JPWO2023190524A1 - - Google Patents
Info
- Publication number
- JPWO2023190524A1 JPWO2023190524A1 JP2024512571A JP2024512571A JPWO2023190524A1 JP WO2023190524 A1 JPWO2023190524 A1 JP WO2023190524A1 JP 2024512571 A JP2024512571 A JP 2024512571A JP 2024512571 A JP2024512571 A JP 2024512571A JP WO2023190524 A1 JPWO2023190524 A1 JP WO2023190524A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
- H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022055454 | 2022-03-30 | ||
| PCT/JP2023/012540 WO2023190524A1 (ja) | 2022-03-30 | 2023-03-28 | 放熱板及びベイパーチャンバー |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023190524A1 true JPWO2023190524A1 (https=) | 2023-10-05 |
| JPWO2023190524A5 JPWO2023190524A5 (https=) | 2024-12-03 |
Family
ID=88202585
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024512571A Pending JPWO2023190524A1 (https=) | 2022-03-30 | 2023-03-28 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250224181A1 (https=) |
| EP (1) | EP4502522A1 (https=) |
| JP (1) | JPWO2023190524A1 (https=) |
| CN (1) | CN118922681A (https=) |
| WO (1) | WO2023190524A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025244030A1 (ja) * | 2024-05-21 | 2025-11-27 | 京セラ株式会社 | 放熱部材、ベイパーチャンバー及び機能モジュール |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5050411A (https=) * | 1973-09-05 | 1975-05-06 | ||
| JP2000150739A (ja) * | 1998-11-05 | 2000-05-30 | Electrovac Fabrikation Elektrotechnischer Spezialartikel Gmbh | 電気デバイスおよび／または電子デバイス用のヒ―トシンク |
| JP2009260168A (ja) * | 2008-04-21 | 2009-11-05 | Sumitomo Electric Ind Ltd | 放熱構造、放熱装置及び放熱構造の製造方法 |
| JP2010151354A (ja) * | 2008-12-24 | 2010-07-08 | Sony Corp | 熱輸送デバイス及び電子機器 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002141449A (ja) * | 2000-10-31 | 2002-05-17 | Denso Corp | 沸騰冷却器 |
| JP4558258B2 (ja) | 2001-10-01 | 2010-10-06 | 古河電気工業株式会社 | 板型ヒートパイプおよびその製造方法 |
| US7579077B2 (en) * | 2003-05-05 | 2009-08-25 | Nanosys, Inc. | Nanofiber surfaces for use in enhanced surface area applications |
| US20110108245A1 (en) * | 2009-11-10 | 2011-05-12 | Dsem Holdings Sdn. Bhd. | Circuit Board Forming Diffusion Bonded Wall of Vapor Chamber |
| CN103649240B (zh) * | 2011-01-19 | 2016-09-14 | 哈佛学院院长等 | 具有高压稳定性、光学透明性以及自修复特征的光滑表面 |
| US20130126132A1 (en) * | 2011-11-18 | 2013-05-23 | Chih-peng Chen | Vapor chamber with integrally formed wick structure and method of manufacturing same |
| CN108323137A (zh) * | 2017-01-18 | 2018-07-24 | 台达电子工业股份有限公司 | 均热板 |
| US10473404B2 (en) * | 2017-11-14 | 2019-11-12 | Asia Vital Components Co., Ltd. | Straight-through structure of heat dissipation unit |
| US20190285357A1 (en) * | 2018-03-19 | 2019-09-19 | Asia Vital Components Co., Ltd. | Middle member of heat dissipation device and the heat dissipation device |
| WO2021188128A1 (en) * | 2020-03-18 | 2021-09-23 | Kelvin Thermal Technologies, Inc. | Deformed mesh thermal ground plane |
-
2023
- 2023-03-28 EP EP23780533.8A patent/EP4502522A1/en not_active Withdrawn
- 2023-03-28 WO PCT/JP2023/012540 patent/WO2023190524A1/ja not_active Ceased
- 2023-03-28 US US18/853,008 patent/US20250224181A1/en active Pending
- 2023-03-28 CN CN202380029917.1A patent/CN118922681A/zh active Pending
- 2023-03-28 JP JP2024512571A patent/JPWO2023190524A1/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5050411A (https=) * | 1973-09-05 | 1975-05-06 | ||
| JP2000150739A (ja) * | 1998-11-05 | 2000-05-30 | Electrovac Fabrikation Elektrotechnischer Spezialartikel Gmbh | 電気デバイスおよび／または電子デバイス用のヒ―トシンク |
| JP2009260168A (ja) * | 2008-04-21 | 2009-11-05 | Sumitomo Electric Ind Ltd | 放熱構造、放熱装置及び放熱構造の製造方法 |
| JP2010151354A (ja) * | 2008-12-24 | 2010-07-08 | Sony Corp | 熱輸送デバイス及び電子機器 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023190524A1 (ja) | 2023-10-05 |
| EP4502522A1 (en) | 2025-02-05 |
| CN118922681A (zh) | 2024-11-08 |
| US20250224181A1 (en) | 2025-07-10 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
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