JPWO2023033031A1 - - Google Patents
Info
- Publication number
- JPWO2023033031A1 JPWO2023033031A1 JP2023545633A JP2023545633A JPWO2023033031A1 JP WO2023033031 A1 JPWO2023033031 A1 JP WO2023033031A1 JP 2023545633 A JP2023545633 A JP 2023545633A JP 2023545633 A JP2023545633 A JP 2023545633A JP WO2023033031 A1 JPWO2023033031 A1 JP WO2023033031A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/20—Compounding polymers with additives, e.g. colouring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021140799 | 2021-08-31 | ||
| PCT/JP2022/032737 WO2023033031A1 (ja) | 2021-08-31 | 2022-08-31 | 顆粒状硬化性シリコーン組成物、その硬化物、およびその製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2023033031A1 true JPWO2023033031A1 (ja) | 2023-03-09 |
Family
ID=85411375
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023545633A Pending JPWO2023033031A1 (ja) | 2021-08-31 | 2022-08-31 |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP4397718A1 (ja) |
| JP (1) | JPWO2023033031A1 (ja) |
| KR (1) | KR20240052022A (ja) |
| CN (1) | CN117858923A (ja) |
| TW (1) | TW202323394A (ja) |
| WO (1) | WO2023033031A1 (ja) |
Family Cites Families (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS528854B2 (ja) | 1972-01-13 | 1977-03-11 | ||
| JP3831481B2 (ja) | 1996-11-18 | 2006-10-11 | 東レ・ダウコーニング株式会社 | カルバシラトラン誘導体、その製造方法、接着促進剤、および硬化性シリコーン組成物 |
| JP2012041428A (ja) * | 2010-08-18 | 2012-03-01 | Shin-Etsu Chemical Co Ltd | シリコーン樹脂組成物及び光半導体ケース |
| JP5814175B2 (ja) * | 2012-04-16 | 2015-11-17 | 信越化学工業株式会社 | Ｌｅｄのリフレクター用熱硬化性シリコーン樹脂組成物並びにこれを用いたｌｅｄ用リフレクター及び光半導体装置 |
| JP2015114390A (ja) | 2013-12-09 | 2015-06-22 | 住友ベークライト株式会社 | 接着シート、接着シート付き光導波路、光電気混載基板、光電気混載基板の製造方法、光モジュールおよび電子機器 |
| WO2015146816A1 (ja) | 2014-03-25 | 2015-10-01 | 住友ベークライト株式会社 | エポキシ樹脂組成物および静電容量型指紋センサー |
| JP6455260B2 (ja) | 2015-03-19 | 2019-01-23 | 住友ベークライト株式会社 | コネクター付き光導波路およびコネクター付き光導波路の製造方法 |
| JP2017179185A (ja) | 2016-03-31 | 2017-10-05 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物および半導体装置 |
| JP6930817B2 (ja) | 2016-08-08 | 2021-09-01 | ダウ・東レ株式会社 | 硬化性粒状シリコーン組成物、それからなる半導体用部材、およびその成型方法 |
| KR20180030288A (ko) | 2016-09-12 | 2018-03-22 | 삼성디스플레이 주식회사 | 각필터를 갖는 표시장치 |
| JP7135278B2 (ja) | 2017-04-28 | 2022-09-13 | 住友ベークライト株式会社 | 封止用樹脂組成物及び電子装置の製造方法 |
| US11555119B2 (en) | 2017-06-19 | 2023-01-17 | Dow Toray Co., Ltd. | Curable granular silicone composition, semiconductor member comprising same, and forming method thereof |
| JP6950299B2 (ja) | 2017-06-26 | 2021-10-13 | 住友ベークライト株式会社 | 封止材用樹脂組成物及びこれを用いた電子装置 |
| JP2020023643A (ja) | 2018-08-08 | 2020-02-13 | 住友ベークライト株式会社 | 封止用樹脂組成物、ウエハーレベルパッケージ、パネルレベルパッケージおよび電子装置 |
| JP7155929B2 (ja) | 2018-11-20 | 2022-10-19 | 住友ベークライト株式会社 | モールドアンダーフィル材料および電子装置 |
| JP7247550B2 (ja) | 2018-11-29 | 2023-03-29 | 住友ベークライト株式会社 | 封止用エポキシ樹脂組成物、及び、電子装置 |
| JP7247563B2 (ja) | 2018-12-07 | 2023-03-29 | 住友ベークライト株式会社 | 封止用樹脂組成物およびパワーモジュール |
| JP7243186B2 (ja) | 2018-12-27 | 2023-03-22 | 住友ベークライト株式会社 | 封止用樹脂組成物、中空パッケージおよびその製造方法 |
| JP7283089B2 (ja) | 2019-01-30 | 2023-05-30 | 住友ベークライト株式会社 | 半導体パッケージおよびそれに用いる封止用エポキシ樹脂組成物 |
| JP2020125399A (ja) | 2019-02-04 | 2020-08-20 | 住友ベークライト株式会社 | 半導体封止用樹脂組成物および半導体装置 |
| JP2020132750A (ja) | 2019-02-19 | 2020-08-31 | 住友ベークライト株式会社 | 封止用樹脂組成物およびそれを用いた電子装置 |
| JP2020132771A (ja) | 2019-02-21 | 2020-08-31 | 住友ベークライト株式会社 | 封止用樹脂組成物および電子装置 |
| JP2020152844A (ja) | 2019-03-20 | 2020-09-24 | 住友ベークライト株式会社 | 封止用樹脂組成物および電子装置 |
| JP7354567B2 (ja) | 2019-03-27 | 2023-10-03 | 住友ベークライト株式会社 | 封止用樹脂組成物および半導体装置 |
| JP7509755B2 (ja) * | 2019-03-29 | 2024-07-02 | ダウ・東レ株式会社 | 硬化性シリコーン組成物、その硬化物、およびその製造方法 |
| JP7338287B2 (ja) | 2019-07-18 | 2023-09-05 | 住友ベークライト株式会社 | パッケージ構造体 |
| JP2021024945A (ja) | 2019-08-05 | 2021-02-22 | 住友ベークライト株式会社 | 顆粒状半導体封止用樹脂組成物および半導体装置 |
| JP7318422B2 (ja) | 2019-08-30 | 2023-08-01 | 住友ベークライト株式会社 | 樹脂組成物および成形品 |
| JP6828784B2 (ja) | 2019-09-13 | 2021-02-10 | 住友ベークライト株式会社 | 伸縮性配線基板およびウェアラブルデバイス |
| JP2021080411A (ja) | 2019-11-22 | 2021-05-27 | 住友ベークライト株式会社 | 樹脂成形材料、成形品および成形品の製造方法 |
| JP2021097123A (ja) | 2019-12-17 | 2021-06-24 | 住友ベークライト株式会社 | 半導体パッケージの製造方法 |
| TW202132466A (zh) * | 2019-12-27 | 2021-09-01 | 日商陶氏東麗股份有限公司 | 硬化性熱熔聚矽氧組成物、其硬化物、及含有上述組成物或硬化物之積層體 |
| JP2021015985A (ja) | 2020-10-14 | 2021-02-12 | 住友ベークライト株式会社 | 伸縮性配線基板およびウェアラブルデバイス |
| JP7230936B2 (ja) | 2021-01-06 | 2023-03-01 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物および半導体装置の製造方法 |
-
2022
- 2022-08-30 TW TW111132733A patent/TW202323394A/zh unknown
- 2022-08-31 EP EP22864613.9A patent/EP4397718A1/en active Pending
- 2022-08-31 WO PCT/JP2022/032737 patent/WO2023033031A1/ja active Application Filing
- 2022-08-31 CN CN202280057469.1A patent/CN117858923A/zh active Pending
- 2022-08-31 JP JP2023545633A patent/JPWO2023033031A1/ja active Pending
- 2022-08-31 KR KR1020247010074A patent/KR20240052022A/ko unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR20240052022A (ko) | 2024-04-22 |
| EP4397718A1 (en) | 2024-07-10 |
| TW202323394A (zh) | 2023-06-16 |
| WO2023033031A1 (ja) | 2023-03-09 |
| CN117858923A (zh) | 2024-04-09 |