DE102005053396A1 - Schaltungseinrichtung, insbesondere Frequenzumrichter - Google Patents
Schaltungseinrichtung, insbesondere Frequenzumrichter Download PDFInfo
- Publication number
- DE102005053396A1 DE102005053396A1 DE200510053396 DE102005053396A DE102005053396A1 DE 102005053396 A1 DE102005053396 A1 DE 102005053396A1 DE 200510053396 DE200510053396 DE 200510053396 DE 102005053396 A DE102005053396 A DE 102005053396A DE 102005053396 A1 DE102005053396 A1 DE 102005053396A1
- Authority
- DE
- Germany
- Prior art keywords
- circuit
- circuit device
- frequency converter
- particular frequency
- contacts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/165—Containers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0352—Differences between the conductors of different layers of a multilayer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24777—Edge feature
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Inverter Devices (AREA)
Abstract
Es wird eine Schaltungseinrichtung, insbesondere ein Frequenzumrichter (10), beschrieben, wobei ein Schaltungsmodul (12) mit einer Schaltungsplatine (14) zusammengeschaltet und mit einem Kühlkörper (16) verbunden ist. Zur Realisierung einer Schaltungseinrichtung, insbesondere eines Frequenzumrichters (10), in einer Anreihlösung mit optimalen Kühleigenschaften wird vorgeschlagen, dass das Schaltungsmodul (12) eine flexible, elektrisch isolierende Kunststofffolie (18) aufweist, die auf ihrer einen Seite eine schaltstrukturierte Logikmetallschicht (20) und auf der gegenüberliegenden Seite eine schaltstrukturierte Leistungsmetallschicht (22) aufweist, die mit einem Kontaktrand (26) an einem Randabschnitt (28) der Schaltungsplatine (14) kontaktiert ist. Das flexible Schaltungsmodul (12) steht von der Schaltungsplatine (14) abgewinkelt weg. An der Leistungsmetallschicht (22) sind Leistungshalbleiterchips (24) kontaktiert. Am Kühlkörper (16) ist ein Substrat (30) befestigt, das mit einer Schaltungsstruktur (32) zur Kontaktierung der Leistungshalbleiterchips (24) ausgebildet ist.
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200510053396 DE102005053396B4 (de) | 2005-11-09 | 2005-11-09 | Schaltungseinrichtung, insbesondere Frequenzumrichter |
CN2006101365130A CN1964614B (zh) | 2005-11-09 | 2006-10-24 | 电路装置尤其是变频器 |
KR1020060107599A KR20070049963A (ko) | 2005-11-09 | 2006-11-02 | 회로 장치, 특히 주파수 변환기 |
EP20060023024 EP1786035B1 (de) | 2005-11-09 | 2006-11-06 | Schaltungseinrichtung, insbesondere Frequenzumrichter |
AT06023024T ATE525749T1 (de) | 2005-11-09 | 2006-11-06 | Schaltungseinrichtung, insbesondere frequenzumrichter |
JP2006302786A JP2007134716A (ja) | 2005-11-09 | 2006-11-08 | 回路装置、特に周波数変換器 |
BRPI0604775-0A BRPI0604775A (pt) | 2005-11-09 | 2006-11-08 | dispositivo de circuito, especialmente para conversor de freqüência |
US11/595,088 US20070104926A1 (en) | 2005-11-09 | 2006-11-09 | Circuit device in particular frequency converter |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200510053396 DE102005053396B4 (de) | 2005-11-09 | 2005-11-09 | Schaltungseinrichtung, insbesondere Frequenzumrichter |
Publications (2)
Publication Number | Publication Date |
---|---|
DE102005053396A1 true DE102005053396A1 (de) | 2007-05-16 |
DE102005053396B4 DE102005053396B4 (de) | 2010-04-15 |
Family
ID=37680594
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE200510053396 Expired - Fee Related DE102005053396B4 (de) | 2005-11-09 | 2005-11-09 | Schaltungseinrichtung, insbesondere Frequenzumrichter |
Country Status (8)
Country | Link |
---|---|
US (1) | US20070104926A1 (de) |
EP (1) | EP1786035B1 (de) |
JP (1) | JP2007134716A (de) |
KR (1) | KR20070049963A (de) |
CN (1) | CN1964614B (de) |
AT (1) | ATE525749T1 (de) |
BR (1) | BRPI0604775A (de) |
DE (1) | DE102005053396B4 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007044143A1 (de) * | 2007-09-18 | 2009-04-02 | Behr-Hella Thermocontrol Gmbh | Vorrichtung zur Ansteuerung eines elektrischen Verbrauchers, insbesondere eines Gebläsemotors |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102271480A (zh) * | 2010-06-04 | 2011-12-07 | 施耐德东芝换流器欧洲公司 | 电气设备及用于电气设备的底座 |
KR101319862B1 (ko) * | 2012-06-07 | 2013-10-18 | 주식회사 피앤이솔루션 | 전지 충,방전기의 환기장치 |
US9825437B2 (en) * | 2014-06-04 | 2017-11-21 | Hamilton Sundstrand Corporation | Three-dimensional power distribution interconnect structure |
CN108995505B (zh) * | 2015-03-20 | 2022-04-12 | 翰昂汽车零部件有限公司 | 电动压缩机变频器冷却装置及设有其的变频器组装体 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004019442A1 (de) * | 2004-04-19 | 2005-10-06 | Siemens Ag | An planarer Verbindung angeordneter Kühlkörper |
DE102004019435A1 (de) * | 2004-04-19 | 2005-11-03 | Siemens Ag | An einer Kühlrippe angeordnetes Bauelement |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4105152A1 (de) * | 1991-02-20 | 1992-09-03 | Export Contor Aussenhandel | Elektronische schaltungsanordnung |
DE9109911U1 (de) * | 1991-08-10 | 1992-12-10 | Fritz A. Seidel Elektro-Automatik Gmbh, 4000 Duesseldorf, De | |
SE9203533L (sv) * | 1992-11-24 | 1994-05-24 | Asea Brown Boveri | Anordning för kylning av skivformiga kraftelektronikelement jämte skivformigt kraftelektronikelement avsett att monteras i sådan kylanordning |
DE19617055C1 (de) * | 1996-04-29 | 1997-06-26 | Semikron Elektronik Gmbh | Halbleiterleistungsmodul hoher Packungsdichte in Mehrschichtbauweise |
US6040624A (en) * | 1997-10-02 | 2000-03-21 | Motorola, Inc. | Semiconductor device package and method |
US6466447B2 (en) * | 2000-02-24 | 2002-10-15 | Denso Corporation | Electronic control unit having flexible wires connecting connector to circuit board |
DE10121970B4 (de) * | 2001-05-05 | 2004-05-27 | Semikron Elektronik Gmbh | Leistungshalbleitermodul in Druckkontaktierung |
US7071420B2 (en) * | 2002-12-18 | 2006-07-04 | Micron Technology, Inc. | Methods and apparatus for a flexible circuit interposer |
DE10316355C5 (de) * | 2003-04-10 | 2008-03-06 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbeitermodul mit flexibler äusserer Anschlussbelegung |
DE102004018476B4 (de) * | 2004-04-16 | 2009-06-18 | Infineon Technologies Ag | Leistungshalbleiteranordnung mit kontaktierender Folie und Anpressvorrichtung |
-
2005
- 2005-11-09 DE DE200510053396 patent/DE102005053396B4/de not_active Expired - Fee Related
-
2006
- 2006-10-24 CN CN2006101365130A patent/CN1964614B/zh not_active Expired - Fee Related
- 2006-11-02 KR KR1020060107599A patent/KR20070049963A/ko active IP Right Grant
- 2006-11-06 EP EP20060023024 patent/EP1786035B1/de not_active Not-in-force
- 2006-11-06 AT AT06023024T patent/ATE525749T1/de active
- 2006-11-08 JP JP2006302786A patent/JP2007134716A/ja active Pending
- 2006-11-08 BR BRPI0604775-0A patent/BRPI0604775A/pt not_active IP Right Cessation
- 2006-11-09 US US11/595,088 patent/US20070104926A1/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004019442A1 (de) * | 2004-04-19 | 2005-10-06 | Siemens Ag | An planarer Verbindung angeordneter Kühlkörper |
DE102004019435A1 (de) * | 2004-04-19 | 2005-11-03 | Siemens Ag | An einer Kühlrippe angeordnetes Bauelement |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007044143A1 (de) * | 2007-09-18 | 2009-04-02 | Behr-Hella Thermocontrol Gmbh | Vorrichtung zur Ansteuerung eines elektrischen Verbrauchers, insbesondere eines Gebläsemotors |
Also Published As
Publication number | Publication date |
---|---|
KR20070049963A (ko) | 2007-05-14 |
EP1786035A2 (de) | 2007-05-16 |
BRPI0604775A (pt) | 2007-09-25 |
US20070104926A1 (en) | 2007-05-10 |
EP1786035A3 (de) | 2010-07-07 |
CN1964614B (zh) | 2012-07-18 |
CN1964614A (zh) | 2007-05-16 |
DE102005053396B4 (de) | 2010-04-15 |
JP2007134716A (ja) | 2007-05-31 |
EP1786035B1 (de) | 2011-09-21 |
ATE525749T1 (de) | 2011-10-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OP8 | Request for examination as to paragraph 44 patent law | ||
8364 | No opposition during term of opposition | ||
R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |
Effective date: 20130601 |