JP2007096265A5 - - Google Patents

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Publication number
JP2007096265A5
JP2007096265A5 JP2006168458A JP2006168458A JP2007096265A5 JP 2007096265 A5 JP2007096265 A5 JP 2007096265A5 JP 2006168458 A JP2006168458 A JP 2006168458A JP 2006168458 A JP2006168458 A JP 2006168458A JP 2007096265 A5 JP2007096265 A5 JP 2007096265A5
Authority
JP
Japan
Prior art keywords
electrode layer
internal electrode
capacitor
dielectric
dummy electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006168458A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007096265A (ja
JP4550774B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006168458A priority Critical patent/JP4550774B2/ja
Priority claimed from JP2006168458A external-priority patent/JP4550774B2/ja
Priority to US11/512,247 priority patent/US7573697B2/en
Publication of JP2007096265A publication Critical patent/JP2007096265A/ja
Priority to US12/497,198 priority patent/US7778010B2/en
Publication of JP2007096265A5 publication Critical patent/JP2007096265A5/ja
Application granted granted Critical
Publication of JP4550774B2 publication Critical patent/JP4550774B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2006168458A 2005-08-31 2006-06-19 配線基板内蔵用コンデンサ、配線基板、積層体、コンデンサ集合体、配線基板内蔵用コンデンサ製造方法 Expired - Fee Related JP4550774B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2006168458A JP4550774B2 (ja) 2005-08-31 2006-06-19 配線基板内蔵用コンデンサ、配線基板、積層体、コンデンサ集合体、配線基板内蔵用コンデンサ製造方法
US11/512,247 US7573697B2 (en) 2005-08-31 2006-08-30 Method of manufacturing capacitor for incorporation in wiring board, capacitor for incorporation in wiring board, and wiring board
US12/497,198 US7778010B2 (en) 2005-08-31 2009-07-02 Method of manufacturing capacitor for incorporation in wiring board, capacitor for incorporation in wiring board, and wiring board

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005251953 2005-08-31
JP2006168458A JP4550774B2 (ja) 2005-08-31 2006-06-19 配線基板内蔵用コンデンサ、配線基板、積層体、コンデンサ集合体、配線基板内蔵用コンデンサ製造方法

Publications (3)

Publication Number Publication Date
JP2007096265A JP2007096265A (ja) 2007-04-12
JP2007096265A5 true JP2007096265A5 (https=) 2010-04-22
JP4550774B2 JP4550774B2 (ja) 2010-09-22

Family

ID=37981537

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006168458A Expired - Fee Related JP4550774B2 (ja) 2005-08-31 2006-06-19 配線基板内蔵用コンデンサ、配線基板、積層体、コンデンサ集合体、配線基板内蔵用コンデンサ製造方法

Country Status (1)

Country Link
JP (1) JP4550774B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009127252A1 (de) * 2008-04-16 2009-10-22 Osram Gesellschaft mit beschränkter Haftung Elektronisches vorschaltgerät
JP2019079987A (ja) * 2017-10-26 2019-05-23 京セラ株式会社 電子素子実装用基板、電子装置および電子モジュール
WO2023127470A1 (ja) * 2021-12-27 2023-07-06 株式会社村田製作所 積層セラミックコンデンサの製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05175071A (ja) * 1991-12-26 1993-07-13 Matsushita Electric Ind Co Ltd 積層セラミックコンデンサ
JP2003198139A (ja) * 2001-12-25 2003-07-11 Kyocera Corp コンデンサ素子内蔵多層配線基板
JP2004235371A (ja) * 2003-01-29 2004-08-19 Kyocera Corp コンデンサ素子内蔵多層配線基板
JP2005039243A (ja) * 2003-06-24 2005-02-10 Ngk Spark Plug Co Ltd 中間基板

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