JPWO2023189996A5 - - Google Patents
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- Publication number
- JPWO2023189996A5 JPWO2023189996A5 JP2023552516A JP2023552516A JPWO2023189996A5 JP WO2023189996 A5 JPWO2023189996 A5 JP WO2023189996A5 JP 2023552516 A JP2023552516 A JP 2023552516A JP 2023552516 A JP2023552516 A JP 2023552516A JP WO2023189996 A5 JPWO2023189996 A5 JP WO2023189996A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- molding resin
- molding
- measured
- composition according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000465 moulding Methods 0.000 claims 48
- 239000011342 resin composition Substances 0.000 claims 46
- 238000000034 method Methods 0.000 claims 19
- 238000002347 injection Methods 0.000 claims 10
- 239000007924 injection Substances 0.000 claims 10
- 238000005259 measurement Methods 0.000 claims 8
- 238000001721 transfer moulding Methods 0.000 claims 8
- 239000003795 chemical substances by application Substances 0.000 claims 6
- 239000003822 epoxy resin Substances 0.000 claims 6
- 229920000647 polyepoxide Polymers 0.000 claims 6
- 238000004519 manufacturing process Methods 0.000 claims 5
- 229920003986 novolac Polymers 0.000 claims 5
- 239000003054 catalyst Substances 0.000 claims 4
- 238000007789 sealing Methods 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims 3
- 230000005484 gravity Effects 0.000 claims 3
- 229920001568 phenolic resin Polymers 0.000 claims 3
- 239000005011 phenolic resin Substances 0.000 claims 3
- 239000007787 solid Substances 0.000 claims 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 2
- 229930003836 cresol Natural products 0.000 claims 2
- 230000009477 glass transition Effects 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims 2
- 230000000930 thermomechanical effect Effects 0.000 claims 2
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 claims 1
- -1 imidazole compound Chemical class 0.000 claims 1
- 239000011256 inorganic filler Substances 0.000 claims 1
- 229910003475 inorganic filler Inorganic materials 0.000 claims 1
- 238000011417 postcuring Methods 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022058500 | 2022-03-31 | ||
| JP2022058500 | 2022-03-31 | ||
| PCT/JP2023/011406 WO2023189996A1 (ja) | 2022-03-31 | 2023-03-23 | 成形用樹脂組成物、封止構造体の製造方法および封止構造体 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023189996A1 JPWO2023189996A1 (https=) | 2023-10-05 |
| JPWO2023189996A5 true JPWO2023189996A5 (https=) | 2024-03-08 |
| JP7501801B2 JP7501801B2 (ja) | 2024-06-18 |
Family
ID=88201921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023552516A Active JP7501801B2 (ja) | 2022-03-31 | 2023-03-23 | 成形用樹脂組成物、封止構造体の製造方法および封止構造体 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7501801B2 (https=) |
| CN (1) | CN118872047A (https=) |
| TW (1) | TW202348678A (https=) |
| WO (1) | WO2023189996A1 (https=) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001196400A (ja) | 2000-01-11 | 2001-07-19 | Sanyo Electric Co Ltd | 半導体装置の製造方法 |
| JP5649294B2 (ja) | 2008-09-30 | 2015-01-07 | キヤノン株式会社 | インナーロータ型ブラシレスモータ |
| JP6221382B2 (ja) | 2013-06-14 | 2017-11-01 | 日立化成株式会社 | エポキシ樹脂組成物及び電子部品装置 |
| JP7126186B2 (ja) | 2016-05-19 | 2022-08-26 | パナソニックＩｐマネジメント株式会社 | 封止用樹脂組成物、その硬化物、及び半導体装置 |
| JP7302166B2 (ja) | 2018-12-10 | 2023-07-04 | 住友ベークライト株式会社 | ステータコア絶縁用樹脂組成物 |
| JP2021015932A (ja) | 2019-07-16 | 2021-02-12 | 住友ベークライト株式会社 | 封止樹脂組成物およびモールドコイル |
| JP7258213B2 (ja) | 2020-02-26 | 2023-04-14 | 三菱電機株式会社 | ステータ、電動機、送風機、空気調和装置およびステータの製造方法 |
-
2023
- 2023-03-23 CN CN202380027928.6A patent/CN118872047A/zh active Pending
- 2023-03-23 WO PCT/JP2023/011406 patent/WO2023189996A1/ja not_active Ceased
- 2023-03-23 JP JP2023552516A patent/JP7501801B2/ja active Active
- 2023-03-27 TW TW112111513A patent/TW202348678A/zh unknown
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