JPWO2025109864A1 - - Google Patents
Info
- Publication number
- JPWO2025109864A1 JPWO2025109864A1 JP2025502819A JP2025502819A JPWO2025109864A1 JP WO2025109864 A1 JPWO2025109864 A1 JP WO2025109864A1 JP 2025502819 A JP2025502819 A JP 2025502819A JP 2025502819 A JP2025502819 A JP 2025502819A JP WO2025109864 A1 JPWO2025109864 A1 JP WO2025109864A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2025066005A JP2025106523A (ja) | 2023-11-24 | 2025-04-14 | 半導体装置の製造方法及び封止体 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023199116 | 2023-11-24 | ||
| JP2023199116 | 2023-11-24 | ||
| PCT/JP2024/034267 WO2025109864A1 (ja) | 2023-11-24 | 2024-09-25 | 半導体装置の製造方法及び封止体 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025066005A Division JP2025106523A (ja) | 2023-11-24 | 2025-04-14 | 半導体装置の製造方法及び封止体 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP7671555B1 JP7671555B1 (ja) | 2025-05-02 |
| JPWO2025109864A1 true JPWO2025109864A1 (https=) | 2025-05-30 |
| JPWO2025109864A5 JPWO2025109864A5 (https=) | 2025-10-23 |
Family
ID=95513914
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025502819A Active JP7671555B1 (ja) | 2023-11-24 | 2024-09-25 | 半導体装置の製造方法及び封止体 |
| JP2025066005A Pending JP2025106523A (ja) | 2023-11-24 | 2025-04-14 | 半導体装置の製造方法及び封止体 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025066005A Pending JP2025106523A (ja) | 2023-11-24 | 2025-04-14 | 半導体装置の製造方法及び封止体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (2) | JP7671555B1 (https=) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4270969B2 (ja) * | 2002-07-16 | 2009-06-03 | 長瀬産業株式会社 | 半導体装置の樹脂封止方法 |
| JP6730206B2 (ja) * | 2017-02-23 | 2020-07-29 | アピックヤマダ株式会社 | 樹脂供給装置、樹脂供給方法および樹脂成形装置 |
| PT3620481T (pt) * | 2017-05-31 | 2024-04-08 | Namics Corp | Composição de resina líquida para selagem e dispositivo de componentes eletrónicos |
| TWI861179B (zh) * | 2019-08-23 | 2024-11-11 | 日商長瀨化成股份有限公司 | 密封結構體之製造方法 |
| JP7582065B2 (ja) * | 2020-06-12 | 2024-11-13 | 味の素株式会社 | 樹脂組成物 |
| TWI883181B (zh) * | 2020-06-23 | 2025-05-11 | 日商納美仕有限公司 | 液狀壓縮成型材 |
| WO2023047702A1 (ja) * | 2021-09-22 | 2023-03-30 | ナミックス株式会社 | 液状コンプレッションモールド材、電子部品、半導体装置、および半導体装置の製造方法 |
-
2024
- 2024-09-25 JP JP2025502819A patent/JP7671555B1/ja active Active
-
2025
- 2025-04-14 JP JP2025066005A patent/JP2025106523A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2025106523A (ja) | 2025-07-15 |
| JP7671555B1 (ja) | 2025-05-02 |
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