JPWO2023190246A5 - - Google Patents

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Publication number
JPWO2023190246A5
JPWO2023190246A5 JP2024512409A JP2024512409A JPWO2023190246A5 JP WO2023190246 A5 JPWO2023190246 A5 JP WO2023190246A5 JP 2024512409 A JP2024512409 A JP 2024512409A JP 2024512409 A JP2024512409 A JP 2024512409A JP WO2023190246 A5 JPWO2023190246 A5 JP WO2023190246A5
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JP
Japan
Prior art keywords
recess
metal plate
metal
plate
main surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024512409A
Other languages
English (en)
Japanese (ja)
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JPWO2023190246A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/011999 external-priority patent/WO2023190246A1/ja
Publication of JPWO2023190246A1 publication Critical patent/JPWO2023190246A1/ja
Publication of JPWO2023190246A5 publication Critical patent/JPWO2023190246A5/ja
Pending legal-status Critical Current

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JP2024512409A 2022-03-31 2023-03-24 Pending JPWO2023190246A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022059779 2022-03-31
PCT/JP2023/011999 WO2023190246A1 (ja) 2022-03-31 2023-03-24 回路基板及びその製造方法、並びにパワーモジュール

Publications (2)

Publication Number Publication Date
JPWO2023190246A1 JPWO2023190246A1 (https=) 2023-10-05
JPWO2023190246A5 true JPWO2023190246A5 (https=) 2024-10-18

Family

ID=88201638

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024512409A Pending JPWO2023190246A1 (https=) 2022-03-31 2023-03-24

Country Status (2)

Country Link
JP (1) JPWO2023190246A1 (https=)
WO (1) WO2023190246A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014086581A (ja) * 2012-10-24 2014-05-12 Nippon Steel & Sumikin Electronics Devices Inc 半導体素子収納用パッケージ
JP2017011216A (ja) * 2015-06-25 2017-01-12 京セラ株式会社 回路基板および電子装置
WO2019163941A1 (ja) * 2018-02-22 2019-08-29 京セラ株式会社 パワーモジュール用基板およびパワーモジュール
JP2022000871A (ja) * 2018-07-31 2022-01-04 京セラ株式会社 電気回路基板及びパワーモジュール

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