JPWO2023190246A1 - - Google Patents
Info
- Publication number
- JPWO2023190246A1 JPWO2023190246A1 JP2024512409A JP2024512409A JPWO2023190246A1 JP WO2023190246 A1 JPWO2023190246 A1 JP WO2023190246A1 JP 2024512409 A JP2024512409 A JP 2024512409A JP 2024512409 A JP2024512409 A JP 2024512409A JP WO2023190246 A1 JPWO2023190246 A1 JP WO2023190246A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/10—Arrangements for heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022059779 | 2022-03-31 | ||
| PCT/JP2023/011999 WO2023190246A1 (ja) | 2022-03-31 | 2023-03-24 | 回路基板及びその製造方法、並びにパワーモジュール |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023190246A1 true JPWO2023190246A1 (https=) | 2023-10-05 |
| JPWO2023190246A5 JPWO2023190246A5 (https=) | 2024-10-18 |
Family
ID=88201638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024512409A Pending JPWO2023190246A1 (https=) | 2022-03-31 | 2023-03-24 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2023190246A1 (https=) |
| WO (1) | WO2023190246A1 (https=) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014086581A (ja) * | 2012-10-24 | 2014-05-12 | Nippon Steel & Sumikin Electronics Devices Inc | 半導体素子収納用パッケージ |
| JP2017011216A (ja) * | 2015-06-25 | 2017-01-12 | 京セラ株式会社 | 回路基板および電子装置 |
| WO2019163941A1 (ja) * | 2018-02-22 | 2019-08-29 | 京セラ株式会社 | パワーモジュール用基板およびパワーモジュール |
| JP2022000871A (ja) * | 2018-07-31 | 2022-01-04 | 京セラ株式会社 | 電気回路基板及びパワーモジュール |
-
2023
- 2023-03-24 JP JP2024512409A patent/JPWO2023190246A1/ja active Pending
- 2023-03-24 WO PCT/JP2023/011999 patent/WO2023190246A1/ja not_active Ceased
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014086581A (ja) * | 2012-10-24 | 2014-05-12 | Nippon Steel & Sumikin Electronics Devices Inc | 半導体素子収納用パッケージ |
| JP2017011216A (ja) * | 2015-06-25 | 2017-01-12 | 京セラ株式会社 | 回路基板および電子装置 |
| WO2019163941A1 (ja) * | 2018-02-22 | 2019-08-29 | 京セラ株式会社 | パワーモジュール用基板およびパワーモジュール |
| JP2022000871A (ja) * | 2018-07-31 | 2022-01-04 | 京セラ株式会社 | 電気回路基板及びパワーモジュール |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023190246A1 (ja) | 2023-10-05 |
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