JPWO2025109864A5 - - Google Patents

Info

Publication number
JPWO2025109864A5
JPWO2025109864A5 JP2025502819A JP2025502819A JPWO2025109864A5 JP WO2025109864 A5 JPWO2025109864 A5 JP WO2025109864A5 JP 2025502819 A JP2025502819 A JP 2025502819A JP 2025502819 A JP2025502819 A JP 2025502819A JP WO2025109864 A5 JPWO2025109864 A5 JP WO2025109864A5
Authority
JP
Japan
Prior art keywords
epoxy resin
resin composition
support
laminate
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2025502819A
Other languages
English (en)
Japanese (ja)
Other versions
JP7671555B1 (ja
JPWO2025109864A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/034267 external-priority patent/WO2025109864A1/ja
Priority to JP2025066005A priority Critical patent/JP2025106523A/ja
Application granted granted Critical
Publication of JP7671555B1 publication Critical patent/JP7671555B1/ja
Publication of JPWO2025109864A1 publication Critical patent/JPWO2025109864A1/ja
Publication of JPWO2025109864A5 publication Critical patent/JPWO2025109864A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2025502819A 2023-11-24 2024-09-25 半導体装置の製造方法及び封止体 Active JP7671555B1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025066005A JP2025106523A (ja) 2023-11-24 2025-04-14 半導体装置の製造方法及び封止体

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023199116 2023-11-24
JP2023199116 2023-11-24
PCT/JP2024/034267 WO2025109864A1 (ja) 2023-11-24 2024-09-25 半導体装置の製造方法及び封止体

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025066005A Division JP2025106523A (ja) 2023-11-24 2025-04-14 半導体装置の製造方法及び封止体

Publications (3)

Publication Number Publication Date
JP7671555B1 JP7671555B1 (ja) 2025-05-02
JPWO2025109864A1 JPWO2025109864A1 (https=) 2025-05-30
JPWO2025109864A5 true JPWO2025109864A5 (https=) 2025-10-23

Family

ID=95513914

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2025502819A Active JP7671555B1 (ja) 2023-11-24 2024-09-25 半導体装置の製造方法及び封止体
JP2025066005A Pending JP2025106523A (ja) 2023-11-24 2025-04-14 半導体装置の製造方法及び封止体

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025066005A Pending JP2025106523A (ja) 2023-11-24 2025-04-14 半導体装置の製造方法及び封止体

Country Status (1)

Country Link
JP (2) JP7671555B1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4270969B2 (ja) * 2002-07-16 2009-06-03 長瀬産業株式会社 半導体装置の樹脂封止方法
JP6730206B2 (ja) * 2017-02-23 2020-07-29 アピックヤマダ株式会社 樹脂供給装置、樹脂供給方法および樹脂成形装置
PT3620481T (pt) * 2017-05-31 2024-04-08 Namics Corp Composição de resina líquida para selagem e dispositivo de componentes eletrónicos
TWI861179B (zh) * 2019-08-23 2024-11-11 日商長瀨化成股份有限公司 密封結構體之製造方法
JP7582065B2 (ja) * 2020-06-12 2024-11-13 味の素株式会社 樹脂組成物
TWI883181B (zh) * 2020-06-23 2025-05-11 日商納美仕有限公司 液狀壓縮成型材
WO2023047702A1 (ja) * 2021-09-22 2023-03-30 ナミックス株式会社 液状コンプレッションモールド材、電子部品、半導体装置、および半導体装置の製造方法

Similar Documents

Publication Publication Date Title
CN105555848B (zh) 半导体芯片密封用热固化性树脂片及半导体封装体的制造方法
KR20040041486A (ko) 몰드수지 밀봉형 파워 반도체장치 및 그 제조방법
CN105636359B (zh) 封装基板阻焊加工方法
KR20140043878A (ko) 반도체 장치의 제조 방법 및 반도체 장치
JP2025029091A5 (https=)
CN103687900A (zh) 荧光树脂膜的制造方法以及由此制造的荧光树脂膜
JPWO2023089878A5 (https=)
TW201703207A (zh) 密封用薄膜及使用該密封用薄膜之電子零件裝置
CN114591598A (zh) 一种晶圆级封装用液体塑封料及其制备方法
US20090309238A1 (en) Molded flip chip package with enhanced mold-die adhesion
US11660788B2 (en) Method for producing sealed structure
JPWO2025109864A5 (https=)
JP4064090B2 (ja) 半導体用樹脂ペースト及び半導体装置
JP3656623B2 (ja) 半導体装置の製造方法及び半導体装置
CN111968811A (zh) 一种贴片式压敏电阻及其制造方法
JP2003124401A (ja) モジュールおよびその製造方法
CN101925989B (zh) 用于半导体封装的滚压囊封方法
CN212392087U (zh) 一种贴片式压敏电阻
JP7476538B2 (ja) 半導体装置を製造する方法
CN112435974B (zh) 高强度dfn封装半导体器件
JPWO2024100934A5 (https=)
JPH08162486A (ja) 半導体素子の樹脂封止方法
JP3220739B2 (ja) 電子部品の製造方法
KR20090044963A (ko) 반도체 장치 제조방법
TWI402922B (zh) 半導體晶片之模封方法