JP7671555B1 - 半導体装置の製造方法及び封止体 - Google Patents

半導体装置の製造方法及び封止体 Download PDF

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JP7671555B1
JP7671555B1 JP2025502819A JP2025502819A JP7671555B1 JP 7671555 B1 JP7671555 B1 JP 7671555B1 JP 2025502819 A JP2025502819 A JP 2025502819A JP 2025502819 A JP2025502819 A JP 2025502819A JP 7671555 B1 JP7671555 B1 JP 7671555B1
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epoxy resin
resin composition
support
curing agent
mass
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JPWO2025109864A1 (https=
JPWO2025109864A5 (https=
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行宏 池田
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Namics Corp
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Namics Corp
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Priority claimed from PCT/JP2024/034267 external-priority patent/WO2025109864A1/ja
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  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Epoxy Resins (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2025502819A 2023-11-24 2024-09-25 半導体装置の製造方法及び封止体 Active JP7671555B1 (ja)

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JP2025066005A JP2025106523A (ja) 2023-11-24 2025-04-14 半導体装置の製造方法及び封止体

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JP2023199116 2023-11-24
JP2023199116 2023-11-24
PCT/JP2024/034267 WO2025109864A1 (ja) 2023-11-24 2024-09-25 半導体装置の製造方法及び封止体

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004056141A (ja) * 2002-07-16 2004-02-19 Nagase & Co Ltd 半導体装置の樹脂封止方法
JP2018134846A (ja) * 2017-02-23 2018-08-30 アピックヤマダ株式会社 樹脂供給装置、樹脂供給方法および樹脂成形装置
WO2018221681A1 (ja) * 2017-05-31 2018-12-06 日立化成株式会社 封止用液状樹脂組成物及び電子部品装置
JP2021036581A (ja) * 2019-08-23 2021-03-04 ナガセケムテックス株式会社 封止構造体の製造方法
JP2021195540A (ja) * 2020-06-12 2021-12-27 味の素株式会社 樹脂組成物
WO2021261064A1 (ja) * 2020-06-23 2021-12-30 ナミックス株式会社 液状コンプレッションモールド材
WO2023047702A1 (ja) * 2021-09-22 2023-03-30 ナミックス株式会社 液状コンプレッションモールド材、電子部品、半導体装置、および半導体装置の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004056141A (ja) * 2002-07-16 2004-02-19 Nagase & Co Ltd 半導体装置の樹脂封止方法
JP2018134846A (ja) * 2017-02-23 2018-08-30 アピックヤマダ株式会社 樹脂供給装置、樹脂供給方法および樹脂成形装置
WO2018221681A1 (ja) * 2017-05-31 2018-12-06 日立化成株式会社 封止用液状樹脂組成物及び電子部品装置
JP2021036581A (ja) * 2019-08-23 2021-03-04 ナガセケムテックス株式会社 封止構造体の製造方法
JP2021195540A (ja) * 2020-06-12 2021-12-27 味の素株式会社 樹脂組成物
WO2021261064A1 (ja) * 2020-06-23 2021-12-30 ナミックス株式会社 液状コンプレッションモールド材
WO2023047702A1 (ja) * 2021-09-22 2023-03-30 ナミックス株式会社 液状コンプレッションモールド材、電子部品、半導体装置、および半導体装置の製造方法

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JPWO2025109864A1 (https=) 2025-05-30

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