JPWO2024134951A1 - - Google Patents
Info
- Publication number
- JPWO2024134951A1 JPWO2024134951A1 JP2024565589A JP2024565589A JPWO2024134951A1 JP WO2024134951 A1 JPWO2024134951 A1 JP WO2024134951A1 JP 2024565589 A JP2024565589 A JP 2024565589A JP 2024565589 A JP2024565589 A JP 2024565589A JP WO2024134951 A1 JPWO2024134951 A1 JP WO2024134951A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
- H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022207377 | 2022-12-23 | ||
| PCT/JP2023/026985 WO2024134951A1 (ja) | 2022-12-23 | 2023-07-24 | エポキシ樹脂組成物、硬化物、及び半導体装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024134951A1 true JPWO2024134951A1 (https=) | 2024-06-27 |
Family
ID=91588310
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024565589A Pending JPWO2024134951A1 (https=) | 2022-12-23 | 2023-07-24 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2024134951A1 (https=) |
| KR (1) | KR20250125937A (https=) |
| TW (1) | TW202426567A (https=) |
| WO (1) | WO2024134951A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2026009780A1 (ja) * | 2024-07-03 | 2026-01-08 | ナミックス株式会社 | エポキシ樹脂組成物、硬化物、半導体装置、及び半導体装置の製造方法 |
| WO2026009778A1 (ja) * | 2024-07-03 | 2026-01-08 | ナミックス株式会社 | エポキシ樹脂組成物、硬化物、半導体装置、及び半導体装置の製造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5552788B2 (ja) * | 2009-10-05 | 2014-07-16 | 日立化成株式会社 | エポキシ樹脂組成物、半導体封止充てん用樹脂組成物及び半導体装置 |
| KR101717035B1 (ko) * | 2015-02-13 | 2017-03-15 | 세키스이가가쿠 고교가부시키가이샤 | 유기 일렉트로루미네선스 표시 소자용 봉지제 |
| EP3620481B1 (en) * | 2017-05-31 | 2024-03-27 | Resonac Corporation | Liquid resin composition for sealing and electronic component apparatus |
| JP7424168B2 (ja) * | 2020-03-31 | 2024-01-30 | 味の素株式会社 | 樹脂組成物、樹脂ペースト、硬化物、樹脂シート、プリント配線板、半導体チップパッケージ及び半導体装置 |
| KR20230028272A (ko) * | 2020-06-23 | 2023-02-28 | 나믹스 가부시끼가이샤 | 액상 컴프레션 몰드재 |
| KR20230044981A (ko) * | 2020-07-27 | 2023-04-04 | 세키스이가가쿠 고교가부시키가이샤 | 유기 el 표시 소자용 봉지제 |
-
2023
- 2023-07-24 KR KR1020257004427A patent/KR20250125937A/ko active Pending
- 2023-07-24 JP JP2024565589A patent/JPWO2024134951A1/ja active Pending
- 2023-07-24 WO PCT/JP2023/026985 patent/WO2024134951A1/ja not_active Ceased
- 2023-08-04 TW TW112129360A patent/TW202426567A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202426567A (zh) | 2024-07-01 |
| WO2024134951A1 (ja) | 2024-06-27 |
| KR20250125937A (ko) | 2025-08-22 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20260302 |