JPWO2025109864A1 - - Google Patents

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Publication number
JPWO2025109864A1
JPWO2025109864A1 JP2025502819A JP2025502819A JPWO2025109864A1 JP WO2025109864 A1 JPWO2025109864 A1 JP WO2025109864A1 JP 2025502819 A JP2025502819 A JP 2025502819A JP 2025502819 A JP2025502819 A JP 2025502819A JP WO2025109864 A1 JPWO2025109864 A1 JP WO2025109864A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2025502819A
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Japanese (ja)
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JP7671555B1 (ja
JPWO2025109864A5 (https=
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Priority claimed from PCT/JP2024/034267 external-priority patent/WO2025109864A1/ja
Priority to JP2025066005A priority Critical patent/JP2025106523A/ja
Application granted granted Critical
Publication of JP7671555B1 publication Critical patent/JP7671555B1/ja
Publication of JPWO2025109864A1 publication Critical patent/JPWO2025109864A1/ja
Publication of JPWO2025109864A5 publication Critical patent/JPWO2025109864A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2025502819A 2023-11-24 2024-09-25 半導体装置の製造方法及び封止体 Active JP7671555B1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025066005A JP2025106523A (ja) 2023-11-24 2025-04-14 半導体装置の製造方法及び封止体

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023199116 2023-11-24
JP2023199116 2023-11-24
PCT/JP2024/034267 WO2025109864A1 (ja) 2023-11-24 2024-09-25 半導体装置の製造方法及び封止体

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025066005A Division JP2025106523A (ja) 2023-11-24 2025-04-14 半導体装置の製造方法及び封止体

Publications (3)

Publication Number Publication Date
JP7671555B1 JP7671555B1 (ja) 2025-05-02
JPWO2025109864A1 true JPWO2025109864A1 (https=) 2025-05-30
JPWO2025109864A5 JPWO2025109864A5 (https=) 2025-10-23

Family

ID=95513914

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2025502819A Active JP7671555B1 (ja) 2023-11-24 2024-09-25 半導体装置の製造方法及び封止体
JP2025066005A Pending JP2025106523A (ja) 2023-11-24 2025-04-14 半導体装置の製造方法及び封止体

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025066005A Pending JP2025106523A (ja) 2023-11-24 2025-04-14 半導体装置の製造方法及び封止体

Country Status (1)

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JP (2) JP7671555B1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4270969B2 (ja) * 2002-07-16 2009-06-03 長瀬産業株式会社 半導体装置の樹脂封止方法
JP6730206B2 (ja) * 2017-02-23 2020-07-29 アピックヤマダ株式会社 樹脂供給装置、樹脂供給方法および樹脂成形装置
PT3620481T (pt) * 2017-05-31 2024-04-08 Namics Corp Composição de resina líquida para selagem e dispositivo de componentes eletrónicos
TWI861179B (zh) * 2019-08-23 2024-11-11 日商長瀨化成股份有限公司 密封結構體之製造方法
JP7582065B2 (ja) * 2020-06-12 2024-11-13 味の素株式会社 樹脂組成物
TWI883181B (zh) * 2020-06-23 2025-05-11 日商納美仕有限公司 液狀壓縮成型材
WO2023047702A1 (ja) * 2021-09-22 2023-03-30 ナミックス株式会社 液状コンプレッションモールド材、電子部品、半導体装置、および半導体装置の製造方法

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Publication number Publication date
JP2025106523A (ja) 2025-07-15
JP7671555B1 (ja) 2025-05-02

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