JPWO2023181210A5 - - Google Patents
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- Publication number
- JPWO2023181210A5 JPWO2023181210A5 JP2023541088A JP2023541088A JPWO2023181210A5 JP WO2023181210 A5 JPWO2023181210 A5 JP WO2023181210A5 JP 2023541088 A JP2023541088 A JP 2023541088A JP 2023541088 A JP2023541088 A JP 2023541088A JP WO2023181210 A5 JPWO2023181210 A5 JP WO2023181210A5
- Authority
- JP
- Japan
- Prior art keywords
- wiring member
- upper wiring
- lower wiring
- metal layer
- face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 37
- 229910052751 metal Inorganic materials 0.000 claims 18
- 239000002184 metal Substances 0.000 claims 18
- 238000006243 chemical reaction Methods 0.000 claims 4
- 238000004519 manufacturing process Methods 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/013670 WO2023181210A1 (ja) | 2022-03-23 | 2022-03-23 | 半導体装置及びその製造方法並びに電力変換装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023181210A1 JPWO2023181210A1 (https=) | 2023-09-28 |
| JP7438466B1 JP7438466B1 (ja) | 2024-02-26 |
| JPWO2023181210A5 true JPWO2023181210A5 (https=) | 2024-03-01 |
Family
ID=88100567
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023541088A Active JP7438466B1 (ja) | 2022-03-23 | 2022-03-23 | 半導体装置及びその製造方法並びに電力変換装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250192098A1 (https=) |
| JP (1) | JP7438466B1 (https=) |
| CN (1) | CN118891704A (https=) |
| DE (1) | DE112022006886T5 (https=) |
| WO (1) | WO2023181210A1 (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3262657B2 (ja) * | 1993-12-14 | 2002-03-04 | 株式会社日立製作所 | ボンディング方法及びボンディング構造 |
| DE102014109766B3 (de) | 2014-07-11 | 2015-04-02 | Heraeus Deutschland GmbH & Co. KG | Verfahren zum Herstellen eines Substratadapters, Substratadapter und Verfahren zum Kontaktieren eines Halbleiterelements |
| CN110832628A (zh) * | 2017-07-07 | 2020-02-21 | 三菱电机株式会社 | 半导体装置、以及半导体装置的制造方法 |
| JP7383881B2 (ja) * | 2019-01-16 | 2023-11-21 | 富士電機株式会社 | 半導体装置および半導体装置の製造方法 |
| DE102019111963A1 (de) * | 2019-05-08 | 2020-11-12 | Danfoss Silicon Power Gmbh | Halbleitermodul mit einem Halbleiter und mit einem Metallformteil, der vom Halbleiter elektrisch kontaktiert wird |
| DE112020007480T5 (de) * | 2020-08-03 | 2023-05-17 | Mitsubishi Electric Corporation | Halbleitereinheit, herstellungsverfahren für dieselbe und leistungswandler |
-
2022
- 2022-03-23 JP JP2023541088A patent/JP7438466B1/ja active Active
- 2022-03-23 US US18/845,441 patent/US20250192098A1/en active Pending
- 2022-03-23 WO PCT/JP2022/013670 patent/WO2023181210A1/ja not_active Ceased
- 2022-03-23 DE DE112022006886.8T patent/DE112022006886T5/de active Pending
- 2022-03-23 CN CN202280093758.7A patent/CN118891704A/zh active Pending
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