JP2007134716A - 回路装置、特に周波数変換器 - Google Patents
回路装置、特に周波数変換器 Download PDFInfo
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- JP2007134716A JP2007134716A JP2006302786A JP2006302786A JP2007134716A JP 2007134716 A JP2007134716 A JP 2007134716A JP 2006302786 A JP2006302786 A JP 2006302786A JP 2006302786 A JP2006302786 A JP 2006302786A JP 2007134716 A JP2007134716 A JP 2007134716A
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- H—ELECTRICITY
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- H01—ELECTRIC ELEMENTS
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
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- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
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- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
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- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0352—Differences between the conductors of different layers of a multilayer
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- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
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- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T428/24777—Edge feature
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Inverter Devices (AREA)
Abstract
【解決手段】回路装置、特に、回路モジュール12が回路基板14に相互接続され、かつ冷却体16に接続される周波数変換器10が記載されている。回路装置、特に、最適な冷却特性を有する連結解除部の周波数変換器を実現するために、回路モジュールがフレキシブル電気絶縁プラスチックフィルム18を備え、このプラスチックフィルムが、その一方の側面に論理回路構造の金属層20を備え、かつ一方の側面の反対側の側面に出力回路構造の金属層22を備え、この金属層の接触縁26が、回路基板の周縁部28に接触することが提案される。フレキシブル回路モジュールは回路基板から曲げられている。出力回路構造の金属層にはパワー半導体チップ24が接触する。冷却体には、パワー半導体チップに接触させるための回路構造体32が形成される基板30が固定される。
【選択図】図1
Description
12 (10の)回路モジュール
14 (10の)回路基板
16 (12に関して10の)冷却体
18 (12の)プラスチックフィルム
20 (18に設けられた)論理回路構造の金属層
22 (18に設けられた)出力回路構造の金属層
24 (22に設けられた)パワー半導体チップ
26 (22の)接触縁
28 (14の)周縁部
30 (24に関して16に設けられた)基板
32 (24に関して30に設けられた)回路構造体
34 (16に関して30に設けられた)金属層
36 (16の)金属板
38 (36の)第1の板部
40 (36の)第2の板部
42 (38に設けられた)冷却素子
44 (10の)容器
46 矢印/熱伝導/熱流
Claims (6)
- 回路装置、特に、回路基板(14)と相互接続され、かつ冷却体(16)に熱伝導接続される回路モジュール(12)を有する周波数変換器(10)において、
前記回路モジュール(12)が、フレキシブル電気絶縁プラスチックフィルム(18)を備え、該フレキシブル電気絶縁プラスチックフィルムが、その一方の側面に、薄い論理回路構造の金属層(20)を備え、かつ前記一方の側面の反対側の側面に、出力回路構造の金属層(22)を備え、該出力回路構造の金属層の接触縁(26)が回路基板(14)の周縁部(28)に接触し、前記フレキシブル回路モジュール(12)が前記回路基板(14)から曲げられていること、
前記出力回路構造の金属層(22)にパワー半導体チップ(24)が接触すること、および
前記冷却体(16)に基板(30)が固定され、該基板に、前記パワー半導体チップ(24)に接触させるための回路構造体(32)が形成されること
を特徴とする回路装置。 - 前記フレキシブル回路モジュール(12)が、前記回路基板(14)よりも小さい面寸法を有することを特徴とする請求項1に記載の回路装置。
- 前記フレキシブル回路モジュール(12)と前記回路基板(14)とが90°の角度をなすことを特徴とする請求項1に記載の回路装置。
- 前記基板(30)が、前記フレキシブル回路モジュール(12)の前記面寸法に適合させられた面寸法を有することを特徴とする請求項1に記載の回路装置。
- 前記冷却体(16)が、第1の板部(38)および第2の板部(40)を有する曲げられた金属板(36)を備え、前記第1の板部(38)に前記基板(30)が固定され、かつ前記第2の板部(40)が、前記回路基板(14)に適合させられた面寸法を有することを特徴とする請求項1に記載の回路装置。
- 前記第1の板部(38)に冷却素子(42)が固定されることを特徴とする請求項5に記載の回路装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200510053396 DE102005053396B4 (de) | 2005-11-09 | 2005-11-09 | Schaltungseinrichtung, insbesondere Frequenzumrichter |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2007134716A true JP2007134716A (ja) | 2007-05-31 |
Family
ID=37680594
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006302786A Pending JP2007134716A (ja) | 2005-11-09 | 2006-11-08 | 回路装置、特に周波数変換器 |
Country Status (8)
Country | Link |
---|---|
US (1) | US20070104926A1 (ja) |
EP (1) | EP1786035B1 (ja) |
JP (1) | JP2007134716A (ja) |
KR (1) | KR20070049963A (ja) |
CN (1) | CN1964614B (ja) |
AT (1) | ATE525749T1 (ja) |
BR (1) | BRPI0604775A (ja) |
DE (1) | DE102005053396B4 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007044143A1 (de) * | 2007-09-18 | 2009-04-02 | Behr-Hella Thermocontrol Gmbh | Vorrichtung zur Ansteuerung eines elektrischen Verbrauchers, insbesondere eines Gebläsemotors |
CN102271480A (zh) * | 2010-06-04 | 2011-12-07 | 施耐德东芝换流器欧洲公司 | 电气设备及用于电气设备的底座 |
KR101319862B1 (ko) * | 2012-06-07 | 2013-10-18 | 주식회사 피앤이솔루션 | 전지 충,방전기의 환기장치 |
US9825437B2 (en) * | 2014-06-04 | 2017-11-21 | Hamilton Sundstrand Corporation | Three-dimensional power distribution interconnect structure |
CN108995505B (zh) * | 2015-03-20 | 2022-04-12 | 翰昂汽车零部件有限公司 | 电动压缩机变频器冷却装置及设有其的变频器组装体 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6040624A (en) * | 1997-10-02 | 2000-03-21 | Motorola, Inc. | Semiconductor device package and method |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4105152A1 (de) * | 1991-02-20 | 1992-09-03 | Export Contor Aussenhandel | Elektronische schaltungsanordnung |
DE9109911U1 (ja) * | 1991-08-10 | 1992-12-10 | Fritz A. Seidel Elektro-Automatik Gmbh, 4000 Duesseldorf, De | |
SE9203533L (sv) * | 1992-11-24 | 1994-05-24 | Asea Brown Boveri | Anordning för kylning av skivformiga kraftelektronikelement jämte skivformigt kraftelektronikelement avsett att monteras i sådan kylanordning |
DE19617055C1 (de) * | 1996-04-29 | 1997-06-26 | Semikron Elektronik Gmbh | Halbleiterleistungsmodul hoher Packungsdichte in Mehrschichtbauweise |
US6466447B2 (en) * | 2000-02-24 | 2002-10-15 | Denso Corporation | Electronic control unit having flexible wires connecting connector to circuit board |
DE10121970B4 (de) * | 2001-05-05 | 2004-05-27 | Semikron Elektronik Gmbh | Leistungshalbleitermodul in Druckkontaktierung |
US7071420B2 (en) * | 2002-12-18 | 2006-07-04 | Micron Technology, Inc. | Methods and apparatus for a flexible circuit interposer |
DE10316355C5 (de) * | 2003-04-10 | 2008-03-06 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbeitermodul mit flexibler äusserer Anschlussbelegung |
DE102004018476B4 (de) * | 2004-04-16 | 2009-06-18 | Infineon Technologies Ag | Leistungshalbleiteranordnung mit kontaktierender Folie und Anpressvorrichtung |
DE102004019435A1 (de) * | 2004-04-19 | 2005-11-03 | Siemens Ag | An einer Kühlrippe angeordnetes Bauelement |
DE102004019442A1 (de) * | 2004-04-19 | 2005-10-06 | Siemens Ag | An planarer Verbindung angeordneter Kühlkörper |
-
2005
- 2005-11-09 DE DE200510053396 patent/DE102005053396B4/de not_active Expired - Fee Related
-
2006
- 2006-10-24 CN CN2006101365130A patent/CN1964614B/zh not_active Expired - Fee Related
- 2006-11-02 KR KR1020060107599A patent/KR20070049963A/ko active IP Right Grant
- 2006-11-06 EP EP20060023024 patent/EP1786035B1/de not_active Not-in-force
- 2006-11-06 AT AT06023024T patent/ATE525749T1/de active
- 2006-11-08 JP JP2006302786A patent/JP2007134716A/ja active Pending
- 2006-11-08 BR BRPI0604775-0A patent/BRPI0604775A/pt not_active IP Right Cessation
- 2006-11-09 US US11/595,088 patent/US20070104926A1/en not_active Abandoned
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6040624A (en) * | 1997-10-02 | 2000-03-21 | Motorola, Inc. | Semiconductor device package and method |
Also Published As
Publication number | Publication date |
---|---|
KR20070049963A (ko) | 2007-05-14 |
EP1786035A2 (de) | 2007-05-16 |
DE102005053396A1 (de) | 2007-05-16 |
BRPI0604775A (pt) | 2007-09-25 |
US20070104926A1 (en) | 2007-05-10 |
EP1786035A3 (de) | 2010-07-07 |
CN1964614B (zh) | 2012-07-18 |
CN1964614A (zh) | 2007-05-16 |
DE102005053396B4 (de) | 2010-04-15 |
EP1786035B1 (de) | 2011-09-21 |
ATE525749T1 (de) | 2011-10-15 |
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