JPWO2023022148A5 - - Google Patents
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- Publication number
- JPWO2023022148A5 JPWO2023022148A5 JP2023542408A JP2023542408A JPWO2023022148A5 JP WO2023022148 A5 JPWO2023022148 A5 JP WO2023022148A5 JP 2023542408 A JP2023542408 A JP 2023542408A JP 2023542408 A JP2023542408 A JP 2023542408A JP WO2023022148 A5 JPWO2023022148 A5 JP WO2023022148A5
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- cured product
- composition according
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 claims 9
- 229920000647 polyepoxide Polymers 0.000 claims 9
- 239000000203 mixture Substances 0.000 claims 7
- -1 thiol compound Chemical class 0.000 claims 7
- 239000000945 filler Substances 0.000 claims 4
- KAESVJOAVNADME-UHFFFAOYSA-N 1H-pyrrole Natural products C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 239000012964 benzotriazole Substances 0.000 claims 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 1
- 239000003054 catalyst Substances 0.000 claims 1
- 239000008393 encapsulating agent Substances 0.000 claims 1
- 125000003700 epoxy group Chemical group 0.000 claims 1
- 239000003566 sealing material Substances 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- 125000003396 thiol group Chemical group [H]S* 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021134823 | 2021-08-20 | ||
| PCT/JP2022/030949 WO2023022148A1 (ja) | 2021-08-20 | 2022-08-16 | エポキシ樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023022148A1 JPWO2023022148A1 (https=) | 2023-02-23 |
| JPWO2023022148A5 true JPWO2023022148A5 (https=) | 2024-11-28 |
Family
ID=85240599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023542408A Pending JPWO2023022148A1 (https=) | 2021-08-20 | 2022-08-16 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2023022148A1 (https=) |
| TW (1) | TW202319431A (https=) |
| WO (1) | WO2023022148A1 (https=) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6447868B2 (ja) * | 2014-12-22 | 2019-01-09 | 株式会社スリーボンド | 嫌気硬化性接着剤 |
| CN107987287B (zh) * | 2017-11-15 | 2020-09-25 | 中山光禾医疗科技有限公司 | 光致亚硝基交联水凝胶材料及其制备方法与应用 |
| CN112442256B (zh) * | 2020-11-03 | 2021-12-17 | 南京大学 | 一种环氧树脂基高分子材料及其制备方法和应用 |
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2022
- 2022-08-16 TW TW111130796A patent/TW202319431A/zh unknown
- 2022-08-16 JP JP2023542408A patent/JPWO2023022148A1/ja active Pending
- 2022-08-16 WO PCT/JP2022/030949 patent/WO2023022148A1/ja not_active Ceased