在所述功率半导体器件的所述上部上与将在其上部布置有所述连接构件的所述印刷电路板布置在所述壳体内之间，通过使用所述辅固定单元来将所述连接构件联接至所述接地件，
其中所述辅固定单元包括焊接和固定螺栓中的至少一种。
CN201310412928.6A 2012-09-11 2013-09-11 功率半导体器件和pcb 的联接组件及其制造方法 Expired - Fee Related CN103687303B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2012-0100489 2012-09-11
KR1020120100489A KR101398739B1 (ko) 2012-09-11 2012-09-11 전력 소자와 ｐｃｂ의 결합 어셈블리 및 전력 소자와 ｐｃｂ의 결합방법

Publications (2)

Publication Number Publication Date
CN103687303A CN103687303A (zh) 2014-03-26
CN103687303B true CN103687303B (zh) 2017-01-11

Family

ID=49084895

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310412928.6A Expired - Fee Related CN103687303B (zh) 2012-09-11 2013-09-11 功率半导体器件和pcb 的联接组件及其制造方法

Country Status (6)

Country Link
US (1) US9165856B2 (zh)
EP (1) EP2706828B1 (zh)
JP (1) JP5706490B2 (zh)
KR (1) KR101398739B1 (zh)
CN (1) CN103687303B (zh)
ES (1) ES2727105T3 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105228427A (zh) * 2015-11-11 2016-01-06 林炳彩 一种带冷却器的可调式电路板装置组件
CN105246303A (zh) * 2015-11-11 2016-01-13 方小刚 一种由电机驱动的电路板装置组件
KR102457660B1 (ko) 2016-01-08 2022-10-24 엘지이노텍 주식회사 전력 변환 장치
US11076477B2 (en) 2017-10-03 2021-07-27 Mks Instruments, Inc. Cooling and compression clamp for short lead power devices
JP2019134647A (ja) * 2018-02-02 2019-08-08 株式会社豊田自動織機 半導体装置
CN110299265B (zh) * 2019-05-06 2021-10-15 上海空间电源研究所 继电器安装在印制板上的高阻接地结构及其安装方法
US11490517B2 (en) * 2019-07-31 2022-11-01 ABB Power Electronics, Inc. Interposer printed circuit boards for power modules
CN116782624B (zh) * 2023-07-04 2024-02-02 江苏苏源杰瑞科技有限公司 一种半导体贴片机输送设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5592021A (en) * 1995-04-26 1997-01-07 Martin Marietta Corporation Clamp for securing a power device to a heatsink
US5850140A (en) * 1993-07-07 1998-12-15 Tokin Corporation Electric field sensor having sensor head with unbalanced electric field shield to shield branched optical waveguides against an applied electric field
US7450387B2 (en) * 2006-03-02 2008-11-11 Tdk Innoveta Technologies, Inc. System for cooling electronic components
CN102299126A (zh) * 2010-06-23 2011-12-28 三星电机株式会社 散热基底以及制造该散热基底的方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6255346A (ja) 1985-09-04 1987-03-11 川鉄建材工業株式会社 構造部材の接合装置
JPS6255346U (zh) * 1985-09-25 1987-04-06
JPH02170593A (ja) 1988-12-23 1990-07-02 Canon Inc Ｉｃの放熱構造
JPH081918B2 (ja) * 1989-04-28 1996-01-10 日本電気株式会社 超高周波帯実装構造
TW381328B (en) * 1994-03-07 2000-02-01 Ibm Dual substrate package assembly for being electrically coupled to a conducting member
JPH081918A (ja) 1994-06-24 1996-01-09 Mitsubishi Heavy Ind Ltd 印刷機械の温度制御装置
US5459640A (en) * 1994-09-23 1995-10-17 Motorola, Inc. Electrical module mounting apparatus and method thereof
JPH09283886A (ja) 1996-04-11 1997-10-31 Canon Inc 基板実装方法及び実装基板構造並びに該実装基板構造を用いた電子機器
KR19980028849U (ko) * 1996-11-25 1998-08-05 김광호 발열부재 고정구조
US5850104A (en) * 1997-01-06 1998-12-15 Spectrian, Inc. Integral lid/clamp for high power transistor
US6097603A (en) * 1997-10-22 2000-08-01 Thermalloy, Incorporated Heat sink for direct attachment to surface mount electronic device packages
JP3619670B2 (ja) * 1998-05-27 2005-02-09 アルプス電気株式会社 電子機器
US6582100B1 (en) * 2000-08-09 2003-06-24 Relume Corporation LED mounting system
US6558169B2 (en) * 2001-03-29 2003-05-06 Intel Corporation Shunt power connection for an integrated circuit package

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5850140A (en) * 1993-07-07 1998-12-15 Tokin Corporation Electric field sensor having sensor head with unbalanced electric field shield to shield branched optical waveguides against an applied electric field
US5592021A (en) * 1995-04-26 1997-01-07 Martin Marietta Corporation Clamp for securing a power device to a heatsink
US7450387B2 (en) * 2006-03-02 2008-11-11 Tdk Innoveta Technologies, Inc. System for cooling electronic components
CN102299126A (zh) * 2010-06-23 2011-12-28 三星电机株式会社 散热基底以及制造该散热基底的方法

Also Published As

Publication number Publication date
CN103687303A (zh) 2014-03-26
JP2014057066A (ja) 2014-03-27
US20140070387A1 (en) 2014-03-13
KR101398739B1 (ko) 2014-05-28
EP2706828A2 (en) 2014-03-12
JP5706490B2 (ja) 2015-04-22
KR20140034989A (ko) 2014-03-21
US9165856B2 (en) 2015-10-20
ES2727105T3 (es) 2019-10-14
EP2706828B1 (en) 2019-03-06
EP2706828A3 (en) 2017-08-02

Similar Documents

Publication Publication Date Title
CN103687303B (zh) 功率半导体器件和pcb 的联接组件及其制造方法
US9538692B2 (en) Integrated heat exchanger and power delivery system for high powered electronic modules
US20170373238A1 (en) Thermoelectric Power Generation Module
US20070184711A1 (en) Electrical module
JP2009212311A (ja) 電子機器
CN102570404A (zh) 电池单元保护电路模块和辅助印刷电路板
CN102790043A (zh) 功率半导体
CN109891660A (zh) 用于印刷电路板的连接器以及包括印刷电路板和连接器的电池系统
CN107112654B (zh) 模块-端子台连接结构及连接方法
CN107453104B (zh) 连接器、电源组件和终端设备
CN102752994A (zh) 一种驱动器
CN201515058U (zh) 弹片接触式插槽
CN215266735U (zh) 接线端子及电力电子设备
CN205726813U (zh) 一种电子设备
CN211350619U (zh) 双面散热功率模块
CN116349416A (zh) 印刷电路板模块和包括印刷电路板模块的电子设备
CN205987528U (zh) 一种易散热印刷电路板组件
CN109041406B (zh) 空间紧凑型大电流线路板模组及运输车辆用保险丝盒
CN206921034U (zh) 散热装置及电子设备
CN111341740A (zh) 一种新型电源管理芯片封装系统
US10103096B2 (en) Semiconductor device
CN201190965Y (zh) 一种表面型发光二极管灯具
CN220210870U (zh) 电子器件、充电装置和电子设备
US9491861B2 (en) Wiring substrate and substrate module
CN216354204U (zh) Sic器件封装模块及升压电路

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20170111

Termination date: 20190911

CF01 Termination of patent right due to non-payment of annual fee