JPWO2023120511A5 - - Google Patents
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- Publication number
- JPWO2023120511A5 JPWO2023120511A5 JP2023569456A JP2023569456A JPWO2023120511A5 JP WO2023120511 A5 JPWO2023120511 A5 JP WO2023120511A5 JP 2023569456 A JP2023569456 A JP 2023569456A JP 2023569456 A JP2023569456 A JP 2023569456A JP WO2023120511 A5 JPWO2023120511 A5 JP WO2023120511A5
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- difunctional
- adhesive composition
- composition according
- higher aliphatic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021205733 | 2021-12-20 | ||
| PCT/JP2022/046837 WO2023120511A1 (ja) | 2021-12-20 | 2022-12-20 | 接着剤組成物および積層体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023120511A1 JPWO2023120511A1 (https=) | 2023-06-29 |
| JPWO2023120511A5 true JPWO2023120511A5 (https=) | 2024-09-03 |
Family
ID=86902437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023569456A Pending JPWO2023120511A1 (https=) | 2021-12-20 | 2022-12-20 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20250101280A1 (https=) |
| EP (1) | EP4455242A1 (https=) |
| JP (1) | JPWO2023120511A1 (https=) |
| KR (1) | KR20240124938A (https=) |
| CN (1) | CN118414395A (https=) |
| WO (1) | WO2023120511A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119351025B (zh) * | 2024-12-25 | 2025-08-22 | 清华大学 | 双组分承重型胶粘剂及其制备方法 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4735297B2 (ja) * | 2006-02-03 | 2011-07-27 | 三菱化学株式会社 | エポキシ樹脂硬化層と構造体構成材料が一体化した複合体 |
| JP2008174577A (ja) * | 2007-01-16 | 2008-07-31 | Kyocera Chemical Corp | ダイボンディングペーストおよびそれを用いた半導体装置 |
| CN103930501B (zh) * | 2011-11-14 | 2017-09-12 | Lg化学株式会社 | 粘合膜 |
| ES2748241T3 (es) * | 2013-10-29 | 2020-03-16 | Kaneka Corp | Composición de resina curable que contiene partículas finas de polímero que tiene estabilidad en almacenamiento mejorada |
| JP6632401B2 (ja) | 2016-01-29 | 2020-01-22 | アイシン化工株式会社 | 構造用接着剤組成物 |
| JP2017186483A (ja) * | 2016-04-08 | 2017-10-12 | 積水化学工業株式会社 | 積層シート、接着層及び金属材付き半導体チップの製造方法、及び半導体装置の製造方法 |
| JP2017191801A (ja) | 2016-04-11 | 2017-10-19 | 株式会社小森コーポレーション | 電子デバイス製造装置 |
| JP7167441B2 (ja) | 2016-05-06 | 2022-11-09 | Dic株式会社 | 樹脂組成物、成形体、積層体及び接着剤 |
| JP7024174B2 (ja) * | 2016-08-26 | 2022-02-24 | 味の素株式会社 | 樹脂組成物 |
| EP3529328B1 (en) * | 2016-10-24 | 2020-06-24 | Dow Global Technologies LLC | Epoxy adhesive resistant to open bead humidity exposure |
| JP2019083225A (ja) * | 2017-10-27 | 2019-05-30 | 日立化成株式会社 | アンダーフィル用液状樹脂組成物、電子部品装置、及び電子部品装置の製造方法 |
| US11932785B2 (en) * | 2018-03-28 | 2024-03-19 | Sekisui Chemical Co., Ltd. | Epoxy adhesive composition |
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2022
- 2022-12-20 EP EP22911213.1A patent/EP4455242A1/en not_active Withdrawn
- 2022-12-20 JP JP2023569456A patent/JPWO2023120511A1/ja active Pending
- 2022-12-20 CN CN202280082737.5A patent/CN118414395A/zh not_active Withdrawn
- 2022-12-20 WO PCT/JP2022/046837 patent/WO2023120511A1/ja not_active Ceased
- 2022-12-20 US US18/720,880 patent/US20250101280A1/en active Pending
- 2022-12-20 KR KR1020247022286A patent/KR20240124938A/ko active Pending