JPWO2024100934A5 - - Google Patents

Info

Publication number
JPWO2024100934A5
JPWO2024100934A5 JP2024557025A JP2024557025A JPWO2024100934A5 JP WO2024100934 A5 JPWO2024100934 A5 JP WO2024100934A5 JP 2024557025 A JP2024557025 A JP 2024557025A JP 2024557025 A JP2024557025 A JP 2024557025A JP WO2024100934 A5 JPWO2024100934 A5 JP WO2024100934A5
Authority
JP
Japan
Prior art keywords
epoxy resin
resin composition
filler
polished surface
cured product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024557025A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024100934A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/026781 external-priority patent/WO2024100934A1/ja
Publication of JPWO2024100934A1 publication Critical patent/JPWO2024100934A1/ja
Publication of JPWO2024100934A5 publication Critical patent/JPWO2024100934A5/ja
Pending legal-status Critical Current

Links

JP2024557025A 2022-11-10 2023-07-21 Pending JPWO2024100934A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022180433 2022-11-10
PCT/JP2023/026781 WO2024100934A1 (ja) 2022-11-10 2023-07-21 エポキシ樹脂組成物、電子部品実装構造体および電子部品実装構造体の製造方法

Publications (2)

Publication Number Publication Date
JPWO2024100934A1 JPWO2024100934A1 (https=) 2024-05-16
JPWO2024100934A5 true JPWO2024100934A5 (https=) 2025-07-22

Family

ID=91032570

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024557025A Pending JPWO2024100934A1 (https=) 2022-11-10 2023-07-21

Country Status (4)

Country Link
JP (1) JPWO2024100934A1 (https=)
KR (1) KR20250105356A (https=)
TW (1) TW202419504A (https=)
WO (1) WO2024100934A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025254026A1 (ja) * 2024-06-05 2025-12-11 ナミックス株式会社 エポキシ樹脂組成物、硬化物、及び半導体装置
WO2026009778A1 (ja) * 2024-07-03 2026-01-08 ナミックス株式会社 エポキシ樹脂組成物、硬化物、半導体装置、及び半導体装置の製造方法
WO2026009780A1 (ja) * 2024-07-03 2026-01-08 ナミックス株式会社 エポキシ樹脂組成物、硬化物、半導体装置、及び半導体装置の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4176619B2 (ja) * 2003-07-18 2008-11-05 信越化学工業株式会社 フリップチップ実装用サイドフィル材及び半導体装置
TWI898612B (zh) * 2017-05-31 2025-09-21 日商力森諾科股份有限公司 壓縮成形用液狀樹脂組成物及電子零件裝置
US11608435B2 (en) * 2017-06-09 2023-03-21 Nagase Chemtex Corporation Epoxy resin composition, electronic component mounting structure, and method for producing the same
KR102581569B1 (ko) * 2017-10-10 2023-10-05 아지노모토 가부시키가이샤 경화체 및 이의 제조방법, 수지 시트 및 수지 조성물
JP7148946B2 (ja) * 2017-12-21 2022-10-06 ナミックス株式会社 樹脂組成物
JP7631828B2 (ja) * 2021-01-22 2025-02-19 味の素株式会社 樹脂組成物、樹脂ペースト、硬化物、半導体チップパッケージ及び半導体装置

Similar Documents

Publication Publication Date Title
CN102234187B (zh) 一种陶瓷复合材料及其制备方法
JP3469446B2 (ja) 樹脂組成物およびこれを用いた樹脂封止型半導体装置の製造方法
JP2001519838A (ja) エポキシシロキサン及びポリエポキシ樹脂のダイス接着剤又はカプセル材
JPWO2023089878A5 (https=)
JP2009513019A5 (https=)
JPWO2024100934A5 (https=)
CN1413814A (zh) 短切原丝和由其制得的不饱和聚酯树脂bmc的模塑产品
CN108424652B (zh) 一种加成型硅胶及其制备方法与应用
CN1670105A (zh) 一种用于低温的改性环氧树脂胶粘剂
JP2019196476A (ja) プリント回路基板及びｉｃパッケージ用樹脂組成物、並びにこれを用いた製品
JP2013008861A (ja) 半導体装置、その製造方法及び製造装置
KR102051375B1 (ko) 인쇄회로기판 및 ic 패키지용 수지 조성물, 및 이를 이용한 제품
JPH0253850A (ja) エポキシ樹脂組成物
JP3578592B2 (ja) 半導体用ダイアタッチ樹脂ペースト
JP4366700B2 (ja) 半導体素子のパッケージの製造方法
TWI883742B (zh) 樹脂組合物及其配製方法與預浸片
JPWO2023182485A5 (https=)
JPH05267371A (ja) 樹脂封止型半導体装置
CN116512519B (zh) 一种热固性复合材料与塑胶装配结构快速复合工艺
JPH01261451A (ja) 半導体装置等用エポキシ樹脂封止組成物
EP1410440A2 (en) Layered dielectric nanoporous material and methods of producing same
CN103117233B (zh) 旋转固化
JPWO2025109864A5 (https=)
JPWO2023171798A5 (https=)
JP2017136864A5 (https=)