JP7501801B2 - 成形用樹脂組成物、封止構造体の製造方法および封止構造体 - Google Patents

成形用樹脂組成物、封止構造体の製造方法および封止構造体 Download PDF

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Publication number
JP7501801B2
JP7501801B2 JP2023552516A JP2023552516A JP7501801B2 JP 7501801 B2 JP7501801 B2 JP 7501801B2 JP 2023552516 A JP2023552516 A JP 2023552516A JP 2023552516 A JP2023552516 A JP 2023552516A JP 7501801 B2 JP7501801 B2 JP 7501801B2
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Prior art keywords
resin composition
molding resin
molding
mass
measured
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JP2023552516A
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Japanese (ja)
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JPWO2023189996A5 (https=
JPWO2023189996A1 (https=
Inventor
和彦 嶽出
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Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2023552516A 2022-03-31 2023-03-23 成形用樹脂組成物、封止構造体の製造方法および封止構造体 Active JP7501801B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022058500 2022-03-31
JP2022058500 2022-03-31
PCT/JP2023/011406 WO2023189996A1 (ja) 2022-03-31 2023-03-23 成形用樹脂組成物、封止構造体の製造方法および封止構造体

Publications (3)

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JPWO2023189996A1 JPWO2023189996A1 (https=) 2023-10-05
JPWO2023189996A5 JPWO2023189996A5 (https=) 2024-03-08
JP7501801B2 true JP7501801B2 (ja) 2024-06-18

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JP2023552516A Active JP7501801B2 (ja) 2022-03-31 2023-03-23 成形用樹脂組成物、封止構造体の製造方法および封止構造体

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JP (1) JP7501801B2 (https=)
CN (1) CN118872047A (https=)
TW (1) TW202348678A (https=)
WO (1) WO2023189996A1 (https=)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001196400A (ja) 2000-01-11 2001-07-19 Sanyo Electric Co Ltd 半導体装置の製造方法
JP2010110198A (ja) 2008-09-30 2010-05-13 Canon Inc インナーロータ型ブラシレスモータ
JP2015000941A (ja) 2013-06-14 2015-01-05 日立化成株式会社 エポキシ樹脂組成物及び電子部品装置
JP2017206631A (ja) 2016-05-19 2017-11-24 パナソニックＩｐマネジメント株式会社 封止用樹脂組成物、その硬化物、及び半導体装置
JP2020094092A (ja) 2018-12-10 2020-06-18 住友ベークライト株式会社 ステータコア絶縁用樹脂組成物
JP2021015932A (ja) 2019-07-16 2021-02-12 住友ベークライト株式会社 封止樹脂組成物およびモールドコイル
WO2021171435A1 (ja) 2020-02-26 2021-09-02 三菱電機株式会社 ステータ、電動機、送風機、空気調和装置およびステータの製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001196400A (ja) 2000-01-11 2001-07-19 Sanyo Electric Co Ltd 半導体装置の製造方法
JP2010110198A (ja) 2008-09-30 2010-05-13 Canon Inc インナーロータ型ブラシレスモータ
JP2015000941A (ja) 2013-06-14 2015-01-05 日立化成株式会社 エポキシ樹脂組成物及び電子部品装置
JP2017206631A (ja) 2016-05-19 2017-11-24 パナソニックＩｐマネジメント株式会社 封止用樹脂組成物、その硬化物、及び半導体装置
JP2020094092A (ja) 2018-12-10 2020-06-18 住友ベークライト株式会社 ステータコア絶縁用樹脂組成物
JP2021015932A (ja) 2019-07-16 2021-02-12 住友ベークライト株式会社 封止樹脂組成物およびモールドコイル
WO2021171435A1 (ja) 2020-02-26 2021-09-02 三菱電機株式会社 ステータ、電動機、送風機、空気調和装置およびステータの製造方法

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JPWO2023189996A1 (https=) 2023-10-05
CN118872047A (zh) 2024-10-29
TW202348678A (zh) 2023-12-16
WO2023189996A1 (ja) 2023-10-05

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