JPWO2023182485A5 - - Google Patents
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- Publication number
- JPWO2023182485A5 JPWO2023182485A5 JP2023557810A JP2023557810A JPWO2023182485A5 JP WO2023182485 A5 JPWO2023182485 A5 JP WO2023182485A5 JP 2023557810 A JP2023557810 A JP 2023557810A JP 2023557810 A JP2023557810 A JP 2023557810A JP WO2023182485 A5 JPWO2023182485 A5 JP WO2023182485A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- sealing resin
- sealing
- manufacturing
- mass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 claims description 54
- 238000007789 sealing Methods 0.000 claims description 52
- 238000004519 manufacturing process Methods 0.000 claims description 25
- 239000003822 epoxy resin Substances 0.000 claims description 18
- 229920000647 polyepoxide Polymers 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 15
- 239000003795 chemical substances by application Substances 0.000 claims description 10
- 239000011256 inorganic filler Substances 0.000 claims description 10
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 10
- 238000000465 moulding Methods 0.000 claims description 6
- ARNKHYQYAZLEEP-UHFFFAOYSA-N 1-naphthalen-1-yloxynaphthalene Chemical group C1=CC=C2C(OC=3C4=CC=CC=C4C=CC=3)=CC=CC2=C1 ARNKHYQYAZLEEP-UHFFFAOYSA-N 0.000 claims description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 4
- 230000009477 glass transition Effects 0.000 claims description 4
- 229920001568 phenolic resin Polymers 0.000 claims description 4
- 239000005011 phenolic resin Substances 0.000 claims description 4
- 150000003852 triazoles Chemical class 0.000 claims description 4
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 claims description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022050381 | 2022-03-25 | ||
| JP2022050381 | 2022-03-25 | ||
| PCT/JP2023/011749 WO2023182485A1 (ja) | 2022-03-25 | 2023-03-24 | 封止用樹脂組成物および片面封止構造体の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023182485A1 JPWO2023182485A1 (https=) | 2023-09-28 |
| JPWO2023182485A5 true JPWO2023182485A5 (https=) | 2024-03-01 |
| JP7552931B2 JP7552931B2 (ja) | 2024-09-18 |
Family
ID=88101652
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023557810A Active JP7552931B2 (ja) | 2022-03-25 | 2023-03-24 | 封止用樹脂組成物および片面封止構造体の製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20250197628A1 (https=) |
| EP (1) | EP4503118A4 (https=) |
| JP (1) | JP7552931B2 (https=) |
| KR (1) | KR20240163145A (https=) |
| CN (1) | CN118946963A (https=) |
| WO (1) | WO2023182485A1 (https=) |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003277486A (ja) * | 2002-03-26 | 2003-10-02 | Matsushita Electric Works Ltd | 片面封止用エポキシ樹脂組成物及び片面封止型半導体装置 |
| JP2004115583A (ja) * | 2002-09-24 | 2004-04-15 | Hitachi Chem Co Ltd | 封止用エポキシ樹脂成形材料及び電子部品装置 |
| CN1802883A (zh) | 2003-07-03 | 2006-07-12 | 株式会社日立制作所 | 组件装置及其制造方法 |
| JP2006100489A (ja) * | 2004-09-29 | 2006-04-13 | Ricoh Co Ltd | プリント基板及びそのプリント基板を用いた電子ユニット並びに樹脂流出防止用ダムの形成方法 |
| CN101124233B (zh) * | 2005-02-18 | 2012-12-05 | 日立化成工业株式会社 | 新型固化性树脂及其制造方法、及环氧树脂组合物、电子部件装置 |
| JP2009001638A (ja) * | 2007-06-20 | 2009-01-08 | Kyocera Chemical Corp | 成形用樹脂組成物、成形品および半導体パッケージ |
| JP2009206314A (ja) * | 2008-02-28 | 2009-09-10 | Kyocera Chemical Corp | 片面樹脂封止型半導体装置 |
| JP2009235164A (ja) * | 2008-03-26 | 2009-10-15 | Panasonic Electric Works Co Ltd | 半導体封止用エポキシ樹脂組成物、及び該組成物を用いて半導体素子を封止して得られる片面封止型半導体装置 |
| JP2009256475A (ja) * | 2008-04-17 | 2009-11-05 | Nitto Denko Corp | 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置 |
| JP2011258603A (ja) * | 2010-06-04 | 2011-12-22 | Kyocera Chemical Corp | 半導体封止装置および封止用樹脂組成物 |
| JP2012111844A (ja) * | 2010-11-24 | 2012-06-14 | Panasonic Corp | 封止用エポキシ樹脂組成物及びこれを用いて封止した半導体装置 |
| JP6409390B2 (ja) * | 2014-07-28 | 2018-10-24 | 住友ベークライト株式会社 | 配線基板、半導体パッケージ、電子装置、配線基板の製造方法、および半導体パッケージの製造方法 |
| US10850627B2 (en) | 2015-12-04 | 2020-12-01 | Cyberswitchingpatents, Llc | Electric vehicle charging system |
| JP2018172545A (ja) * | 2017-03-31 | 2018-11-08 | 日立化成株式会社 | 圧縮成形用固形封止材、半導体装置の製造方法及び半導体装置 |
| JP2019026715A (ja) * | 2017-07-28 | 2019-02-21 | 住友ベークライト株式会社 | 一括封止用エポキシ樹脂組成物、電子装置およびその製造方法 |
| PH12021551530A1 (en) * | 2018-12-27 | 2022-03-14 | Sumitomo Bakelite Co | Resin composition for sealing, semiconductor device, and method for producing semiconductor device |
-
2023
- 2023-03-24 JP JP2023557810A patent/JP7552931B2/ja active Active
- 2023-03-24 EP EP23775078.1A patent/EP4503118A4/en active Pending
- 2023-03-24 US US18/848,177 patent/US20250197628A1/en active Pending
- 2023-03-24 WO PCT/JP2023/011749 patent/WO2023182485A1/ja not_active Ceased
- 2023-03-24 KR KR1020247034955A patent/KR20240163145A/ko active Pending
- 2023-03-24 CN CN202380029988.1A patent/CN118946963A/zh active Pending
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