CN118872047A - 成型用树脂组合物、密封结构体的制造方法和密封结构体 - Google Patents

成型用树脂组合物、密封结构体的制造方法和密封结构体 Download PDF

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Publication number
CN118872047A
CN118872047A CN202380027928.6A CN202380027928A CN118872047A CN 118872047 A CN118872047 A CN 118872047A CN 202380027928 A CN202380027928 A CN 202380027928A CN 118872047 A CN118872047 A CN 118872047A
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CN
China
Prior art keywords
resin composition
molding resin
molding
measured
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380027928.6A
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English (en)
Chinese (zh)
Inventor
嶽出和彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Publication of CN118872047A publication Critical patent/CN118872047A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN202380027928.6A 2022-03-31 2023-03-23 成型用树脂组合物、密封结构体的制造方法和密封结构体 Pending CN118872047A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022058500 2022-03-31
JP2022-058500 2022-03-31
PCT/JP2023/011406 WO2023189996A1 (ja) 2022-03-31 2023-03-23 成形用樹脂組成物、封止構造体の製造方法および封止構造体

Publications (1)

Publication Number Publication Date
CN118872047A true CN118872047A (zh) 2024-10-29

Family

ID=88201921

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380027928.6A Pending CN118872047A (zh) 2022-03-31 2023-03-23 成型用树脂组合物、密封结构体的制造方法和密封结构体

Country Status (4)

Country Link
JP (1) JP7501801B2 (https=)
CN (1) CN118872047A (https=)
TW (1) TW202348678A (https=)
WO (1) WO2023189996A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001196400A (ja) 2000-01-11 2001-07-19 Sanyo Electric Co Ltd 半導体装置の製造方法
JP5649294B2 (ja) 2008-09-30 2015-01-07 キヤノン株式会社 インナーロータ型ブラシレスモータ
JP6221382B2 (ja) 2013-06-14 2017-11-01 日立化成株式会社 エポキシ樹脂組成物及び電子部品装置
JP7126186B2 (ja) 2016-05-19 2022-08-26 パナソニックＩｐマネジメント株式会社 封止用樹脂組成物、その硬化物、及び半導体装置
JP7302166B2 (ja) 2018-12-10 2023-07-04 住友ベークライト株式会社 ステータコア絶縁用樹脂組成物
JP2021015932A (ja) 2019-07-16 2021-02-12 住友ベークライト株式会社 封止樹脂組成物およびモールドコイル
JP7258213B2 (ja) 2020-02-26 2023-04-14 三菱電機株式会社 ステータ、電動機、送風機、空気調和装置およびステータの製造方法

Also Published As

Publication number Publication date
JPWO2023189996A1 (https=) 2023-10-05
JP7501801B2 (ja) 2024-06-18
TW202348678A (zh) 2023-12-16
WO2023189996A1 (ja) 2023-10-05

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