TW202426567A - 環氧樹脂組成物、硬化物及半導體裝置 - Google Patents

環氧樹脂組成物、硬化物及半導體裝置 Download PDF

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Publication number
TW202426567A
TW202426567A TW112129360A TW112129360A TW202426567A TW 202426567 A TW202426567 A TW 202426567A TW 112129360 A TW112129360 A TW 112129360A TW 112129360 A TW112129360 A TW 112129360A TW 202426567 A TW202426567 A TW 202426567A
Authority
TW
Taiwan
Prior art keywords
epoxy resin
resin composition
mass
epoxy
cured product
Prior art date
Application number
TW112129360A
Other languages
English (en)
Chinese (zh)
Inventor
酒井洋介
Makoto Suzuki
上村剛
Original Assignee
日商納美仕股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商納美仕股份有限公司 filed Critical 日商納美仕股份有限公司
Publication of TW202426567A publication Critical patent/TW202426567A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW112129360A 2022-12-23 2023-08-04 環氧樹脂組成物、硬化物及半導體裝置 TW202426567A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-207377 2022-12-23
JP2022207377 2022-12-23

Publications (1)

Publication Number Publication Date
TW202426567A true TW202426567A (zh) 2024-07-01

Family

ID=91588310

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112129360A TW202426567A (zh) 2022-12-23 2023-08-04 環氧樹脂組成物、硬化物及半導體裝置

Country Status (4)

Country Link
JP (1) JPWO2024134951A1 (https=)
KR (1) KR20250125937A (https=)
TW (1) TW202426567A (https=)
WO (1) WO2024134951A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026009780A1 (ja) * 2024-07-03 2026-01-08 ナミックス株式会社 エポキシ樹脂組成物、硬化物、半導体装置、及び半導体装置の製造方法
WO2026009778A1 (ja) * 2024-07-03 2026-01-08 ナミックス株式会社 エポキシ樹脂組成物、硬化物、半導体装置、及び半導体装置の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5552788B2 (ja) * 2009-10-05 2014-07-16 日立化成株式会社 エポキシ樹脂組成物、半導体封止充てん用樹脂組成物及び半導体装置
KR101717035B1 (ko) * 2015-02-13 2017-03-15 세키스이가가쿠 고교가부시키가이샤 유기 일렉트로루미네선스 표시 소자용 봉지제
EP3620481B1 (en) * 2017-05-31 2024-03-27 Resonac Corporation Liquid resin composition for sealing and electronic component apparatus
JP7424168B2 (ja) * 2020-03-31 2024-01-30 味の素株式会社 樹脂組成物、樹脂ペースト、硬化物、樹脂シート、プリント配線板、半導体チップパッケージ及び半導体装置
KR20230028272A (ko) * 2020-06-23 2023-02-28 나믹스 가부시끼가이샤 액상 컴프레션 몰드재
KR20230044981A (ko) * 2020-07-27 2023-04-04 세키스이가가쿠 고교가부시키가이샤 유기 el 표시 소자용 봉지제

Also Published As

Publication number Publication date
WO2024134951A1 (ja) 2024-06-27
KR20250125937A (ko) 2025-08-22
JPWO2024134951A1 (https=) 2024-06-27

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